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1SMB43CAT3G

型号:

1SMB43CAT3G

品牌:

LITTELFUSE[ LITTELFUSE ]

页数:

6 页

PDF大小:

350 K

TVS Diodes  
Surface Mount > 600W > 1SMB10CAT3G Series  
Pb  
1SMB10CAT3G Series  
Description  
The 1SMB10CAT3Gv series is designed to protect voltage  
sensitive components from high voltage, high energy  
transients. They have excellent clamping capability, high  
surge capability, low zener impedance and fast response  
time. The 1SMB10CAT3G series is supplied in the  
Littelfuse exclusive, cost-effective, highly reliable package  
and is ideally suited for use in communication systems,  
automotive, numerical controls, process controls, medical  
equipment, business machines, power supplies and  
many other industrial/consumer applications.  
Features  
• Working Peak Reverse Voltage Range − 10 V to 75 V  
Maximum Ratings andThermal Characteristics  
• Standard Zener Breakdown Voltage Range −  
11.7 V to 91.7 V  
Parameter  
Symbol  
PPK  
Value  
600  
Unit  
W
• Peak Power − 600 Watts @ 1 ms  
Peak Power Dissipation (Note 1) @ TL =  
25°C, Pulse Width = 1 ms  
• ESD Rating of Class 3 (> 16 kV) per Human Body Model  
• Maximum Clamp Voltage @ Peak Pulse Current  
• Low Leakage < 5 µA Above 10 V  
DC Power Dissipation @ TL = 75°C  
Measured Zero Lead Length (Note 2)  
PD  
W
3.0  
40  
25  
Derate Above 75°C  
mW/°C  
°C/W  
• UL 497B for Isolated Loop Circuit Protection  
• ResponseTime isTypically < 1 ns  
Thermal Resistance from Junction−  
to−Lead  
RJL  
• Pb−Free Packages are Available  
0.55  
4.4  
W
DC Power Dissipation (Note 3) @ TA =  
25°C Derate Above 25°C  
P
D
mW/°C  
°C/W  
Thermal Resistance from Junction–to–  
Ambient  
Functional Diagram  
226  
R
JA  
θ
Operating and Storage  
Temperature Range  
-65 to  
+150  
TJ, Tstg  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are  
stress ratings only. Functional operation above the Recommended Operating Conditions is  
not implied. Extended exposure to stresses above the Recommended Operating Conditions  
may affect device reliability.  
Additional Information  
1. 10 X 1000 µs, non−repetitive  
2. 1” square copper pad, FR−4 board  
3. FR−4 board, using Littelfuse minimum recommended footprint, as shown in 403A-03  
case outline dimensions spec  
Samples  
Datasheet  
Resources  
*Please see 1SMB5.0AT3 to 1SMB170AT3 for Unidirectional devices  
© 2017 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 11/17/17  
TVS Diodes  
Surface Mount > 600W > 1SMB10CAT3G Series  
I-V Curve Characteristics (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Maximum Reverse Peak Pulse Current  
Clamping Voltage @ IPP  
I
PP  
IPP  
VC  
I
VRWM  
IR  
Working Peak Reverse Voltage  
Maximum Reverse Leakage Current @ VRWM  
Breakdown Voltage @ IT  
T
I
V
C
V
V
R
BR RWM  
I
R
I
T
V
V
V
RWM BR C  
VBR  
IT  
Test Current  
I
PP  
© 2017 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 11/17/17  
TVS Diodes  
Surface Mount > 600W > 1SMB10CAT3G Series  
Electrical Characteristics  
VC @ IPP  
(Note 8)  
Breakdown Voltage  
VBR @ IT (V) (Note 7)  
NOM  
V
IR @  
VRWM  
RWM  
CTyp.  
(Note 6)  
Device  
Device*  
(Note 9)  
@ IT  
mA  
VC  
IPP  
Marking  
Volts  
µA  
MIN  
MAX  
Volts  
Amps  
pF  
1SMB10CAT3G  
1SMB11CAT3G  
1SMB12CAT3G  
1SMB13CAT3G  
1SMB14CAT3G  
1SMB15CAT3G  
1SMB16CAT3G  
1SMB17CAT3G  
1SMB18CAT3G  
1SMB20CAT3G  
1SMB22CAT3G  
1SMB24CAT3G  
1SMB26CAT3G  
1SMB28CAT3G  
1SMB30CAT3G  
1SMB33CAT3G  
1SMB36CAT3G  
1SMB40CAT3G  
1SMB43CAT3G  
1SMB45CAT3G  
1SMB48CAT3G  
1SMB51CAT3G  
1SMB54CAT3G  
1SMB58CAT3G  
1SMB60CAT3G  
1SMB64CAT3G  
1SMB75CAT3G  
KXC  
KZC  
10  
11  
12  
13  
14  
15  
16  
17  
18  
20  
22  
24  
26  
28  
30  
33  
36  
40  
43  
45  
48  
51  
54  
58  
60  
64  
75  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
11.1  
12.2  
13.3  
14.4  
15.6  
16.7  
17.8  
18.9  
20.0  
22.2  
24.4  
26.7  
28.9  
31.1  
33.3  
36.7  
40.0  
44.4  
47.8  
50.0  
53.3  
56.7  
60.0  
64.4  
66.7  
71.1  
83.3  
11.69  
12.84  
14.00  
15.16  
16.42  
17.58  
18.74  
19.90  
21.06  
23.37  
25.69  
28.11  
30.42  
32.74  
35.06  
38.63  
42.11  
46.74  
50.32  
52.63  
56.11  
59.69  
63.16  
67.79  
70.21  
74.84  
91.65  
12.27  
13.5  
14.7  
15.9  
17.2  
18.5  
19.7  
20.9  
22.1  
24.5  
27.0  
29.5  
31.9  
34.4  
36.8  
40.6  
44.2  
49.1  
52.8  
55.3  
58.9  
62.7  
66.32  
71.18  
73.72  
78.58  
92.07  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
17.0  
18.2  
19.9  
21.5  
23.2  
24.4  
26.0  
27.6  
29.2  
32.4  
35.5  
38.9  
42.1  
45.4  
48.4  
53.3  
58.1  
64.5  
69.4  
72.2  
77.4  
82.4  
87.1  
93.6  
96.8  
103  
35.3  
33.0  
30.2  
27.9  
25.8  
24.0  
23.1  
21.7  
20.5  
18.5  
16.9  
15.4  
14.2  
13.2  
12.4  
11.3  
10.3  
9.3  
805  
740  
680  
630  
590  
555  
520  
490  
465  
425  
390  
366  
330  
310  
290  
265  
245  
220  
210  
200  
190  
175  
170  
155  
150  
145  
125  
LEC  
LGC  
LKC  
LMC  
LPC  
LRC  
LTC  
LVC  
LXC  
LZC  
MEC  
MGC  
MKC  
MMC  
MPC  
MRC  
MTC  
MVC  
MXC  
MZC  
NEC  
NGC  
NKC  
NMC  
NRC  
8.6  
8.3  
7.7  
7.3  
6.9  
6.4  
6.2  
5.8  
121  
4.9  
4. A transient suppressor is normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the  
DC or continuous peak operating voltage level.  
5. VBR measured at pulse test current IT at an ambient temperature of 25°C.  
6. Surge current waveform per Figure 2 and derate per Figure 3 of the General Data − 600 Watt at the beginning of this group.  
7. Bias Voltage = 0 V, F = 1 MHz, TJ = 25°C  
© 2017 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 11/17/17  
TVS Diodes  
Surface Mount > 600W > 1SMB10CAT3G Series  
Ratings and Characteristic Curves  
Figure 1. Pulse Rating Curve  
Figure 2. PulseWaveform  
100  
NONREPETITIVE  
PULSE WAVEFORM  
SHOWN IN FIGURE 2  
10  
1
0.1  
0.1 s1  
s1  
0
s
100 s  
1 ms  
10 ms  
t
Figure 3. Pulse Derating Curve  
Figure 4.Typical Junction Capacitance vs. BiasVoltage  
Typical Protection Circuit  
in  
in  
© 2017 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 11/17/17  
TVS Diodes  
Surface Mount > 600W > 1SMB10CAT3G Series  
Application Notes  
Figure 5.  
ResponseTime  
In most applications, the transient suppressor device is  
placed in parallel with the equipment or component to be  
protected. In this situation, there is a time delay associated  
with the capacitance of the device and an overshoot  
condition associated with the inductance of the device and  
the inductance of the connection method. The capacitive  
effect is of minor importance in the parallel protection  
scheme because it only produces a time delay in the  
transition from the operating voltage to the clamp voltage  
as shown in Figure 5.  
The inductive effects in the device are due to actual turn-on  
time (time required for the device to go from zero current  
to full current) and lead inductance. This inductive effect  
produces an overshoot in the voltage across the  
equipment or component being protected as shown in  
Figure 6. Minimizing this overshoot is very important in the  
application, since the main purpose for adding a transient  
suppressor is to clamp voltage spikes. The SMB series  
have a very good response time, typically < 1 ns and  
negligible inductance. However, external inductive effects  
could produce unacceptable overshoot. Proper circuit  
layout minimum lead lengths and placing the suppressor  
device as close as possible to the equipment or  
Figure 6.  
components to be protected will minimize this overshoot.  
Some input impedance represented by Zin is essential  
to prevent overstress of the protection device. This  
impedance should be as high as possible, without  
restricting the circuit operation.  
Duty Cycle Derating  
The data of Figure 1 applies for non-repetitive conditions  
and at a lead temperature of 25ºC. If the duty cycle  
increases, the peak power must be reduced as indicated  
by the curves of Figure 7. Average power must be derated  
as the lead or ambient temperature rises above 25ºC. The  
average power derating curve normally given on data  
sheets may be normalized and used for this purpose.  
Figure 7. Typical Derating Factor for Duty Cycle  
At first glance the derating curves of Figure 7 appear to be  
in error as the 10 ms pulse has a higher derating factor  
than the 10 s pulse. However, when the derating factor for  
a given pulse of Figure 7 is multiplied by the peak power  
value of Figure 1 for the same pulse, the results follow the  
expected trend.  
© 2017 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 11/17/17  
TVS Diodes  
Surface Mount > 600W > 1SMB10CAT3G Series  
Dimensions  
Soldering Footrpint  
H
E
E
b
D
POLARITY INDICATOR  
OPTIONAL AS NEEDED  
(SEE STYLES)  
A
A1  
mm  
inches  
c
L
Inches  
Millimeters  
Nom  
ORDERING INFORMATION  
Dim  
Min  
Nom  
0.087  
0.004  
0.080  
0.009  
0.140  
0.170  
0.214  
0.040  
Max  
0.090  
0.007  
0.087  
0.012  
0.156  
0.181  
0.220  
0.063  
Min  
Max  
2.28  
0.19  
2.20  
0.31  
3.95  
4.60  
5.60  
1.60  
Device  
Package  
Shipping  
A
A1  
b
0.075  
0.002  
0.077  
0.006  
0.130  
0.160  
0.205  
0.030  
1.90  
0.05  
1.96  
0.15  
3.30  
4.06  
5.21  
0.76  
2.20  
0.10  
2,500 /  
Tape & Reel  
SMB  
1SMBxxCAT3G  
(Pb−Free)  
2.03  
c
0.23  
D
3.56  
E
4.32  
Flow/Wave Soldering (Solder Dipping)  
HE  
L
5.44  
1.02  
PeakTemperature :  
DippingTime :  
260 ºC  
10 seconds  
L1  
0.020 REF  
0.51 REF  
NOTES:  
1. DIMENSIONING ANDTOLERANCING PER ANSIY14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
Physical Specifications  
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.  
Void-free, transfer-molded, thermosetting  
plastic  
Case  
Part Marking System  
Polarity  
Cathode indicated by polarity band  
Any  
Mounting Position  
Finish  
All external surfaces are corrosion  
resistant and leads are readily solderable  
Modified L−Bend providing more contact  
area to bond pads  
Leads  
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and  
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete  
Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics.  
© 2017 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 11/17/17  
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