This is the PDF file of catalog No.T13E-4.
No.T13E4.pdf 99.8.23
Notice of Ceramic Trimmer Capacitor
Introduction :
Flow Soldering
Trimmer capacitors made by MURATA MFG. CO., LTD. are
designed to achieve high reliability and cost
efficiency. We offer the following usage guidelines
to ensure our trimmer capacitors perform effectively
and meet your requirements. Rapid innovations will
certainly create new applications for our trimmer
capacitors. We welcome you to contact us
concerning application questions.
Gradual Cooling
Solderring
Pre-heating (in air)
(in air)
250
200
100
0
1. Mounting Trimmer Capacitors on PCBs
(1) Ensure that PCB hole spacing complies with the terminal
spacing requirement of the intended trimmer capacitor
model. Incorrect hole spacing may lower trimmer capacitor
performance due to excessive stress applied to the
terminal.
60Y120 sec.
5 sec. max.
(3) Reflow Soldering
TZS02 / TZVY2 / TZVX2 / TZV02 / TZC03 / TZBX4 series
Refer to the standard temperature profile listed below.
(2) Mount trimmer capacitor in contact with PCB.
(3) Do not apply bending stress after the trimmer capacitor
has been mounted to the PCB. See the stress
specification listed below.
Reflow Soldering
Gradual Cooling
(in air)
Pre-heating (in air)
Solderring
230
183
Model
Allowable Stress
TZ03/TZBX4 (Terminal Style CZD)
10.0N(Ref.1kgf)
100
0
(4) Note trimmer capacitor polarity to minimize the influence of
stray capacitance. Refer to the outlines of each model.
( W Terminal:Stator side ; Y Terminal:Rotor side)
(5) Do not warp and/or bend PC board to prevent trimmer
capacitor from breakage.
60Y120 sec.
20 sec. max.
(Solder Melting Zone)
2. Soldering
(4) Notice When Soldering
Standard soldering conditions are shown below.
Before using soldering conditions other than those
listed below , please consult MURATA factory
representative. If the soldering conditions are not
suitable for the product , the trimmer capacitor may
deviate from the specified performances characteristic.
(1) Soldering Iron
¡ The solder iron should contact neither the trimmer
capacitor's resin case nor its ceramic substrate.
¡ To prevent the deterioration of trimmer capacitor
characteristics, apply flux only to terminals.
¡ The amount of solder is critical. Insufficient amounts of
solder can lead to insufficient soldering strength on the
PCB. Excessive amounts of solder may cause bridging
between the terminals resulting in terminal shorts.
¡ Do not use water - soluble flux if using water for washing.
¡ TZS02 / TZVY2 / TZVX2 / TZV02 / TZC03 / TZBX4 series
without cover films can not be soldered using the flow
soldering method (dipping).
TZS02/TZVY2/
TZBX4/TZ03
TZVX2/TZV02/TZC03
Tip temperature
Soldering time
Tip diameter
Iron wattage
260DT10D
3 sec. max.
1mm dia. max.
20W max.
260DT10D
3 sec. max.
2mm dia. max.
30W max.
¡ TZ03 series can not be soldered using the reflow soldering
method.
¡ When soldering the TZC03 series, the solder should not
flow into the staking part of the substrate. If such flow does
occur, driver slot rotation will be impeded.
(2) Flow Soldering
¡TZBX4 Cover film type
¡ Use our standard land dimension. Excessive land area
causes displacement due to effect of the surface tension
of the solder or the contact failure due to flux wicking up.
Insufficient land area causes insufficient soldering strength
of the chip.
Immerse the body in solder bath
¡TZBX4 Terminal style C and D / TZ03 series
Only immerse terminal in solder bath
Refer to the standard temperature profile listed below.
Series
TZS02/TZVY2/TZVX2/TZV02
TZC03
Standard applying thickness
120Y170µm
150Y200µm
200Y250µm
TZBX4
20