SPECIFICATIONS
BGA 478 NB
1.27 mm [.05”] Pitch
BGA CPU Socket
SMT Horizontal Type
mPGA Series, 478 Pos
Mechanical
Socket Engagement/disengagement Force: 3.0kg max.
Durability: 20 Cycles min.
Socket Retention Force: 10 g/pin min.
Electrical
Contact Resistance: 25 mΩ max.
Dielectric Withstanding Voltage: 360V
Insulation Resistance: 800MΩ min.
Physical
Cover: Thermoplastic, UL 94V-0 rated, Natural Color
Base: Thermoplastic, UL 94V-0 rated, Black Color
Cam: Thermoplastic, UL 94V-0 rated, Black Color
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
Operating Temperature: -55°C to +125°C
DRAWING
ORDERING INFORMATION
PRODUCT NO.: P Z 4 7 8 1 3 - 2 7 4 9 - 0 1
Actual Loading
Pick-up Package
NO. of Pos.
1=Cap
478=478Pos.
Termination Type:
Package
1=Lead Free Sn/Ag Type
0=Hard Tray
Actuaction & Body Type
9=Standard Cam,Pin#A1,B2 Removed
Black Cover
Gold Plating On
Contact Area
3=30u" Gold Plating On Contact Area
Base Color
4=Black
Grid Array Type
27=26X26 for Northwood
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
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