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CYPD1122-40LQXI

型号:

CYPD1122-40LQXI

品牌:

CYPRESS[ CYPRESS ]

页数:

31 页

PDF大小:

547 K

CCG1 Datasheet  
USB Type-C Port Controller with Power  
Delivery  
General Description  
CCG1 provides a complete USB Type-C and USB Power Delivery port control solution. The core architecture of CCG1 enables a  
base Type-C solution that can scale to a complete 100-W USB Power Delivery with Alternate Mode multiplex support. CCG1 is also  
a Type-C cable ID IC for active and passive cables. The CCG1 controller detects connector insert, plug orientation and VCONN  
switching signals. CCG1 makes it easier to add USB Power Delivery to any architecture because it provides control signals to manage  
external VBUS and VCONN power management solutions and external mux controls for most single cable-docking solutions.  
The CCG1 family of devices are fixed-function parts that use a configuration table to control their operation in different applications.  
The functionality is implemented in firmware and will be certified against USB Implementers Forum (USB-IF) compliance tests when  
available. The programmability allows CCG1 devices to track any USB Specification changes. For information on accessing the source  
code, contact Cypress support.  
Type-C Support  
Integrated transceiver (BB PHY)  
Applications  
Notebooks, tablets, monitors, docking stations  
Supports up to two USB ports with PD  
Power adapters, USB Type-C cables  
Supports routing of all protocols through an external mux  
Features  
PD Support  
Supports Provider and Consumer roles  
32-bit MCU Subsystem  
48-MHz ARM Cortex-M0 CPU with 32-KB flash and 4-KB  
Supports all power profiles  
SRAM  
Low-Power Operation  
3.2 V to 5.5 V operation  
Sleep 1.3 mA, Deep Sleep 1.3 A[1]  
Packages  
Integrated analog blocks  
12-bit, 1-Msps ADC for VBUS voltage and current monitoring  
Dynamic overcurrent and overvoltage protection  
Integrated digital blocks  
40-pin QFN  
Two configurable 16-bit TCPWM blocks  
One I2C master or slave  
16-pin SOIC  
35-ball wafer-level CSP (WLCSP)  
Figure 1. CCG1 Block Diagram[2, 3, 4, 5, 6, 7]  
Notes  
1. Values measured for CCG1 silicon only. Application specific power numbers may be higher.  
2. Timer, counter, pulse-width modulation block.  
2
3. Serial communication block configurable as I C.  
4. Base band.  
5. Termination resistor denoting a Downstream Facing Port (DFP).  
6. Termination resistor denoting a Upstream Facing Port (UFP).  
7. Termination resistor denoting an Electronically Marked Cable Assembly (EMCA).  
Cypress Semiconductor Corporation  
Document Number: 001-93639 Rev. *K  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised May 3, 2017  
 
 
 
 
 
 
 
 
CCG1 Datasheet  
Contents  
Functional Definition ........................................................3  
CPU and Memory Subsystem .....................................3  
System Resources ......................................................3  
GPIO ...........................................................................3  
Pin Definitions ..................................................................4  
Pinouts ............................................................................10  
Power ...............................................................................11  
Electrical Specifications ................................................12  
Absolute Maximum Ratings .......................................12  
Device-Level Specifications ......................................12  
Digital Peripherals .....................................................14  
Memory .....................................................................15  
System Resources ....................................................16  
Applications in Detail .....................................................18  
Ordering Information ......................................................23  
Ordering Code Definitions .........................................23  
Packaging ........................................................................24  
Acronyms ........................................................................27  
Document Conventions .................................................28  
Units of Measure .......................................................28  
Revision History .............................................................29  
Sales, Solutions, and Legal Information ......................31  
Worldwide Sales and Design Support .......................31  
Products ....................................................................31  
PSoC® Solutions ......................................................31  
Cypress Developer Community .................................31  
Technical Support .....................................................31  
Document Number: 001-93639 Rev. *K  
Page 2 of 31  
CCG1 Datasheet  
FIFO for receive and transmit which, by increasing the time given  
for the CPU to read data, greatly reduces the need for clock  
stretching caused by the CPU not having read data on time.  
The I2C peripheral is compatible with the I2C Standard-mode,  
Fast-mode, and Fast-mode Plus devices, as defined in the NXP  
I2C-bus specification and user manual (UM10204). The I2C bus  
I/O is implemented with GPIO in open-drain modes.  
Functional Definition  
CPU and Memory Subsystem  
CPU  
The Cortex-M0 CPU in the CCG1 is part of the 32-bit MCU  
subsystem, which is optimized for low-power operation with  
extensive clock gating. It mostly uses 16-bit instructions and  
executes a subset of the Thumb-2 instruction set. This enables  
fully compatible binary upward migration of the code to higher  
performance processors such as the Cortex-M3 and M4, thus  
enabling upward compatibility. The Cypress implementation  
includes a hardware multiplier that provides a 32-bit result in one  
cycle. It includes a nested vectored interrupt controller (NVIC)  
block with 32 interrupt inputs and a Wakeup Interrupt Controller  
(WIC). The WIC can wake the processor up from the Deep Sleep  
mode, allowing power to be switched off to the main processor  
when the chip is in the Deep Sleep mode. The Cortex-M0 CPU  
provides a Non-Maskable Interrupt (NMI) input, which is made  
available to the user when it is not in use for system functions  
requested by the user.  
The CCG1 is not completely compliant with the I2C spec in the  
following respects:  
GPIO cells are not overvoltage tolerant and, therefore, cannot  
be hot-swapped or powered up independently of the rest of the  
I2C system.  
Fast-mode Plus has an IOL specification of 20 mA at a VOL of  
0.4 V. The GPIO cells can sink a maximum of 8 mA IOL with a  
VOL maximum of 0.6 V.  
Fast-mode and Fast-mode Plus specify minimum Fall times,  
which are not met with the GPIO cell; Slow strong mode can  
help meet this spec depending on the Bus Load.  
When the SCB is an I2C Master, it interposes an IDLE state  
between NACK and Repeated Start; the I2C spec defines Bus  
free as following a Stop condition so other Active Masters do  
not intervene but a Master that has just become activated may  
start an Arbitration cycle.  
The CPU also includes a debug interface, the serial wire debug  
(SWD) interface, which is a 2-wire form of JTAG; the debug  
configuration used for CCG1 has four break-point (address)  
comparators and two watchpoint (data) comparators.  
Flash  
When the SCB is in the I2C Slave mode, and Address Match  
on External Clock is enabled (EC_AM = 1) along with operation  
in the internally clocked mode (EC_OP = 0), then its I2C  
address must be even.  
The CCG1 device has a flash module with a flash accelerator,  
tightly coupled to the CPU to improve average access times from  
the flash block. The flash block is designed to deliver 1 wait-state  
(WS) access time at 48 MHz and 0-WS access time at 24 MHz.  
The flash accelerator delivers 85% of single-cycle SRAM access  
performance on average. Part of the flash module can be used  
to emulate EEPROM operation if required.  
GPIO  
The CCG1 has up to 30 GPIOs, which are configured for various  
functions. Refer to the pinout tables for the definitions. The GPIO  
block implements the following:  
SROM  
Eight drive strength modes:  
Analog input mode (input and output buffers disabled)  
Input only  
Weak pull-up with strong pull-down  
Strong pull-up with weak pull-down  
Open drain with strong pull-down  
Open drain with strong pull-up  
Strong pull-up with strong pull-down  
Weak pull-up with weak pull-down  
A supervisory ROM that contains boot and configuration routines  
is provided.  
System Resources  
Power System  
The power system is described in detail in the section Power on  
page 11. It provides assurance that voltage levels are as required  
for each respective mode and either delay mode entry (on  
power-on reset (POR), for example) until voltage levels are as  
required for proper function or generate resets (Brown-Out  
Detect (BOD)) or interrupts (Low Voltage Detect (LVD)). The  
CCG1 operates with a single external supply over the range of  
3.2 V to 5.5 V operation and has three different power modes:  
Active, Sleep, and Deep Sleep; transitions between modes are  
managed by the power system.  
Input threshold select (CMOS or LVTTL).  
Individual control of input and output buffer enabling/disabling  
in addition to the drive strength modes.  
Hold mode for latching previous state (used for retaining I/O  
state in Deep Sleep mode).  
Serial Communication Blocks (SCB)  
Selectable slew rates for dV/dt related noise control to improve  
EMI.  
The CCG1 has one SCB, which can implement an I2C interface.  
The hardware I2C block implements a full multi-master and slave  
interface (it is capable of multimaster arbitration). This block is  
capable of operating at speeds of up to 1 Mbps (Fast Mode Plus)  
and has flexible buffering options to reduce interrupt overhead  
and latency for the CPU. It also supports EZ-I2C that creates a  
mailbox address range in the memory of the CCG1 and effec-  
tively reduces I2C communication to reading from and writing to  
an array in memory. In addition, the block supports an 8-deep  
During power-on and reset, the I/O pins are forced to the disable  
state so as not to crowbar any inputs and/or cause excess  
turn-on current. A multiplexing network, known as a high-speed  
I/O matrix, is used to multiplex between various signals that may  
connect to an I/O pin.  
Document Number: 001-93639 Rev. *K  
Page 3 of 31  
 
 
 
CCG1 Datasheet  
Pin Definitions  
Table 1 provides the pin definition for 35-Ball WLCSP for the Cable/EMCA application. Refer to Table 23 for part numbers to package  
mapping.  
Table 1. Pin Definitions for 35-ball WLCSP for EMCA Cable Application  
CYPD1103-  
35FNXIT  
Balls  
Functional Pin Name  
Type  
Description  
CC1 control  
0: TX enabled  
z: RX sense  
CC1_RX  
C4  
I
CC1_TX  
SWD_IO  
SWD_CLK  
I2C_SCL  
I2C_SDA  
XRES  
D7  
D1  
C1  
B1  
B2  
B6  
O
I/O  
I
Configuration Channel 1  
SWD I/O  
SWD clock  
I/O  
I/O  
I
I2C clock signal  
I2C data signal  
Reset  
Regulated digital supply output. Connect a 1 to 1.6-µF capacitor. No  
external source should be connected  
VCCD  
A7  
POWER  
VDDD  
C7  
B7  
C5  
POWER Power supply for both analog and digital sections  
VSSA  
GND  
I
Analog ground  
CC_VREF  
Data reference signal for CC lines  
Signals for internal use only. The TX_U output signal should be  
connected to the TX_M signal  
TX_U  
B3  
B5  
D3  
A3  
D4  
O
I
TX_M  
Reference signal for internal use. Connect to TX_REF output via a  
2.4K 1% resistor  
TX_REF_IN  
TX_GND  
TX_REF_OUT  
I
I
Connect to GND via 2K 1% resistor  
Reference signal generated by connecting internal current source to  
two 1K external resistors  
O
Optional control signal to remove RA after assertion of VCONN  
0: RA disconnected  
RA_DISCONNECT  
E4  
O
1: RA connected  
Local VCONN detection signal  
0: VCONN is not locally applied  
1: VCONN is locally applied  
VCONN_DET  
CC1_LPREF  
C6  
A5  
I
I
Reference signal for internal use. Connect to the output of resistor  
divider from VDDD.  
Optional control signal to remove RA after assertion of VCONN (NC  
for 2 chip/cable)  
0: RA disconnected  
1: RA connected  
RA_FAR_DISCONNECT  
E5  
O
BYPASS  
D5  
C3  
I
I
Bypass capacitor for internal analog circuits  
CC1_LPRX  
Configuration channel 1 RX signal for Low Power States  
A1, A2, A4, A6,  
B4, C2, D2, D6,  
E1, E2, E3, E6,  
E7  
GPIO  
General-purpose I/Os  
Document Number: 001-93639 Rev. *K  
Page 4 of 31  
 
 
CCG1 Datasheet  
Table 2 provides the pin definitions for 40-pin QFN and 35-ball WLCSP for the notebook, tablet, smartphone, and monitor  
applications. Refer to Table 23 on page 23 for part numbers to package mapping.  
Table 2. Pin Definitions for 40-QFN and 35-ball WLCSP for Notebook, Tablet, SmartPhone and Monitor Applications  
CYPD  
CYPD  
CYPD  
Functional Pins  
1122-40LQXI 1121-40LQXI 1131-35FNXIT  
Type  
Description  
[8]  
[9]  
[10]  
Pins  
Pins  
Balls  
MUXSEL_1  
MUXSEL_2  
1
2
1
D5  
D6  
O
O
External Data Mux Select signal 1  
External Data Mux Select signal 2  
2
CC1 control  
0: TX enabled  
z: RX sense  
CC1_CTRL  
CC2_CTRL  
3
4
3
4
D3  
E4  
I/O  
I/O  
CC2 control  
0: TX enabled  
z: RX sense  
MUXSEL_3  
MUXSEL_4  
CS_P  
5
6
5
6
E5  
E6  
E3  
E2  
O
O
External Data Mux Select signal 3  
External Data Mux Select signal 4  
Current Sensing Plus input  
Current Sensing Minus input I  
Ground  
7
7
I
CS_M  
8
8
I
VSS  
9
9
GND  
I/O  
O
CC1  
10  
11  
12  
13  
14  
15  
10  
11  
12  
13  
14  
-
Configuration Channel 1  
CC Reference Select signal  
SWD IO  
CC_SEL_REF_1  
SWD_IO  
SWD_CLK  
HOTPLUG_DET  
GPIO1  
E1  
D1  
C1  
C2  
I/O  
I
SWD Clock  
I/O  
I/O  
O
HotPlug Detection for Display Port Alternate Mode  
General-purpose I/O  
VSEL2  
15  
Voltage Select signal 2 for selecting output voltage  
General-purpose I/O  
GPIO2  
16  
17  
I/O  
I/O  
GPIO3  
General-purpose I/O  
Current Fault Indication  
0: No fault  
IFAULT  
17  
I
1: Current fault  
I2C_SCL  
I2C_SDA  
I2C_INT  
18  
19  
20  
18  
19  
20  
B1  
B2  
A2  
I/O  
I/O  
O
I2C Clock signal  
I2C Data signal  
I2C Interrupt  
CC_SEL_REF_2  
21  
21  
A1  
O
CC Reference Select signal  
Open Drain signal to connect RD to CC 1 line  
z: RD not connected  
0: RD connected for Monitor application  
1: RD connected for Notebook application  
CC1_RD  
22  
22  
C3  
O
Open Source signal to connect RP to CC 1 line  
z: RP not connected  
CC1_RP  
23  
23  
A5  
O
1: RP connected  
Notes  
8. Pinout for Notebook DRP application for 40-QFN.  
9. Pinout for Monitor DRP application for 40-QFN.  
10. Pinout for Notebook DRP application for 35-CSP.  
Document Number: 001-93639 Rev. *K  
Page 5 of 31  
 
 
 
 
CCG1 Datasheet  
Table 2. Pin Definitions for 40-QFN and 35-ball WLCSP for Notebook, Tablet, SmartPhone and Monitor Applications (continued)  
CYPD  
CYPD  
CYPD  
Functional Pins  
1122-40LQXI 1121-40LQXI 1131-35FNXIT  
Type  
Description  
[8]  
[9]  
[10]  
Pins  
Pins  
Balls  
Open Drain signal to control a PFET power switch  
for VCONN on CC 1 line  
0: VCONN switch closed  
CC1_VCONN_CTRL  
24  
24  
A4  
O
z: VCONN switch open  
Signal used for discharging VBUS line during  
voltage change  
VBUS_DISCHARGE  
CC2  
25  
26  
25  
26  
A3  
B3  
O
O
Configuration Channel 2  
Open Drain signal to connect RD to CC 2 line  
z: RD not connected  
0: RD connected for Monitor application  
1: RD connected for Notebook application  
CC2_RD  
CC2_RP  
27  
28  
27  
28  
A6  
B4  
O
O
Open Source signal to connect RP to CC 2 line  
z: RP not connected  
1: RP connected  
Open Drain signal to control a PFET power switch  
for VCONN on CC 2 line  
0: VCONN switch closed  
CC2_VCONN_CTRL  
29  
29  
B5  
O
I
z: VCONN switch open  
XRES  
VCCD  
30  
31  
30  
31  
B6  
A7  
Reset  
Regulated digital supply output. Connect a 1 to  
POWER 1.6-μF capacitor. No external source should be  
connected  
VDDD  
32  
33  
34  
35  
32  
33  
34  
35  
C7  
C7  
B7  
C4  
POWER Power supply for digital sections  
POWER Power Supply for analog sections  
VDDA  
VSSA  
GND  
I
Analog ground pin  
VBUS_VMON  
VBUS Overvoltage Protection monitoring signal  
VBUS reference signal for Overvoltage Protection  
detection  
VBUS_VREF  
36  
36  
37  
C5  
I
Voltage Select signal 1 for selecting the output  
voltage  
VSEL1  
O
O
CC_SEL_REF_3  
CC Reference Select signal  
37  
16  
C6  
Full rail control signal for enabling/disabling  
Consumer load FET  
VBUS_C_CTRL  
38  
D7  
O
VBUS_OK=1 - VBUS Voltage ok  
VBUS_OK=0 - VBUS Overvoltage detected  
VBUS_OK  
CC_VREF  
38  
39  
40  
39  
40  
D4  
E7  
I
Data reference signal for CC lines  
Full rail control signal for enabling/disabling Provider  
load FET  
VBUS_P_CTRL  
O
Notes  
8. Pinout for Notebook DRP application for 40-QFN.  
9. Pinout for Monitor DRP application for 40-QFN.  
10. Pinout for Notebook DRP application for 35-CSP.  
Document Number: 001-93639 Rev. *K  
Page 6 of 31  
CCG1 Datasheet  
Table 3 provides the pin definition for 40-pin QFN for Notebook (DFP) application. Refer to Table 23 for part numbers to package  
mapping.  
Table 3. Pin Definitions for 40-Pin QFN for Notebook (DFP)  
CYPD  
1134-40LQXI  
Pins  
Active HIGH/  
Functional Pin Name  
Drive Mode  
Type  
Description  
LOW  
Open drain, drives low  
Open drain, drives low  
MUXSEL_1  
MUXSEL_2  
1
2
O
O
External Data Mux Select signal 1  
External Data Mux Select signal 2  
CC1 control  
0:Tx enabled  
z: RX sense  
Analog input/Strong  
drive (push pull)  
CC1_CTRL  
CC2_CTRL  
3
4
IO  
IO  
CC2 control  
0: TX enabled  
z: RX sense  
Analog input/Strong  
drive (push pull)  
Open drain, drives low  
Open drain, drives low  
Analog input  
MUXSEL_3  
MUXSEL_4  
CS_P  
5
O
External Data Mux Select signal 3  
External Data Mux Select signal 4  
Current Sensing Plus input  
Current Sensing Minus input  
Ground  
6
O
7
I
Analog input  
CS_M  
8
I
VSS  
9
GND  
O
Strong drive (push pull)  
CC1  
10  
Configuration Channel 1  
Open Drain signal to connect RP to CC1  
line (1.5A current)  
z: RP not connected  
Open drain, drives high  
CC1_RP_1.5  
Active HIGH  
11  
O
1: RP connected  
SWD_IO  
12  
13  
IO  
I
SWD IO  
SWD_CLK  
SWD Clock  
Open Source signal to connect RP to  
CC1 line (3A current)  
z: RP not connected  
Open drain, drives high  
Open drain, drives high  
Open drain, drives high  
Open drain, drives high  
CC1_RP_3.0  
CC1_RP_DEF  
CC2_RP_DEF  
CC2_RP_1.5  
Active HIGH  
Active HIGH  
Active HIGH  
Active HIGH  
14  
15  
16  
17  
O
O
O
O
1: RP connected  
Open Drain signal to connect RP to CC1  
line (Default current)  
z: RP not connected  
1: RP connected  
Open Drain signal to connect RP to CC2  
line (Default current)  
z: RP not connected  
1: RP connected  
Open Drain signal to connect RP to CC2  
line (1.5A current)  
z: RP not connected  
1: RP connected  
I2C Clock signal  
I2C Data signal  
Open drain, drives low  
Open drain, drives low  
I2C_SCL  
I2C_SDA  
Active LOW  
Active LOW  
18  
19  
IO  
IO  
Document Number: 001-93639 Rev. *K  
Page 7 of 31  
 
CCG1 Datasheet  
Table 3. Pin Definitions for 40-Pin QFN for Notebook (DFP) (continued)  
CYPD  
1134-40LQXI  
Pins  
Active HIGH/  
Functional Pin Name  
Drive Mode  
Type  
Description  
LOW  
I2C Interrupt  
Open drain, drives low  
I2C_INT  
Active LOW  
20  
O
O
Open Source signal to connect RP to  
CC2 line (3A current)  
z: RP not connected  
Open drain, drives high  
CC2_RP_3.0  
Active HIGH  
21  
1: RP connected  
Configuration channel 1 RX signal for  
Low Power states  
Analog input  
Analog input  
Analog input  
CC1_LPRX  
CC1_LPREF  
CC2_LPRX  
22  
23  
24  
I
I
I
Reference signal for internal use.  
Configuration channel 2 RX signal for  
Low Power states  
Analog input  
CC2_LPREF  
CC2  
25  
26  
I
Reference signal for internal use.  
Configuration Channel 2  
Strong drive (push pull)  
O
Open Drain signal to control a PFET  
power switch for VCONN on CC1 line  
0: VCONN switch closed  
Open drain, drives low  
Open drain, drives low  
Digital input  
CC1_VCONN_CTRL  
CC2_VCONN_CTRL  
IFAULT  
Active LOW  
Active LOW  
Active HIGH  
27  
28  
29  
O
O
z: VCONN switch open  
Open Drain signal to control a PFET  
power switch for VCONN on CC2 line  
0: VCONN switch closed  
z: VCONN switch open  
Current Fault Indication on VBUS  
0: No fault  
1: Over Current fault  
I
I
Analog input  
XRES  
VCCD  
Active LOW  
30  
31  
Reset  
Connect 1uf Capacitor between VCCD  
and Ground  
POWER  
VDDD  
VDDA  
VSSA  
E-PAD  
32  
POWER  
POWER  
GND  
5-V Supply  
33  
5-V Supply  
34  
E-PAD  
GND  
VBUS Over-voltage Protection  
monitoring signal  
Analog input  
VBUS_VMON  
VBUS_VREF  
35  
36  
37  
38  
I
VBUS reference signal for Over-voltage  
Protection detection  
Analog input  
I
Full rail control signal for  
enabling/disabling Provider load FET  
Strong drive (Push Pull)  
Open drain, drives low  
VBUS_P_CTRL  
HOTPLUG_DET  
Active HIGH  
Active HIGH  
O
IO  
HotPlug Detection for Display Port  
Alternate Mode  
Data reference signal for CC lines /  
Signal used for discharging VBUS line  
during voltage change  
Analog input/Strong  
drive (Push Pull)  
CC_VREF/  
VBUS_DISCHARGE  
-/Active  
HIGH  
39  
40  
IO  
O
Open drain, drives low  
MUXSEL_5  
External Data Mux Select signal 5  
Document Number: 001-93639 Rev. *K  
Page 8 of 31  
CCG1 Datasheet  
Table 4 provides the pin definition for 16-pin SOIC for the Power Adapter application. Refer to Table 23 on page 23 for part numbers  
to package mapping.  
Table 4. Pin Definitions for 16-pin SOIC for Power Adapter Application  
CYPD  
Functional Pin Name  
1132-16SXI  
Pins  
Type  
Description  
SWD_CLK  
1
2
3
4
5
6
7
8
9
I
O
I
SWD Clock  
VBUS_P_CTRL  
VBUS_VMON  
VBUS_VREF  
XRES  
Full rail control signal for enabling/disabling provider load FET  
VBUS over-voltage protection monitoring signal  
I
VBUS reference signal for over-voltage protection detection  
Active Low Reset  
VCCD  
Connect 1 µF capacitor between VCCD and GROUND  
VSSD  
Ground  
VDDD  
Power 3.3 V/5 V  
Ground  
VSSA  
Data reference signal for CC line (0.55 Volt) / Signal used for  
discharging VBUS line during voltage decrease  
CC_VREF/VBUS_DISCHARGE  
10  
I/O  
CC1 control  
0: TX enabled  
z: RX sense  
CC_CTRL  
11  
I/O  
CS  
12  
13  
14  
15  
16  
I
Low Side Current Sense  
VSEL1  
VSEL2  
CC  
O
Voltage select signal for selecting the output voltage 5/12/20 V  
Voltage select signal for selecting the output voltage 5/12/20 V  
Configuration Channel TX/RX  
O
I/O  
I/O  
SWD_IO  
SWD I/O  
Document Number: 001-93639 Rev. *K  
Page 9 of 31  
 
CCG1 Datasheet  
Pinouts  
Figure 2. Pinout for CYPD1122-40LQXI/CYPD1121-40LQXI  
MUXSEL_1  
MUXSEL_2  
CC1_CTRL  
CC2_CTRL  
MUXSEL_3  
MUXSEL_4  
CS _P  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
XRES  
CC2_VCONN _CTRL  
CC2_RP  
1
2
3
4
5
6
7
8
9
10  
CC2_RD  
CC2  
VBUS _DISCHARGE  
CC1_VCONN _CTRL  
CC1_RP  
QFN  
(Top View)  
CS_M  
CC1_RD  
VSS  
CC1  
CC_SEL_REF_2  
Figure 3. Pinout for CYPD1134-40LQXI  
MUXSEL_1  
MUXSEL_2  
CC1_CTRL  
CC2_CTRL  
MUXSEL_3  
MUXSEL_4  
CS_P  
30  
29  
28  
27  
26  
25  
24  
23  
22  
XRES  
IFAULT  
1
2
3
4
5
6
7
8
9
10  
CC2_VCONN _CTRL  
CC1_VCONN _CTRL  
CC2  
QFN  
(Top View)  
CC2_LPREF  
CC2_LPRX  
CC1_LPREF  
CC1_LPRX  
CC2_RP_3.0  
CS_M  
VSS  
CC1  
21  
Figure 4. Pinout for CYPD1132-16SXI  
SWD_CLK  
VBUS_P_CTRL  
VBUS_VMON  
VBUS_VREF  
XRES  
1
2
3
4
5
6
7
8
16 SWD_IO  
15 CC  
14 VSEL2  
13 VSEL1  
12 CS  
SOIC  
(Top View)  
11  
10  
9
CC_CTRL  
VCCD  
CC_VREF/VBUS_DISCHARGE  
VSSA  
VSSD  
VDDD  
Document Number: 001-93639 Rev. *K  
Page 10 of 31  
 
 
 
 
CCG1 Datasheet  
Figure 5. Pinout for CYPD1103-35FNXIT/CYPD1131-FNXIT  
7
6
5
4
3
2
1
GPIO/  
CC1_VCO  
NN_CTRL  
TX_GND/  
VBUS_DIS  
CHARGE  
GPIO/  
CC_SEL_R  
EF_2  
GPIO/  
CC2_RD  
GPIO/  
I2C_INT  
CC1_LPRE  
F/CC1_RP  
A
B
C
D
E
VCCD  
TX_M/  
CC2_VCON  
N_CTRL  
GPIO/  
CC2_RP  
TX_U/  
CC2  
XRES  
I2C_SDA  
VSSA  
I2C_SCL  
SWD_CLK  
SWD_IO  
VCONN_D  
ET/  
CC_SEL_R  
EF_3  
CC1_RX/  
VBUS_VMO  
N
CC_VREF/  
VBUS_VRE  
F
GPIO/  
HOTPLUG_  
DET  
VDDD/  
VDDA  
CC1_LPRX/  
CC1_RD  
TX_REF_O  
UT/  
CC_VREF  
CC1_TX/  
VBUS_C_C  
TRL  
GPIO/  
MUXSEL_2  
BYPASS/  
MUXSEL_1  
TX_REF_IN  
/CC1_CTRL  
GPIO  
RA_FAR_D  
ISCONNEC  
T/  
RA_DISCO  
NNECT/  
CC2_CTRL  
GPIO/  
VBUS_P_C  
TRL  
GPIO/  
CC_SEL_R  
EF_1  
GPIO/  
MUXSEL_4  
GPIO/  
CS_M  
GPIO/  
CS_P  
MUXSEL_3  
Power  
The following power system diagram shows the minimum set of  
power supply pins as implemented for the CCG1. The system  
has one regulator in Active mode for the digital circuitry. There is  
no analog regulator; the analog circuits run directly from the  
VDDA input. There is a separate regulator for the Deep Sleep  
mode. There is a separate low-noise regulator for the bandgap.  
The supply voltage range is 3.2 V to 5.5 V with all functions and  
circuits operating over that range.  
VDDA and VDDD must be shorted together; the grounds, VSSA  
and VSS must also be shorted together. Bypass capacitors must  
be used from VDDD to ground. The typical practice for systems  
in this frequency range is to use a capacitor in the 1-µF range in  
parallel with a smaller capacitor (0.1 µF, for example). Note that  
these are simply rules of thumb and that, for critical applications,  
the PCB layout, lead inductance, and the bypass capacitor  
parasitic should be simulated to design and obtain optimal  
bypassing.  
Refer to Application Diagrams for bypassing schemes.  
Document Number: 001-93639 Rev. *K  
Page 11 of 31  
 
 
 
CCG1 Datasheet  
Electrical Specifications  
Absolute Maximum Ratings  
Table 5. Absolute Maximum Ratings[11]  
Details/  
Conditions  
Spec ID Parameter  
Description  
Min  
Typ  
Max  
Units  
SID1  
SID2  
VDDD_ABS  
VCCD_ABS  
VGPIO_ABS  
IGPIO_ABS  
Digital supply relative to VSSD  
–0.50  
–0.50  
6.00  
1.95  
V
V
V
Absolute max  
Absolute max  
Absolute max  
Direct digital core voltage input  
relative to VSSD  
SID3  
SID4  
GPIO voltage  
–0.50  
VDDD+0.50  
25.00  
Maximum current per GPIO  
GPIO injection current, Max for VIH  
–25.00  
mA Absolute max  
>
Absolute max, current  
injected per pin  
SID5  
IGPIO_injection  
ESD_HBM  
–0.50  
0.50  
mA  
V
VDDD, and Min for VIL < VSS  
Electrostatic discharge human body  
model  
BID44  
2200.00  
Electrostatic discharge charged  
device model  
BID45  
BID46  
ESD_CDM  
LU  
500.00  
V
Pin current for latch-up  
–200.00  
200.00  
mA  
Device-Level Specifications  
All specifications are valid for –40 °C TA 85 °C and TJ 100 °C for 35-CSP and 40-QFN package options. Specifications are valid  
for –40 °C TA 105 °C and TJ 120 °C for 16-SOIC package options. Specifications are valid for 3.2 V to VDD’s maximum value,  
depending on the type of application.  
Table 6. DC Specifications  
Spec ID Parameter  
SID53 VDDD  
SID53_A VDDD  
Details/  
Description  
Min  
Typ  
Max  
Units  
Conditions  
Notebook, tablet, monitor and  
power adapter applications  
Power supply input voltage  
3.20  
5.20  
V
Power supply input voltage  
3.20  
5.50  
V
V
EMCA applications  
SID54  
SID55  
SID56  
VCCD  
CEFC  
CEXC  
Output voltage (for core logic)  
External regulator voltage bypass  
Power supply decoupling capacitor  
1.80  
1.30  
1.00  
1.00  
1.60  
μF  
μF  
X5R ceramic or better  
X5R ceramic or better  
Active Mode, VDDD = 3.2 to 5.5 V. Typical values measured at VDD = 3.3 V.  
SID19  
SID20  
IDD14  
IDD15  
Execute from flash; CPU at 48 MHz  
Execute from flash; CPU at 48 MHz  
12.80  
mA  
mA  
T = 25 °C  
13.80  
Sleep Mode, VDDD = 3.2 to 5.5 V  
SID25A IDD20A  
I2C wakeup and comparators on  
1.70  
2.2 0  
mA  
Deep Sleep Mode, VDDD = 3.2 to 3.6 V (Regulator on)  
SID31  
SID32  
IDD26  
IDD27  
I2C wakeup on  
I2C wakeup on  
1.30  
μA  
μA  
T = 25 °C, 3.6 V  
T = 85 °C  
50.00  
Deep Sleep Mode, VDDD = 3.6 to 5.5 V  
SID34  
IDD29  
I2C wakeup  
15.00  
2.00  
μA  
T = 25 °C, 5 V  
XRES Current  
SID307 IDD_XR  
Supply current while XRES asserted  
5.00  
mA  
Note  
11. Usage above the absolute maximum conditions listed in Table 5 may cause permanent damage to the device. Exposure to absolute maximum conditions for extended  
periods of time may affect device reliability. The maximum storage temperature is 150 °C in compliance with JEDEC Standard JESD22-A103, High Temperature  
Storage Life. When used below absolute maximum conditions but above normal operating conditions, the device may not operate to specification.  
Document Number: 001-93639 Rev. *K  
Page 12 of 31  
 
 
 
 
 
CCG1 Datasheet  
Table 7. AC Specifications  
Spec ID Parameter  
Details/  
Description  
Min  
DC  
Typ  
Max  
48.00  
Units  
Conditions  
SID48 FCPU  
CPU frequency  
MHz 3.2 VDD 5.5  
Guaranteed by  
µs  
SID49 TSLEEP  
Wakeup from sleep mode  
0.00  
characterization  
24-MHz IMO.  
Guaranteed by  
characterization  
SID50 TDEEPSLEEP  
Wakeup from Deep Sleep mode  
25.00  
µs  
µs  
Guaranteed by  
characterization  
SID52 TRESETWIDTH External reset pulse width  
1.00  
I/O  
Table 8. I/O DC Specifications  
Details/  
Spec ID Parameter  
Description  
Input voltage high threshold  
Input voltage low threshold  
Min  
Typ  
Max  
Units  
Conditions  
0.70 ×  
VDDD  
[12]  
SID57 VIH  
V
V
CMOS Input  
CMOS Input  
0.30 ×  
VDDD  
SID58 VIL  
[12]  
SID243 VIH  
LVTTL input  
LVTTL input  
2.00  
V
V
SID244 VIL  
0.80  
VDDD  
–0.60  
SID59 VOH  
Output voltage high level  
V
IOH = 4 mA at 3 V VDDD  
SID62 VOL  
Output voltage low level  
Output voltage low level  
Pull-up resistor  
0.60  
0.40  
8.50  
8.50  
2.00  
V
IOL = 8 mA at 3 V VDDD  
SID62A VOL  
V
IOL = 3 mA at 3 V VDDD  
SID63 RPULLUP  
SID64 RPULLDOWN  
SID65 IIL  
3.50  
3.50  
5.60  
5.60  
kΩ  
kΩ  
nA  
Pull-down resistor  
Input leakage current (absolute value)  
25 °C, VDDD = 3.0 V  
Input leakage current (absolute value)  
for analog pins  
SID65A IIL_CTBM  
SID66 CIN  
4.00  
7.00  
nA  
pF  
Input capacitance  
VDDD 2.7 V.  
Guaranteed by charac-  
terization  
SID67 VHYSTTL  
Input hysteresis LVTTL  
15.00  
40.00  
mV  
mV  
VDDD 4.5 V.  
Guaranteed by charac-  
terization  
SID68 VHYSCMOS  
Input hysteresis CMOS  
200.00  
Current through protection diode to  
Guaranteed by charac-  
terization  
SID69 IDIODE  
100.00  
200.00  
μA  
VDD/VSS  
Maximum Total Source or Sink Chip  
Current  
Guaranteed by charac-  
terization  
SID69A ITOT_GPIO  
mA  
Table 9. I/O AC Specifications  
(Guaranteed by Characterization)  
Details/  
Conditions  
Spec ID Parameter  
Description  
Min  
Typ  
Max  
Units  
SID70  
SID71  
TRISEF  
TFALLF  
Rise time  
Fall time  
2.00  
2.00  
12.00  
12.00  
ns  
ns  
3.3-V VDDD, Cload = 25 pF  
3.3-V VDDD, Cload = 25 pF  
Note  
12. V must not exceed V  
+ 0.2 V.  
IH  
DDD  
Document Number: 001-93639 Rev. *K  
Page 13 of 31  
 
 
 
CCG1 Datasheet  
XRES  
Table 10. XRES DC Specifications  
Details/  
Units  
Spec ID  
Parameter  
VIH  
Description  
Min  
Typ  
Max  
Conditions  
SID77  
SID78  
SID79  
SID80  
Input voltage high threshold  
Input voltage low threshold  
Pull-up resistor  
0.70 × VDDD  
V
V
CMOS input  
VIL  
3.50  
0.30 × VDDD  
CMOS input  
RPULLUP  
CIN  
5.60  
3.00  
8.50  
kΩ  
pF  
Input capacitance  
Guaranteed by  
characterization  
SID81  
SID82  
VHYSXRES  
IDIODE  
Input voltage hysteresis  
100.00  
mV  
µA  
Current through protection diode to  
Guaranteed by  
characterization  
100.00  
VDDD/VSS  
Digital Peripherals  
The following specifications apply to the Timer/Counter/PWM peripherals in the Timer mode.  
Pulse Width Modulation (PWM) for VSEL and CUR_LIM Pins  
Table 11. PWM AC Specifications  
(Guaranteed by Characterization)  
Details/  
Spec ID  
Parameter  
Description  
Operating frequency  
Min  
Typ  
Max  
Units  
Conditions  
SID140  
SID141  
SID142  
SID143  
SID144  
SID145  
SID146  
SID147  
SID148  
TPWMFREQ  
TPWMPWINT  
TPWMEXT  
48.00  
MHz  
ns  
Pulse width (internal)  
42.00  
42.00  
42.00  
42.00  
42.00  
42.00  
42.00  
42.00  
Pulse width (external)  
ns  
TPWMKILLINT  
TPWMKILLEXT  
TPWMEINT  
Kill pulse width (internal)  
Kill pulse width (external)  
Enable pulse width (internal)  
Enable pulse width (external)  
ns  
ns  
ns  
TPWMENEXT  
ns  
TPWMRESWINT Reset pulse width (internal)  
TPWMRESWEXT Reset pulse width (external)  
ns  
ns  
Document Number: 001-93639 Rev. *K  
Page 14 of 31  
CCG1 Datasheet  
I2C  
Table 12. Fixed I2C DC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID149  
Parameter  
II2C1  
Description  
Min  
Typ  
Max  
50  
Units Details/Conditions  
Block current consumption at 100 kHz  
Block current consumption at 400 kHz  
Block current consumption at 1 Mbps  
I2C enabled in Deep Sleep mode  
µA  
µA  
µA  
µA  
SID150  
SID151  
SID152  
II2C2  
II2C3  
II2C4  
135.00  
310.00  
1.40  
Table 13. Fixed I2C AC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID153  
Parameter  
FI2C1  
Description  
Min  
Typ  
Max  
Units Details/Conditions  
Bit rate  
1.00  
Mbps  
Memory  
Table 14. Flash DC Specifications  
Spec ID  
Parameter  
VPE  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
SID173  
Erase and program voltage  
3.20  
5.50  
V
Table 15. Flash AC Specifications  
Spec ID  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
Row (block) write time (erase and  
program)  
Row (block) =  
128 bytes  
[13]  
SID174 TROWWRITE  
20.00  
ms  
[13]  
SID175 TROWERASE  
Row erase time  
13.00  
7.00  
ms  
ms  
ms  
[13]  
SID176 TROWPROGRAM  
Row program time after erase  
Bulk erase time (32 KB)  
[13]  
SID178 TBULKERASE  
35.00  
Guaranteed by  
characterization  
[13]  
SID180 TDEVPROG  
Total device program time  
Flash endurance  
100 K  
20  
7.00  
seconds  
cycles  
years  
Guaranteed by  
characterization  
SID181 FEND  
Flash retention. TA 55 °C, 100 K P/E  
cycles  
Guaranteed by  
characterization  
[14]  
SID182 FRET  
Flash retention. TA 85 °C, 10 K P/E  
cycles  
Guaranteed by  
characterization  
SID182A  
SID182B  
10  
years  
Flash retention. 85 °C < TA < 105 °C,  
10K P/E cycles  
Guaranteed by  
characterization  
3
years  
Notes  
13. It can take as much as 20 milliseconds to write to flash. During this time the device should not be Reset, or flash operations will be interrupted and cannot be relied  
on to have completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs.  
Make certain that these are not inadvertently activated.  
14. Cypress provides a retention calculator to calculate the retention lifetime based on customers' individual temperature profiles for operation over the –40 °C to +105 °C  
ambient temperature range. Contact customercare@cypress.com.  
Document Number: 001-93639 Rev. *K  
Page 15 of 31  
 
 
 
 
CCG1 Datasheet  
System Resources  
Power-on-Reset (POR) with Brown Out  
Table 16. Imprecise Power On Reset (PRES)  
Spec ID  
Parameter  
Description  
Rising trip voltage  
Min  
0.80  
0.75  
15.0  
Typ  
Max  
1.45  
Units  
Details/Conditions  
SID185 VRISEIPOR  
SID186 VFALLIPOR  
SID187 VIPORHYST  
V
V
Guaranteed by characterization  
Guaranteed by characterization  
Falling trip voltage  
Hysteresis  
1.40  
200.0  
mV Guaranteed by characterization  
Table 17. Precise Power On Reset (POR)  
Spec ID  
Parameter  
Description  
Min  
1.64  
1.40  
Typ  
Max  
Units  
Details/Conditions  
BOD trip voltage in active and  
sleep modes  
SID190 VFALLPPOR  
SID192 VFALLDPSLP  
V
V
Guaranteed by characterization  
Guaranteed by characterization  
BOD trip voltage in Deep Sleep  
SWD Interface  
Table 18. SWD Interface Specifications  
Spec ID  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
SWDCLK 1/3 CPU clock  
frequency  
SID213 F_SWDCLK1  
3.2 V VDDD 5.5 V  
14.00 MHz  
SID215 T_SWDI_SETUP T = 1/f SWDCLK  
SID216 T_SWDI_HOLD T = 1/f SWDCLK  
SID217 T_SWDO_VALID T = 1/f SWDCLK  
SID217A T_SWDO_HOLD T = 1/f SWDCLK  
0.25 × T  
ns Guaranteed by characterization  
ns Guaranteed by characterization  
ns Guaranteed by characterization  
ns Guaranteed by characterization  
0.25 × T  
0.50*T  
1
Internal Main Oscillator  
Table 19. IMO DC Specifications  
(Guaranteed by Design)  
Spec ID  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
SID218 IIMO1  
IMO operating current at 48 MHz  
1000.00  
µA  
Table 20. IMO AC Specifications  
Spec ID  
Parameter  
Description  
Frequency variation  
IMO startup time  
Min  
Typ  
Max  
±2.00  
12.00  
Units  
%
Details/Conditions  
SID223 FIMOTOL1  
SID226 TSTARTIMO  
SID229 TJITRMSIMO3  
With API-called calibration  
µs  
RMS Jitter at 48 MHz  
139.00  
ps  
Document Number: 001-93639 Rev. *K  
Page 16 of 31  
 
CCG1 Datasheet  
Internal Low-Speed Oscillator  
Table 21. ILO DC Specifications  
(Guaranteed by Design)  
Spec ID Parameter  
Description  
Min  
Typ  
0.30  
2.00  
Max  
1.05  
Units  
µA  
Details/Conditions  
Guaranteed by characterization  
Guaranteed by design  
SID231 IILO1  
ILO operating current at 32 kHz  
ILO leakage current  
SID233 IILOLEAK  
15.00  
nA  
Table 22. ILO AC Specifications  
Spec ID Parameter  
Description  
Min  
Typ  
Max  
2.00  
Units  
ms  
Details/Conditions  
Guaranteed by characterization  
Guaranteed by characterization  
±60% with trim  
SID234 TSTARTILO1  
SID236 TILODUTY  
SID237 FILOTRIM1  
ILO startup time  
ILO duty cycle  
32-kHz trimmed frequency  
40.00 50.00  
15.00 32.00  
60.00  
50.00  
%
kHz  
Document Number: 001-93639 Rev. *K  
Page 17 of 31  
CCG1 Datasheet  
Applications in Detail  
Figure 6. Single Chip/Cable, Component Count = 19  
Type-C Plug  
Type-C Plug  
VBUS  
BAT54V-7  
VCONN 1  
BAT54V-7  
VCONN 2  
A1  
C1  
C2  
A2  
100k  
10%  
100k  
10%  
D
S
D
12.4k1%100k1%  
TF412S  
Ra_Far  
G
TF412S  
G
S
806  
1%  
806  
Ra  
1uF  
1%  
A5  
C7  
CC1_LPREF  
VDDD  
A1, A2, A4, A6, B4, C2, D2,  
D6, E1, E2, E3, E6, E7  
GPIO  
C6  
VCONN_DET  
D4  
TX_REF_OUT  
E4  
E5  
RA_DISCONNECT  
  
C5  
CC_VREF  
TX_GND  
2.2nf  
2.4k1%  
RA_FAR_DISCONNECT  
2k1%  
2k1%  
A3  
CYPD1103-35FNXI  
35CSP  
B6  
D3  
B5  
XRES  
TX_REF_IN  
TX_M  
47pF  
1uF  
D5  
A7  
BYPASS  
B3  
D7  
TX_U  
221%  
VCCD  
VSSA  
CC1_TX  
B7  
C4  
C3  
CC1_RX  
I2C_ I2C_ SWD_ SWD_  
SCL SDA  
B2  
IO  
D1  
CLK  
C1  
CC1_LPRX  
B1  
S
D
NTNS3164NZ  
G
CC  
CC  
SuperSpeed and HighSpeed Lines  
GND  
Document Number: 001-93639 Rev. *K  
Page 18 of 31  
 
 
 
CCG1 Datasheet  
Figure 7. Two Chip/Cable, Component Count = 15/paddle  
Type-C Plug  
Type-C Plug  
VBUS  
VBUS  
VCONN 1  
VCONN 2  
100k  
10%  
100k  
10%  
D
D
12.4k1% 100k1%  
12.4k1% 100k1%  
TF412S  
G
S
TF412S  
G
S
806  
Ra  
  
1%  
1uF  
1uF  
Ra  
1%  
A5  
A5  
C7  
VDDD  
C7  
VDDD  
A1, A2, A4, A6, B4, C2, D2,  
D6, E1, E2, E3, E6, E7  
CC1_LPREF  
A1, A2, A4, A6, B4, C2, D2,  
D6, E1, E2, E3, E6, E7  
CC1_LPREF  
GPIO  
GPIO  
C6  
E4  
E5  
C6  
VCONN_DET  
VCONN_DET  
D4  
D4  
TX_REF_OUT  
CC_VREF  
TX_GND  
TX_REF_OUT  
E4  
E5  
RA_DISCONNECT  
RA_DISCONNECT  
  
  
C5  
C5  
2.2nf  
2.4k1%  
2.2nf  
RA_FAR_DISCONNECT  
CC_VREF  
TX_GND  
2.4k1%  
RA_FAR_DISCONNECT  
2k1%  
2k1%  
2k1%  
2k1%  
A3  
A3  
D3  
B5  
B3  
D7  
CYPD1103-35FNXI  
35CSP  
CYPD1103-35FNXI  
35CSP  
B6  
B6  
D3  
B5  
B3  
D7  
XRES  
XRES  
TX_REF_IN  
TX_M  
TX_REF_IN  
TX_M  
47pF  
47pF  
D5  
D5  
A7  
B7  
BYPASS  
BYPASS  
TX_U  
TX_U  
1uF  
1uF  
221%  
221%  
A7  
B7  
VCCD  
VSSA  
VCCD  
VSSA  
CC1_TX  
CC1_TX  
C4  
C3  
C4  
C3  
CC1_RX  
CC1_RX  
I2C_ I2C_ SWD_ SWD_  
SCL SDA  
I2C_ I2C_ SWD_ SWD_  
SCL SDA  
B1 B2  
IO  
D1  
CLK  
C1  
CC1_LPRX  
IO  
D1  
CLK  
C1  
CC1_LPRX  
B2  
B1  
S
D
S
D
G
NTNS3164NZ  
CC  
NTNS3164NZ  
G
CC  
SuperSpeed and HighSpeed Lines  
SuperSpeed and HighSpeed Lines  
GND  
GND  
Figure 8. 16-pin SOIC Power Adapter Application Diagram  
PFET  
DMG7401SFG-7  
5-20 Volts  
From  
Secondary  
Side  
VBUS  
S
D
49.9k  
1%  
G
100k1%  
10uF  
1k1%  
100  
1%  
10k1%  
0.1uF  
NFET  
MGSF1N03L  
3.3v  
NFET  
D
S
MGSF1N03L  
Select  
NFET  
with Vth  
> 1V  
MGSF1N03LT1G  
G
VBUS_DISCHARGE  
Sense Resistor on the  
return path of Secondary  
100k  
Rsense  
10 m  
1uF  
0.1uF  
3.9k1%  
4
VBUS_DISCHARGE  
3
8
2
6
1uF  
3.3V  
12  
21.5k1%  
CS  
10  
VBUS_DISCHARGE/  
To  
Primary  
Side  
VBUS  
VSEL1  
VSEL2  
CC_VREF  
5.6K 1%  
5V  
0
0
1
0
13  
14  
VSEL1  
VSEL2  
CYPD1132-16SXI  
16SOIC  
3.3v  
12V  
19.6V  
1
0
16  
1
Rp  
SWD_IO  
4.7k 1%  
3.3v  
SWD_CLK  
84.51%  
51.11%  
15  
11  
CC  
5
CC  
XRES  
NTS3164NZ  
330pF  
4.7nF  
0.1uF  
CCG1 supports up to 2.2kV ESD  
protection. If higher protection is  
required, add external ESD.  
CC_CTRL  
VSSA  
VSSD  
7
9
Document Number: 001-93639 Rev. *K  
Page 19 of 31  
 
 
 
CCG1 Datasheet  
Figure 9. Notebook (DRP) Application Diagram  
PFET  
To System  
D
S
S
D
50k  
5%  
G
G
VBUS  
From  
System  
PFET  
5V  
D
S
S
D
G
50k  
G
100k1%  
10k1%  
5%  
5 Volts  
1001% 1W  
CS_P  
0.21%  
CS_M  
NFET  
G
D
G
NFET  
D
G
D
S
VBUS_DISCHARGE  
S
3.9k1%  
Select  
NFET  
S
with Vth  
> 1V  
10k1%  
VDDD = 5V  
S
D
0.1uF 1uF  
PFET  
G
33  
31  
32  
40  
38  
35 36  
24  
NFET  
1uF  
S
D
G
330pF  
5.1k  
10%  
Rp  
10k1%  
Rd  
G
23  
1M, 5%  
VDDD  
CC1_RP  
7
8
CS_P  
CS_M  
CS_P  
CS_M  
D
S
22  
10  
NFET  
NFET  
15  
16  
17  
CC1_RD  
CC1  
GPIO1  
GPIO2  
GPIO3  
S
D
G
2871%  
VDDD  
CC1  
CC2  
25  
VBUS_DISCHARGE  
VBUS_DISCHARGE  
80.61%  
2.2nF  
Type C  
Receptacle  
1
3
MUXSEL_1  
CC1_CTRL  
2
5
6
10k1%  
MUXSEL_2  
MUXSEL_3  
MUXSEL_4  
S
CYPD1122-40LQXI  
40QFN  
G
PFET  
D
14  
29  
26  
HOTPLUG_DET  
HPD  
CC2_VCONN_CTRL  
2871%  
NFET  
CC2  
S
D
G
330pF  
12  
13  
80.61%  
SWD_IO  
2.2nF  
1M, 5%  
5.1k  
10%  
VDDD  
Rd  
G
SWD_CLK  
4
CC2_CTRL  
CC2_RP  
D
S
18  
19  
20  
NFET  
I2C_SCL  
Embedded  
Controller  
10k  
1%  
Rp  
I2C_SDA  
I2C_INT  
28  
27  
30  
NFET  
D
XRES  
CC2_RD  
39  
S
G
0.1uF  
HS  
SS  
9
34  
11  
21  
37  
USB  
Chipset  
VDDD  
HS  
5 Volts  
3.16k  
1%  
MUXSEL_x  
4.1k  
1%  
HS/SS/  
DP/SBU  
Lines  
2.32k  
1%  
21.5k1%  
HPD  
SS/DP0/1  
DP2/3  
DisplayPort  
Chipset  
HS/SS/DP  
Mux  
DP0/1/2/3  
AUX+/-  
AUX+/-  
Document Number: 001-93639 Rev. *K  
Page 20 of 31  
 
CCG1 Datasheet  
Figure 10. Notebook (DFP) Application Diagram  
VBUS  
From  
System  
5V  
PFET  
D
S
S
D
0.021%  
50k  
5%  
G
G
100k1%  
10k1%  
Current Monitor  
+ Comparator  
1001% 1W  
5 Volts  
iFAULT  
CS_P  
0.21%  
CS_M  
D
NFET  
G
G
NFET  
D
S
VBUS_DISCHARGE  
S
3.9k1%  
Select  
NFET  
with Vth  
> 1V  
10k1%  
VDDD = 5V  
S
D
0.1uF 1uF  
PFET  
G
31  
33  
32  
37  
35 36  
27  
NFET  
56k1%  
22k1%  
10k1%  
1uF  
S
D
15  
11  
CC1_RP_DEF  
CC1_RP_1.5  
G
390pF  
VDDD  
14  
22  
CC1_RP_3.0  
CC1_LPRX  
7
8
CS_P  
CS_M  
CS_P  
CS_M  
2871%  
10  
CC1  
CC1  
CC2  
29  
80.61%  
iFAULT  
iFAULT  
2.2nF  
10k1%  
Type C  
Receptacle  
3
CC1_CTRL  
1
MUXSEL_1  
28  
24  
CC2_VCONN_CTRL  
2
S
MUXSEL_2  
MUXSEL_3  
MUXSEL_4  
MUXSEL_5  
5
6
CYPD1134-40LQXI  
40QFN  
G
PFET  
CC2_LPRX  
CC2  
40  
D
38  
2871%  
HOTPLUG_DET  
HPD  
NFET  
26  
S
D
G
390pF  
80.61%  
12  
13  
2.2nF  
SWD_IO  
VDDD  
Embedded  
Controller  
SWD_CLK  
4
CC2_CTRL  
56k1%  
22k1%  
10k1%  
18  
19  
16  
I2C_SCL  
CC2_RP_DEF  
CC2_RP_1.5  
I2C_SDA  
I2C_INT  
20  
17  
21  
30  
CC2_RP_3.0  
XRES  
0.1uF  
HS  
SS  
39  
9
34  
23 25  
USB  
Chipset  
HS  
5 Volts  
MUXSEL_x  
HS/SS/  
21.5k1%  
DP/SBU  
Lines  
HPD  
SS/DP0/1  
DP2/3  
DisplayPort  
Chipset  
VBUS_DISCHARGE  
3.42k1%  
HS/SS/DP  
Mux  
DP0/1/2/3  
AUX+/-  
AUX+/-  
Document Number: 001-93639 Rev. *K  
Page 21 of 31  
 
CCG1 Datasheet  
Figure 11. Monitor Application Block Diagram  
VBUS  
DC Input  
5/12/20V  
PFET  
DC/DC  
D
S
S
D
50k  
5%  
G
G
100k1%  
10k1%  
5 Volts  
1001%, 1W  
D
G
NFET  
D
S
VBUS_DISCHARGE  
S
NFET  
Select  
NFET  
with Vth  
> 1V  
G
3.9k1%  
CS_P  
0.21%  
CS_M  
REG  
10k1%  
VDDD = 5V  
VBUS_  
DISCHARGE  
S
D
0.1uF 1uF  
PFET  
G
33  
32  
40  
35 36  
25  
24  
31  
1uF  
10k  
1%  
Rp  
23  
VBUS  
5V  
VSEL1  
VSEL2  
CC1_RP  
7
8
CS_P  
CS_M  
CS_P  
CS_M  
5.1k  
1%  
Rd  
2871%  
NFET  
22  
10  
CC1_RD  
CC1  
37  
15  
S
D
VSEL1  
VSEL2  
0
0
1
0
1
0
G
330pF  
VDDD  
17  
38  
iFAULT  
CC1  
80.61%  
12V  
19.6V  
0V  
2.2nF  
VBUS_C_CTRL/VBUS_OK  
Type C  
Receptacle  
3
CC1_CTRL  
1
2
5
6
MUXSEL_1  
10k  
MUXSEL_2  
MUXSEL_3  
MUXSEL_4  
CC2  
CYPD1121-40LQXI  
40QFN  
S
D
1
1
PFET  
G
29  
26  
CC2_VCONN_CTRL  
14  
HOTPLUG_DET  
HPD  
2871%  
NFET  
CC2  
S
D
G
330pF  
80.61%  
2.2nF  
12  
13  
VDDD  
SWD_IO  
4
CC2_CTRL  
SWD_CLK  
18  
I2C_SCL  
Embedded  
Controller  
19  
10k  
1%  
Rp  
Rd  
I2C_SDA  
I2C_INT  
28  
27  
20  
CC2_RP  
CC2_RD  
5.1k  
1%  
30  
XRES  
0.1uF  
HS  
9
34  
39  
HS  
SS  
11  
21  
16  
USB  
Chipset  
5 Volts  
3.16k  
1%  
MUXSEL_x  
4.1k  
1%  
HS/SS/  
DP/SBU  
Lines  
2.32k  
1%  
21.50k1%  
SS/DP0/1  
DP2/3  
HPD  
HS/SS/DP  
Mux  
DisplayPort  
Chipset  
DP0/1/2/3  
AUX+/-  
AUX+/-  
Document Number: 001-93639 Rev. *K  
Page 22 of 31  
 
CCG1 Datasheet  
Ordering Information  
The CCG1 part numbers and features are listed in the following table.  
Table 23. CCG1 Ordering Information  
Type-C Overcurrent Overvoltage Termination  
Part Number[15]  
Application  
Role[18]  
Package  
Si ID  
Ports[16] Protection  
Protection  
Resistor[17]  
Cable 35-WLCSP[20] 0490  
DRP[24] 35-WLCSP[22] 0491  
[19]  
CYPD1103-35FNXIT Cable, EMCA  
1
1
No  
No  
Ra  
Notebook,  
CYPD1131-35FNXIT Tablet,  
Smartphone  
[21]  
Yes  
Yes  
Rp[23], Rd  
DRP[24] 40-QFN  
DRP[24] 40-QFN  
0489  
048A  
[21]  
CYPD1121-40LQXI Monitor  
CYPD1122-40LQXI Notebook  
1
1
Yes  
Yes  
Yes  
Yes  
Rp[23], Rd  
Rp[23], Rd  
[21]  
Notebook,  
CYPD1134-40LQXI  
Desktop  
[23]  
1
Yes  
Yes  
Rp  
DFP  
40-QFN  
048B  
[23]  
CYPD1132-16SXI  
Power Adapter  
1
1
Yes  
Yes  
Yes  
Yes  
Rp  
DFP  
DFP  
16-SOIC  
16-SOIC  
0498  
0498  
[23]  
CYPD1132-16SXQ Power Adapter  
Rp  
Ordering Code Definitions  
-
X X X  
XX  
X
PD X XX XX  
CY  
T = Tape and reel for CSP, N/A for other packages  
Temperature Range: I = Industrial, Q = Extended industrial  
Lead: X = Pb-free  
Package Type: LQ = QFN, FN = CSP, S = SOIC  
Number of pins in the package  
0X: OCP and OVP not supported, 1X: reserved,  
2X, 3X: OCP and OVP supported  
Number of Type-C Ports: 1 = 1 Port, 2 = 2 Port  
Product Type: 1 = First-generation product family, CCG1  
Marketing Code: PD = Power delivery product family  
Company ID: CY = Cypress  
Notes  
15. All part numbers support: Input voltage range from 3.2 V to 5.5 V. Industrial parts support -40 °C to +85 °C, Extended Industrial parts support -40 °C to 105 °C.  
16. Number of USB Type-C Ports supported .  
17. Default V  
18. PD Role.  
termination.  
CONN  
19. Type-C Cable Termination.  
20. 35-WLCSP #1 pinout.  
21. USB Device Termination.  
22. 35-WLCSP #2 pinout.  
23. USB Host Termination.  
24. Dual Role Port.  
Document Number: 001-93639 Rev. *K  
Page 23 of 31  
 
 
 
 
 
 
 
 
 
 
 
 
CCG1 Datasheet  
Packaging  
Table 24. Package Characteristics  
Parameter  
A (40-QFN, 35-CSP)  
Description  
Conditions  
Min  
–40  
–40  
–40  
–40  
Typ  
25.00  
Max  
Units  
°C  
T
Operating ambient temperature  
Operating junction temperature  
Operating ambient temperature  
Operating junction temperature  
Package JA (40-pin QFN)  
Package JA (35-CSP)  
85.00  
T
100.00  
°C  
J (40-QFN, 35-CSP)  
T
25.00  
105.00  
°C  
A (16-SOIC)  
T
120.00  
°C  
J (16-SOIC)  
TJA  
15.34  
28.00  
85.00  
02.50  
00.40  
49.00  
°C/Watt  
°C/Watt  
°C/Watt  
°C/Watt  
°C/Watt  
°C/Watt  
TJA  
TJA  
TJC  
TJC  
TJC  
Package JA (16-SOIC)  
Package JC (40-pin QFN)  
Package JC (35-CSP)  
Package JC (16-SOIC)  
Table 25. Solder Reflow Peak Temperature  
Package  
16-pin SOIC  
Maximum Peak Temperature  
Maximum Time at Peak Temperature  
30 seconds  
260 °C  
260 °C  
260 °C  
40-pin QFN  
30 seconds  
35-ball WLCSP  
30 seconds  
Table 26. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2  
Package  
16-pin SOIC  
MSL  
MSL 3  
MSL 3  
MSL 1  
40-pin QFN  
35-ball WLCSP  
Document Number: 001-93639 Rev. *K  
Page 24 of 31  
 
 
 
 
CCG1 Datasheet  
Figure 12. 40-pin QFN Package Outline, 001-80659  
001-80659 *A  
The center pad on the QFN package should be connected to ground (VSS) for best mechanical, thermal, and electrical performance.  
If not connected to ground, it should be electrically floating and not connected to any other signal.  
Figure 13. 35-Ball WLCSP Package Outline, 001-93741  
SIDE VIEW  
TOP VIEW  
BOTTOM VIEW  
1
2
3
4
5
6
7
7
6
5
4
3
2
1
A
B
C
D
E
A
B
C
D
E
NOTES:  
1. REFERENCE JEDEC PUBLICATION 95, DESIGN GUIDE 4.18  
2. ALL DIMENSIONS ARE IN MILLIMETERS  
001-93741 **  
Document Number: 001-93639 Rev. *K  
Page 25 of 31  
CCG1 Datasheet  
Figure 14. 16-pin SOIC (150 Mils) S16.15/SZ16.15 Package Outline, 51-85068  
51-85068 *E  
Document Number: 001-93639 Rev. *K  
Page 26 of 31  
CCG1 Datasheet  
Acronyms  
Table 27. Acronyms Used in this Document (continued)  
Table 27. Acronyms Used in this Document  
Acronym  
opamp  
Description  
operational amplifier  
Acronym  
ADC  
Description  
analog-to-digital converter  
OCP  
OVP  
PCB  
PGA  
PHY  
POR  
PRES  
PSoC®  
PWM  
RAM  
RISC  
RMS  
RTC  
RX  
Overcurrent protection  
Overvoltage protection  
printed circuit board  
programmable gain amplifier  
physical layer  
API  
ARM®  
application programming interface  
advanced RISC machine, a CPU architecture  
Configuration Channel  
CC  
CPU  
central processing unit  
cyclic redundancy check, an error-checking  
protocol  
CRC  
power-on reset  
precise power-on reset  
Programmable System-on-Chip™  
pulse-width modulator  
random-access memory  
reduced-instruction-set computing  
root-mean-square  
CS  
Current Sense  
DFP  
downstream facing port  
digital input/output, GPIO with only digital  
capabilities, no analog. See GPIO.  
DIO  
electrically erasable programmable read-only  
memory  
EEPROM  
EMI  
ESD  
FPB  
FS  
electromagnetic interference  
electrostatic discharge  
flash patch and breakpoint  
full-speed  
real-time clock  
receive  
SAR  
SCL  
successive approximation register  
I2C serial clock  
I2C serial data  
general-purpose input/output, applies to a PSoC  
pin  
GPIO  
SDA  
S/H  
sample and hold  
IC  
integrated circuit  
Serial Peripheral Interface, a communications  
protocol  
IDE  
integrated development environment  
SPI  
Inter-Integrated Circuit, a communications  
protocol  
I2C, or IIC  
SRAM  
SWD  
TX  
static random access memory  
serial wire debug, a test protocol  
transmit  
ILO  
internal low-speed oscillator, see also IMO  
internal main oscillator, see also ILO  
input/output, see also GPIO, DIO, SIO, USBIO  
low-voltage detect  
IMO  
I/O  
Universal Asynchronous Transmitter Receiver, a  
communications protocol  
UART  
LVD  
LVTTL  
MCU  
NC  
UFP  
USB  
upstream facing port  
Universal Serial Bus  
low-voltage transistor-transistor logic  
microcontroller unit  
USB input/output, PSoC pins used to connect to  
a USB port  
USBIO  
XRES  
no connect  
NMI  
NVIC  
nonmaskable interrupt  
external reset I/O pin  
nested vectored interrupt controller  
Document Number: 001-93639 Rev. *K  
Page 27 of 31  
 
CCG1 Datasheet  
Document Conventions  
Units of Measure  
Table 28. Units of Measure  
Symbol  
°C  
Unit of Measure  
degrees Celsius  
hertz  
Hz  
KB  
kHz  
k  
Mbps  
MHz  
M  
Msps  
µA  
1024 bytes  
kilohertz  
kilo ohm  
megabits per second  
megahertz  
mega-ohm  
megasamples per second  
microampere  
microfarad  
microsecond  
microvolt  
µF  
µs  
µV  
µW  
mA  
ms  
mV  
nA  
microwatt  
milliampere  
millisecond  
millivolt  
nanoampere  
nanosecond  
ohm  
ns  
pF  
picofarad  
ppm  
ps  
parts per million  
picosecond  
second  
s
sps  
V
samples per second  
volt  
Document Number: 001-93639 Rev. *K  
Page 28 of 31  
CCG1 Datasheet  
Revision History  
Description Title: CCG1 Datasheet USB Type-C Port Controller with Power Delivery  
Document Number: 001-93639  
Orig. of Submission  
Revision  
ECN  
Description of Change  
Change  
Date  
**  
4520316  
MSMI  
09/30/2014 New datasheet  
Updated Functional Definition.  
Updated Figure 8, Figure , Figure 7, Figure , Figure 14, Figure 9.  
Added Figure 11.  
Updated Pinouts.  
Updated Power.  
*A  
4531795  
SJH  
10/13/2014 Updated Figure , Figure 8.  
Updated Ordering Information  
Added Note 24 and referred the same note in 40-pin QFN corresponding to  
CYPD1122-40LQXI.  
Added Note 27 and referred the same note in 40-pin QFN corresponding to  
CYPD1134-40LQXI.  
Updated Features.  
Added 16-pin SOIC related information.  
Updated Functional Definition.  
Updated Pin Definitions.  
Added Table 2.  
Updated Pinouts.  
Updated Figure 2, Figure 5.  
Added Figure 4.  
Updated Power.  
Updated Figure , Figure 8.  
Added Figure 6.  
Updated Electrical Specifications.  
Updated Device-Level Specifications.  
Updated Memory.  
*B  
4569912  
SJH  
11/21/2014  
Added Note 14 and referred the same note in FRET parameter.  
Added details corresponding to spec ID SID182B under FRET parameter.  
Updated Figure 14, Figure 9, Figure 11. Added Figure 8 and Figure 10.  
Updated Ordering Information.  
Updated part numbers.  
Added a column “Si ID”.  
Updated Packaging.  
Updated Table 24.  
Updated details in maximum value column corresponding to TA and TJ  
parameters.  
Added 16-pin SOIC related information.  
Updated Table 25.  
Updated Figure 6, Figure 14, Figure 16.  
Updated Table 8, Table 23.  
*C  
*D  
4596141  
4646123  
SJH  
SJH  
12/14/2014  
Updated pin definitions for 40-pin QFN and 35-ball WLCSP.  
Updated Pinout for CYPD1122-40LQXI/CYPD1121-40LQXI and Ordering  
02/04/2015 Information.  
Updated conditions for Device-Level Specifications.  
Updated diagrams in Applications in Detail section.  
Removed information about 28-pin SSOP.  
03/13/2015 Updated Table 3, Table 23, Table 24, Table 25, Table 26, Table 27.  
Updated Figure 2, Figure .  
*E  
*F  
4686050  
4747272  
VGT  
VGT  
Updated General Description.  
Added Note 1 and referenced it in Features.  
05/13//2015 Updated Figure 6, Figure 8 through Figure 11.  
Removed Figure 9. Single Chip/Cable, Component Count = 13.  
Removed Figure 11. Two Chip/Cable, Component Count = 11/paddle.  
Document Number: 001-93639 Rev. *K  
Page 29 of 31  
CCG1 Datasheet  
Revision History (continued)  
Description Title: CCG1 Datasheet USB Type-C Port Controller with Power Delivery  
Document Number: 001-93639  
Orig. of Submission  
Revision  
ECN  
Description of Change  
Updated Low-Power Operation.  
Change  
Date  
Updated the number of GPIOs to “up to 30” in GPIO.  
Updated “1.8 to 5.5 V” to “3.2 V to 5.5 V” in Low-Power Operation, Power  
System, Power, Device-Level Specifications and Note 15.  
Updated Table 2, Table 4, Table 5, Table 6, Table 7, Table 8, Table 14 and  
Table 18.  
*G  
4800534  
VGT  
07/02/2015  
Added table footnotes 8, 9 and 10.  
Deleted footnotes 25 through 28.  
Updated Figure 2 and Figure 8 through Figure 11.  
Added Figure 3.  
Updated the following in Power: Removed Figures 5 through 8. Updated the  
section.  
Removed specs SID241 and 242.  
Updated 40-pin QFN package to current revision.  
*H  
*I  
4939764  
5179365  
VGT  
09/29/2015  
03/17/2016  
Updated max value of II2C1 from 10.50 µA to 50 µA.  
Updated copyright information and sales links at the end of the document.  
KISB  
Added compliance information regarding the USB Specification.  
10/03/2016 Updated copyright notice to include WICED.  
*J  
5459633  
5725038  
VGT  
VGT  
Added IoT link in Sales, Solutions, and Legal Information.  
Updated Cypress logo.  
05/03/2017  
*K  
Updated Copyright information.  
Document Number: 001-93639 Rev. *K  
Page 30 of 31  
CCG1 Datasheet  
Sales, Solutions, and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at Cypress Locations.  
®
Products  
PSoC Solutions  
ARM® Cortex® Microcontrollers  
cypress.com/arm  
cypress.com/automotive  
cypress.com/clocks  
cypress.com/interface  
cypress.com/iot  
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6  
Automotive  
Cypress Developer Community  
Clocks & Buffers  
Interface  
Forums | WICED IOT Forums | Projects | Video | Blogs |  
Training | Components  
Internet of Things  
Memory  
Technical Support  
cypress.com/memory  
cypress.com/mcu  
cypress.com/support  
Microcontrollers  
PSoC  
cypress.com/psoc  
Power Management ICs  
Touch Sensing  
USB Controllers  
Wireless Connectivity  
cypress.com/pmic  
cypress.com/touch  
cypress.com/usb  
cypress.com/wireless  
Notice regarding compliance with Universal Serial Bus specification: Cypress offers firmware and hardware solutions that are certified to comply with the Universal Serial Bus specification, USB Type-C™  
Cable and Connector Specification, and other specifications of USB Implementers Forum, Inc (USB-IF). You may use Cypress or third-party software tools, including sample code, to modify the firmware  
for Cypress USB products. Modification of such firmware could cause the firmware/hardware combination to no longer comply with the relevant USB-IF specification. You are solely responsible for  
ensuring the compliance of any modifications you make, and you must follow the compliance requirements of USB-IF before using any USB-IF trademarks or logos in connection with any modifications  
you make. In addition, if Cypress modifies firmware based on your specifications, then you are responsible for ensuring compliance with any desired standard or specifications as if you had made the  
modification. CYPRESS IS NOT RESPONSIBLE IN THE EVENT THAT YOU MODIFY OR HAVE MODIFIED A CERTIFIED CYPRESS PRODUCT AND SUCH MODIFIED PRODUCT NO LONGER  
COMPLIES WITH THE RELEVANT USB-IF SPECIFICATIONS.  
© Cypress Semiconductor Corporation, 2014-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,  
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries  
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other  
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress  
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to  
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users  
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as  
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation  
of the Software is prohibited.  
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE  
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent  
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any  
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is  
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products  
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or  
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the  
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably  
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,  
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other  
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.  
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in  
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.  
Document Number: 001-93639 Rev. *K  
Revised May 3, 2017  
Page 31 of 31  
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