1CYM9272A/B
fax id: 2043
CYM9270
CYM9271A/B
CYM9272A/B
CYM9273
PRELIMINARY
64K x 36 SRAM Module
128K x 36 SRAM Module
256K x 36 SRAM Module
512K x 36 SRAM Module
9272A) or 256K x 18 SRAM’s (9272B, 9273). in plastic surface
mount packages on an epoxy laminate board with pins. The
modules are designed to be incorporated into large memory
arrays.
Features
• Operates at 50 MHz
• Uses 64K x 18/ 128K x 18 or256K x 18 highperformance
synchronous SRAMs.
• 144-position Angled DIMM from Berg p/n 61178
• 3.3V inputs/data outputs
The modules are configured as single banks or multiple banks
depending on the SRAM used to make the module. Separate
clock are provided for each of the banks. Separate clocks are
provided for each of the SRAM’s.
Functional Description
Multiple ground pins and on-board de-coupling capacitors en-
sure high performance with maximum noise immunity.
The CYM9270, CYM9271, CYM9272 and the CYM9273 are
high-performance synchronous memory modules organized
as 64K(9270), 128K(9271), 256K(9272), 512K(9273) by 36
bits. These modules are constructed using either 64K x 18
SRAM’s (CYM9270, CYM9271A), 128K x 18 SRAM’s (9271B,
All components on the cache modules are surface mounted
on a multi-layer epoxy laminate (FR-4) substrate. The contact
pins are plated with 150 micro-inches of nickel covered by 30
micro-inches of gold flash.
Logic Block Diagram - CYM9270/CYM9271A
A[15:0]
(2) 64K x 18 SRAM’S
A15:0
WE
SGW
D[0:31]
OE0
OE[0:1]
CS[0:1]
BW[0:3]
D[0:15]
DQ[0:1]
OE
CS
CS0
DQ[0:3]
BWE
WEH
WEL
ADSP
CLK[0:3]
ADSC
CLK
Bank 0
CLK[0:1]
(2) 64K x 18 SRAM’S
A15:0
SGW
OE
OE1
CS1
D[0:15]
DQ[0:1]
CS
BWE
WEH
WEL
ADSC
CLK
Bank 1
PD
1
PD
0
CLK[2:3]
GND NC
NC GND
Bank 0
64Kx36
Bank 0 and Bank 1
128KX36
9270/71A
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
August 15, 1997