COMCHIP
Surface Mount Zener Diode
www.comchiptech.com
CZRM27C3V6P THRU C200P
Features
Power Dissipation 0.8Watts
Low profile surface-mount package
MINI-SMA
Zener and surge current specification
Low leakage current
Excellent stability
(
0.161 4.1)
(
0.146 3.7)
(
0.012 0.3)Typ.
(
0.071 1.8)
(
)
0.055 1.4
Mechanical Data
Case: Molded plastic MINI-SMA
(2.8
(2.4
0.110
0.094
)
)
Epoxy: UL 94V-0 rate flame retardant
Solderable per MIL-STD-202,
method 208 guaranteed
(
0.063 1.6)
(
)
0.055 1.4
Polarity: cathode band
(
0.035 0.9)Typ.
(
0.035 0.9)Typ.
Mounting position: Any
Weight: 0.04gram(approx.)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
o
Rating at 25
C ambient temperature unless otherwise specified.
Parameter
VALUE
Units
V
Forward voltage
IF=0.2A
1.2
Power Dissipation
TA=25oC
TL=80oC
( Note )
0.8
2.3
W
W
Non-repetitive peak pulse
power dissipation
TJ=25oC
100us square pulse
300
150
100
Non-repetitive peak pulse
power dissipation
TJ=25oC
10/1000us waveform
W
W
(CZRM27C7V5P to C100P)
Non-repetitive peak pulse
TJ=25oC
power dissipation 10/1000us waveform
(CZRM27C110P to C200P)
Thermal resistance junction to lead
ambient ( Note )
30
KW
oC
180
Operating junction and Storage Temperature
Range
150 / -55 to +150
NOTES : Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads ( 40um thick)
MDS0310010B
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