找货询价

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

QQ咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

技术支持

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

售后咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

CYM9288APZ-60C

型号:

CYM9288APZ-60C

描述:

X72可选的突发模式SRAM模块\n[ x72 Selectable Burst Mode SRAM Module ]

品牌:

ETC[ ETC ]

页数:

10 页

PDF大小:

229 K

1CYM9287  
CYM9288/CYM9289  
512K/1M x 72 Flowthrough NoBL SRAM Module  
epoxy laminate board with pins. The modules are designed to  
be incorporated into large memory arrays.  
Features  
• Operates at 66 MHz  
• Uses 256K/512K x 18 high performance Flowthrough  
NoBL synchronous SRAMs  
• 3.3V data inputs/outputs  
Modules are configured as either one or two banks, where  
each bank has separate chip select controls. Separate clocks  
are provided for every pair of SRAMs.  
Multiple ground pins and on-board decoupling capacitors en-  
sure high performance with maximum noise immunity.  
Functional Description  
The CYM9288/9289 are high-performance synchronous  
Flowthrough NoBL memory modules organized as 512K/1M  
by 72 bits. These modules are constructed from 256K/512K x  
18 NoBL SRAM’s in plastic surface mount packages on an  
All components on the cache modules are surface mounted on  
a multi-layer epoxy laminate (FR-4) substrate. The contact  
pins are plated with 200 micro-inches (minimum) of 90/10  
tin/lead over 50 micro-inches of nickel.  
LogicBlockDiagram- CYM9288/9289  
A[17:0]  
BWE[7:0]  
ADV/LD  
OE  
D[15:0]  
DP[1:0]  
A
17:0  
ADV/LD  
OE  
OE  
D[63:0]  
DP[7:0]  
CE[0:1]  
CE0  
CS  
BW[0]  
BW[1]  
WE  
BANK 0  
WE  
CLK  
MODE  
CLK[0:3]  
D[15:0]  
DP[1:0]  
A
17:0  
ADV/LD  
OE  
OE  
CE1  
CS  
BW[0]  
PD  
PD  
1
0
BW[1]  
9288  
9289  
NC  
GND  
BANK 0 & 1  
BANK 0 & 1  
NC  
GND  
BANK 1  
CLK  
WE  
9288/9289  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
May 7, 2001  
CYM9288/CYM9289  
Selection Guide  
NoBL Synchronous Module  
CYM9288-66 CYM9289-60  
512 K x 72 1M x 72  
Part Number  
Cache Size  
CYM9288-60  
512 K x 72  
CYM9289-66  
1M x 72  
SRAMs Used  
8 of 256K x 18  
8 of 256K x 18  
66  
8 of 512K x 18  
8 of 512K x 18  
66  
System Clock (MHz)  
Data tCDV  
60  
60  
12 ns  
10.5 ns  
12 ns  
10.5 ns  
2
CYM9288/CYM9289  
Pin Configuration  
Dual Read-Out ZIP  
Top View  
GND  
D63  
GND  
DP7  
D61  
GND  
D59  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
85  
86  
D62  
87  
88  
89  
90  
91  
92  
93  
94  
95  
96  
Vcc3  
D60  
D58  
GND  
D56  
D55  
GND  
D53  
D51  
GND  
D49  
D57  
GND  
DP6  
D54  
Vcc3  
D52  
D50  
GND  
D48  
D47  
GND  
D45  
D43  
GND  
D41  
DP4  
97  
98  
DP5  
Vcc3  
99  
100  
101  
102  
103  
104  
105  
106  
D46  
D44  
GND  
D42  
D40  
GND  
D39  
D37  
GND  
D35  
D33  
GND  
CLK3  
GND  
DP3  
D30  
Vcc3  
D28  
D26  
GND  
D24  
D23  
Vcc3  
D38  
107  
108  
109  
110  
111  
112  
113  
114  
115  
116  
117  
118  
119  
120  
121  
122  
123  
124  
D36  
GND  
D34  
D32  
GND  
CLK2  
GND  
D31  
D29  
GND  
D27  
D25  
GND  
DP2  
D22  
37  
38  
39  
40  
GND  
D21  
Vcc3  
D20  
D19  
GND  
D17  
DP1  
Vcc3  
D14  
D12  
GND  
D10  
D8  
GND  
D7  
D5  
D18  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
125  
126  
127  
128  
129  
130  
131  
132  
133  
134  
135  
136  
137  
138  
139  
140  
141  
142  
143  
144  
145  
146  
147  
148  
149  
150  
151  
152  
153  
154  
155  
156  
157  
158  
159  
GND  
D16  
D15  
GND  
D13  
D11  
GND  
D9  
DP0  
Vcc3  
D6  
D4  
GND  
D2  
GND  
D3  
D1  
D0  
PD0  
MODE  
A18  
A20  
A16  
A14  
GND  
A12  
A10  
GND  
A8  
A6  
Vcc3  
A4  
A2  
A0  
PD1  
A19  
A17  
GND  
A15  
A13  
Vcc3  
A11  
A9  
GND  
A7  
67  
A5  
68  
69  
70  
71  
72  
73  
74  
75  
75  
77  
78  
79  
80  
81  
82  
GND  
A3  
A1  
ADV/LD  
GND  
CLK0  
GND  
GND  
CLK1  
GND  
160  
BWE6  
BWE7  
161  
BWE4  
BWE5  
162  
GND  
GND  
163  
164  
165  
166  
167  
168  
BWE2  
BWE3  
BWE0  
BWE1  
Vcc3  
GND  
OE  
CE0  
GND  
WE  
83  
84  
9288/9289  
CE1  
GND  
3
CYM9288/CYM9289  
Pin Definitions  
Signal  
Description  
VCC3  
3.3V supply  
GND  
Ground  
A[20:0]  
OE  
Addresses from processor  
Output Enable  
WE  
Write Enable  
BWE[7:0]  
CS[1:0]  
PD0–PD1  
D[63:0]  
DP[7:0]  
CLK[0:3]  
ADV/LD  
Mode  
Byte Write Enables  
Chip Select for the two banks  
Presence Detect output pins  
Data lines from processor  
Data Parity lines from processor  
Clock lines to the module  
Advance Load Signal from processor  
Mode pin for Burst Selection  
Signal not connected on module  
Reserved  
NC  
RSVD  
Presence Detect Pins  
PD1  
NC  
PD0  
NC  
CYM9288 - 512K x 72  
CYM9289 - 1M x 72  
GND  
GND  
4
CYM9288/CYM9289  
DC Input Voltage –0.5V to +4.6V  
Maximum Ratings  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Output Current into Outputs (LOW)20 mA  
Storage Temperature –55°C to +125°C  
Operating Range  
Ambient Temperature  
with Power Applied 0°C to +70°C  
Ambient  
Temperature  
Range  
VCC  
Supply Voltage to Ground Potential –0.5V to +4.5V  
Commercial  
0°C to +70°C  
3.3V ± 5%  
DC Voltage Applied to Outputs  
in High Z State –0.5V to +4.6V  
Electrical Characteristics Over the Operating Range  
Parameter  
VIH  
Description  
Input HIGH Voltage  
Input LOW Voltage  
Output HIGH Voltage  
Output LOW Voltage  
Test Condition  
Min.  
2.2  
Max.  
Unit  
V
VCC + 0.3  
0.8  
VIL  
–0.3  
2.4  
V
VOH  
VCC = Min. IOH = 4 mA  
VCC = Min. IOL = 8 mA  
V
VOL  
0.4  
V
ICC (9288)  
ICC (9289)  
VCC Operating Supply Current VCC = Max., IOUT = 0 mA, f = fMAX = 1/tRC  
VCC Operating Supply Current VCC = Max., IOUT = 0 mA, f = fMAX = 1/tRC  
2400  
2400  
mA  
mA  
Capacitance[1]  
Parameter  
Description  
Test Conditions  
Max.  
Unit  
CA  
Address Input Capacitance  
Control Input Capacitance  
Input/Output Capacitance  
Clock Capacitance  
TA = 25°C, f = 1 MHz,  
48  
pF  
pF  
pF  
pF  
VCC = 3.3V  
CI  
TA = 25°C, f = 1 MHz,  
VCC = 3.3V  
48  
16  
12  
CO  
TA = 25°C, f = 1 MHz,  
VCC = 3.3V  
CCLK  
TA = 25°C, f = 1 MHz,  
VCC = 3.3V  
Note:  
1. Tested initially and after any design or process changes that may affect these parameters.  
.................................................................  
AC Test Loads and Waveforms  
R=317  
3.3V  
OUTPUT  
OUTPUT  
ALL INPUT PULSES  
Z =50Ω  
0
3.0V  
R =50Ω  
L
5 pF  
R=351Ω  
GND  
V = 1.5V  
L
INCLUDING  
JIG AND  
SCOPE  
(a)  
(b)  
5
CYM9288/CYM9289  
Switching Characteristics Over the Operating Range[2]  
60  
66  
Parameter  
Clock  
Description  
Min.  
Max.  
Min.  
Max.  
Unit  
tCYC  
Clock Cycle Time  
16.6  
15.0  
ns  
MHz  
ns  
FMAX  
tCH  
Maximum Operating Frequency  
Clock HIGH  
60  
66  
6.0  
6.0  
5.0  
5.0  
tCL  
Clock LOW  
ns  
Output Times  
tCDV  
Data Output Valid After CLK Rise  
OE LOW to Output Valid[3, 5]  
Data Output Hold After CLK Rise  
Clock to High-Z[3, 4, 5]  
12  
6
10.5  
6
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tEOV  
tDOH  
1.5  
3.0  
0
1.5  
2.0  
0
tCHZ  
5.0  
6.0  
5.0  
6.0  
tCLZ  
Clock to Low-Z[3, 4, 5]  
tEOHZ  
tEOLZ  
Setup Times  
tAS  
OE HIGH to Output High-Z[3, 4, 5]  
OE LOW to Output Low-Z[3, 4, 5]  
Address Set-Up Before CLK Rise  
Data Input Set-Up Before CLK Rise  
WE, BWE[7:0] Set-Up Before CLK Rise  
ADV/LD Set-Up Before CLK Rise  
Chip Selects Set-Up  
2.5  
2.5  
2.5  
2.5  
2.5  
2.0  
2.0  
2.0  
2.0  
2.0  
ns  
ns  
ns  
ns  
ns  
tDS  
tWES  
tALS  
tCES  
Hold Times  
tAH  
Address Hold After CLK Rise  
Data Input Hold After CLK Rise  
WE, BWE[7:0] Hold After CLK Rise  
ADV/LD Hold after CLK Rise  
Chip Selects Hold After CLK Rise  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
ns  
ns  
ns  
ns  
ns  
tDH  
tWEH  
tALH  
tCEH  
Notes:  
2. AC test conditions assume signal transition time of 2 ns or less, timing reference levels, input pulse levels and output loading shown in part (a) of AC Test  
Load for 3.3V devices and (c) for 2.5V devices. .  
3.  
t
CHZ, tCLZ, tOEV, tEOLZ, and tEOHZ are specified with AC test conditions shown in part (a) of AC Test Loads. Transition is measured ± 200 mV from steady-state  
voltage.  
4. At any given voltage and temperature, tEOHZ is less than tEOLZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same  
data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed  
to achieve High-Z prior to Low-Z under the same system conditions.  
5. This parameter is sampled and not 100% tested.  
6
CYM9288/CYM9289  
Switching Waveforms  
Read/Write/Deselect Timing  
CLK[0:3]  
tCENH  
tCENH  
tCENS  
tCENS  
tCL  
tCH  
tCYC  
CEN  
tAS  
WA2  
WA5  
RA1  
RA3  
RA4  
RA6  
RA7  
ADDRESS  
tAH  
WE &  
BWE[7:0]  
tWS  
tWH  
tCES  
tCEH  
CE[0:1]  
tDOH  
tCHZ  
tDOH  
tCLZ  
tCHZ  
Q6  
Out  
Q4  
Out  
D5  
In  
Data-  
In/Out  
D2  
In  
Q7  
Out  
Q3  
Q1  
Out  
Out  
Device  
tCDV  
originally  
deselected  
WE is the combination of WE & BWEx to define a write cycle (see Write Cycle Description table).  
RAx stands for Read Address X, WAx stands for  
Write Address X, Dx stands for Data-in X, Qx stands for Data-out X.  
= UNDEFINED  
= DON’T CARE  
7
CYM9288/CYM9289  
Switching Waveforms (continued)  
Read/Write/Deselect Timing  
Burst Sequences  
CLK[0:3]  
tALH  
tALS  
ADV/LD  
tCL  
tCH  
tCYC  
tAH  
tAS  
RA1  
WA2  
ADDRESS  
WE  
RA3  
tWS  
tWH  
tWS  
tWH  
BWE[7:0]  
tCES  
tCEH  
CE[1:0]  
tCLZ  
tCHZ  
tDH  
tDOH  
tCLZ  
Q3  
Out  
Q1  
Q1+2  
Out  
Q1+3  
Out  
D2  
In  
D2+2  
In  
D2+3  
In  
Data-  
In/Out  
Q1+1  
Out  
D2+1  
In  
Q1+1  
Out  
Out  
tCDV  
t
tDS  
DeviceCDV  
originally deselected  
The combination of WE & BWE[7:0] define a write cycle.  
RAx stands for Read Address X, WAx stands for  
Write Address X, Dx stands for Data-in for location X, Qx stands for Data-out for location X. CEN held  
LOW. During burst writes, byte writes can be conducted by asserting the appropriate BWE[7:0] input signals.  
Burst order determined by the state of the Mode input. CEN held LOW. OE held LOW.  
= UNDEFINED  
= DON’T CARE  
8
CYM9288/CYM9289  
Switching Waveforms (continued)  
OE Timing  
OE  
tEOV  
tEOHZ  
Three-state  
I/O’s  
tEOLZ  
Ordering Information  
Speed  
(MHz)  
Package  
Name  
Operating  
Ordering Code  
CYM9288APZ-60C  
CYM9288APZ-66C  
CYM9289BPZ-60C  
CYM9289BPZ-66C  
Package Type  
Description  
Range  
60  
66  
60  
66  
PZ12  
168-Pin Quad-Row ZIP  
Flowthrough NoBL 512K x 72  
Flowthrough NoBL 512K x 72  
Flowthrough NoBL 1M x 72  
Flowthrough NoBL 1M x 72  
Commercial  
PZ12  
168-Pin Quad-Row ZIP  
Commercial  
Document #: 38-M-00092-**  
9
CYM9288/CYM9289  
Package Diagrams  
PZ12: 168 Pin Quad Row ZIP Module  
© Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize  
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.  
厂商 型号 描述 页数 下载

MERRIMAC

CYM-13R-9G 定向耦合器[ DIRECTIONAL COUPLER ] 2 页

SUMIDA

CYM-2B 滤波线圈\u003c SMD型: CYM系列\u003e[ Filter Coils < SMD Type: CYM Series> ] 2 页

ETC

CYM1220HD-10C X4 SRAM模块\n[ x4 SRAM Module ] 5 页

ETC

CYM1220HD-12C X4 SRAM模块\n[ x4 SRAM Module ] 5 页

ETC

CYM1220HD-12MB X4 SRAM模块\n[ x4 SRAM Module ] 5 页

ETC

CYM1220HD-15C X4 SRAM模块\n[ x4 SRAM Module ] 5 页

ETC

CYM1220HD-15MB X4 SRAM模块\n[ x4 SRAM Module ] 5 页

ETC

CYM1220HD-20MB X4 SRAM模块\n[ x4 SRAM Module ] 5 页

CYPRESS

CYM1240HD-25C [ SRAM Module, 256KX4, 25ns, CMOS, CDIP28, HERMETIC SEALED, MODULE, DIP-28 ] 1 页

CYPRESS

CYM1240HD-25MB [ SRAM Module, 256KX4, 25ns, CMOS, CDIP28, HERMETIC SEALED, MODULE, DIP-28 ] 1 页

PDF索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

IC型号索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

Copyright 2024 gkzhan.com Al Rights Reserved 京ICP备06008810号-21 京

0.181809s