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HYS64T32000GU-3.7-A

型号:

HYS64T32000GU-3.7-A

品牌:

INFINEON[ Infineon ]

页数:

25 页

PDF大小:

447 K

Data Sheet, V0.84, Jan. 2004  
HYS64T32000GU (256 MByte)  
HYS64T64000GU (512 MByte)  
HYS72T64000GU (512 MByte ECC)  
HYS64T128020GU (1 GByte)  
HYS72T128020GU (1 GByte ECC)  
DDR2 Unbuffered DIMM Modules  
Memory Products  
N e v e r s t o p t h i n k i n g .  
HYS64T32000GU  
HYS64T64000GU, HYS72T64000GU  
HYS64T128020GU, HYS72T128020GU  
Preliminary Datasheet Rev. 0.84 (1.04)  
1.8 V 240-pin Unbuffered DDR2 SDRAM Modules  
256 MByte, 512 MByte & 1 GByte ECC and non-ECC Modules  
PC2-3200U /-4300U /-5400U  
240-pin ECC and Non-ECC Unbuffered 8-  
Byte Dual-In-Line DDR2 SDRAM Module for  
PC, Workstation and Server main memory  
applications  
Programmable CAS Latencies (3, 4 & 5),  
Burst Length (8 & 4) and Burst Type  
Auto Refresh (CBR) and Self Refresh  
All inputs and outputs SSTL_1.8 compatible  
One rank 32M x 64, 32M x 72, 64M x 64, 64M  
x 72 and two ranks 128M × 64 and 128M x 72  
organization  
OCD (Off-Chip Driver Impedance  
Adjustment) and ODT (On-Die Termination)  
JEDEC standard Double Data Rate 2  
Synchronous DRAMs (DDR2 SDRAM) with a  
single + 1.8 V (± 0.1 V) power supply  
Serial Presence Detect with E2PROM  
Low Profile Modules form factor:  
133.35 mm x 30,00 mm (MO-237)  
Built with 512Mb DDR2 SDRAMs in 60-ball /  
84-ball FBGA chipsize packages  
Based on JEDEC standard reference card  
layouts Raw Card “A”, “B” & “C”  
Performance:  
Speed Grade Indicator  
-5  
-3.7  
DDR2-533  
PC2-4300  
200  
-3  
DDR2-667  
PC2-5400  
200  
Unit  
Component Speed Grade  
DDR2-400  
PC2-3200  
200  
Module Speed Grade  
Max. Clock Frequency @ CL = 3  
Max. Clock Frequency @ CL = 4 & 5  
MHz  
MHz  
200  
266  
333  
1.0 Introduction  
The INFINEON HYS64/72Txxxx0GU module family are low profile Unbuffered DIMM modules with  
30,0 mm height based on DDR2 technology. DIMMs are available as non-ECC modules in  
32M x 64 (256MB), 64M x 64 (512MB) and 128M x 64 (1024MB) and as ECC-modules in 32M x 72  
(256MB), 64M x 72 (512MB) and 128M x 72 (1024MB) organisation and density, intended for  
mounting into 240 pin connector sockets.  
The memory array is designed with 512Mb Double Data Rate (DDR2) Synchronous DRAMs for  
ECC and Non-ECC applications. Decoupling capacitors are mounted on the PCB board. The  
DIMMs feature serial presence detect based on a serial E2PROM device using the 2-pin I2C  
protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes are  
available to the customer.  
INFINEON Technologies  
Rainer.Weidlich@Infineon.com  
2
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
1.1 Ordering Information  
Type & Partnumber  
Compliance Code  
Description  
ECC/  
SDRAM  
Non-ECC Technology  
PC2-3200:  
HYS64T32000GU-5-A  
HYS64T64000GU-5-A  
HYS72T64000GU-5-A  
HYS64T128020GU-5-A  
HYS72T128020GU-5-A  
PC2-4300:  
PC2-3200U-33310-C one rank 256 MB Unb. DIMM Non-ECC 512 Mbit (x16)  
PC2-3200U-33310-A one rank 512 MB Unb.DIMM Non-ECC 512 Mbit (x8)  
PC2-3200U-33310-A one rank 512 MB Unb.DIMM  
PC2-3200U-33310-B two ranks 1 GB Unb. DIMM  
PC2-3200U-33310-B two ranks 1 GB Unb. DIMM  
ECC  
Non-ECC 512 Mbit (x8)  
ECC 512 Mbit (x8)  
512 Mbit (x8)  
HYS64T32000GU-3.7-A PC2-4300U-44410-C one rank 256 MB Unb. DIMM Non-ECC 512 Mbit (x16)  
HYS64T64000GU-3.7-A PC2-4300U-44410-A one rank 512 MB Unb.DIMM Non-ECC 512 Mbit (x8)  
HYS72T64000GU-3.7-A PC2-4300U-44410-A one rank 512 MB Unb.DIMM  
HYS64T128020GU-3.7-A PC2-4300U-44410-B two ranks 1 GB Unb. DIMM  
HYS72T128020GU-3.7-A PC2-4300U-44410-B two ranks 1 GB Unb. DIMM  
PC2-5400:  
ECC  
Non-ECC 512 Mbit (x8)  
ECC 512 Mbit (x8)  
512 Mbit (x8)  
HYS64T32000GU-3-A  
HYS64T64000GU-3-A  
HYS72T64000GU-3-A  
HYS64T128020GU-3-A  
HYS72T128020GU-3-A  
Notes:  
PC2-5400U-44410-C one rank 256 MB Unb. DIMM Non-ECC 512 Mbit (x16)  
PC2-5400U-44410-A one rank 512 MB Unb.DIMM Non-ECC 512 Mbit (x8)  
PC2-5400U-44410-A one rank 512 MB Unb.DIMM  
PC2-5400U-44410-B two ranks 1 GB Unb. DIMM  
PC2-5400U-44410-B two ranks 1 GB Unb. DIMM  
ECC  
Non-ECC 512 Mbit (x8)  
ECC 512 Mbit (x8)  
512 Mbit (x8)  
1. All part numbers end with a place code, designating the silicon die revision. Example: HYS 72T64000GU-5-A, indicating  
Rev. A dies are used for DDR2 SDRAM components. For all INFINEON DDR2 module and component nomenclature see  
section 8 of this datasheet.  
2. The Compliance Code is printed on the module label and describes the speed grade, f.e. “PC2-4300U-44410-C”, where  
4300U means Unbuffered DIMM modules with 4.26 GB/sec Module Bandwidth and “44410” means CAS latency = 4, trcd  
latency = 4 and trp latency = 4 using the latest JEDEC SPD Revision 1.0 and produced on the Raw Card “C”.  
1.2 Address Format  
Part Number  
DIMM  
Module  
Memory  
Ranks  
ECC/  
# of  
# of row/bank/  
Raw  
Card  
Density Organization  
Non-ECC SDRAMs columns bits  
HYS64T32000GU  
HYS64T64000GU  
HYS72T64000GU  
256 MB  
512 MB  
512 MB  
32M x 64  
64M × 64  
64M × 72  
1
1
1
2
2
Non-ECC  
Non-ECC  
ECC  
4
8
13/2/10  
14/2/10  
14/2/10  
14/2/10  
14/2/10  
C
A
A
B
B
9
HYS64T128020GU 1024 MB 2 x 64M × 64  
HYS72T128020GU 1024 MB 2 x 64M × 72  
Non-ECC  
ECC  
16  
18  
INFINEON Technologies  
3
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
1.3 Components on Modules and RawCard  
DIMM  
Density  
DRAM components  
reference datasheet  
DRAM Density  
DRAM Organisation  
Raw  
Card  
256 MB  
512 MB  
1024 MB  
HYB18T512160AC  
HYB18T512800AC  
HYB18T512800AC  
512 Mbit  
512 Mbit  
512 Mbit  
32Mb x 16  
64Mb x 8  
64Mb x 8  
C
A
B
For a detailed description of all functionalities of the DRAM components on these modules see the  
referenced component datasheet  
1.4 Pin Definition and Function  
Pin Name  
A[13:0]  
Description  
Row Address Inputs 4)  
Column Address Inputs  
Pin Name  
CB[7:0]  
Description  
DIMM ECC Check Bits 2)  
A[9:0]  
DQS[8:0]  
SDRAM data strobes 2)  
(positive line of differential pair)  
A10/AP  
Column Address Input for Auto-  
Precharge  
DQS[8:0]  
SDRAM data strobes 2)  
(negative line of differential pair)  
BA[1:0]  
CK[2:0]  
SDRAM Bank Selects  
DM[8:0]  
SCL  
SDRAM data mask 2)  
Serial bus clock  
Clock input  
(positive line of differential pair)  
CK[2:0]  
Clock input  
(negative line of differential pair)  
SDA  
Serial bus data line  
RAS  
Row Address Strobe  
Column Address Strobe  
Read/Write Input  
Chip Select 3)  
SA[2:0]  
VDD  
slave address select  
Power (+ 1.8 V)  
I/O reference supply  
Ground  
CAS  
WE  
VREF  
CS[1:0]  
CKE[1:0]  
ODT[1:0]  
DQ[63:0]  
VSS  
Clock Enable 3)  
VDDSPD  
EEPROM power supply  
no connect  
Active termination control lines 1) 3) NC  
Data Input/Output  
1) Active termination only applies to DQ, DQS, DQS and DM signals  
2) CB[7:0], DQS8, DQS8 and DM8 are used on ECC modules only and are not connected to components on Non-ECC modules  
3) CS1, ODT1 and CKE1 are used on dual rank modules only  
4) A13 is not used on memory modules based on x16 organised memory components  
INFINEON Technologies  
4
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
1.5 Pin Configuration  
Symbol  
VREF  
VSS  
PIN#  
121  
122  
123  
124  
125  
126  
127  
128  
129  
130  
131  
132  
133  
134  
135  
136  
137  
138  
139  
140  
141  
142  
143  
144  
145  
146  
147  
148  
149  
150  
151  
152  
153  
154  
155  
156  
157  
158  
159  
160  
161  
162  
Symbol  
VSS  
PIN#  
61  
Symbol  
A4  
PIN#  
181  
182  
183  
184  
Symbol  
VDDQ  
A3  
PIN#  
1
2
DQ4  
62  
VDDQ  
A2  
3
DQ0  
DQ5  
63  
A1  
4
DQ1  
VSS  
64  
VDD  
VDD  
KEY  
CK0  
5
VSS  
DM0  
KEY  
6
DQS0  
DQS0  
VSS  
DQS9  
VSS  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
84  
85  
86  
87  
88  
89  
90  
91  
92  
93  
94  
95  
96  
97  
98  
99  
100  
101  
VSS  
185  
186  
187  
188  
189  
190  
191  
192  
193  
194  
195  
196  
197  
198  
199  
200  
201  
202  
203  
204  
205  
206  
207  
208  
209  
210  
211  
212  
213  
214  
215  
216  
217  
218  
219  
220  
221  
7
VSS  
CK0  
8
DQ6  
VDD  
VDD  
A0  
9
DQ2  
DQ7  
NC  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
DQ3  
VSS  
VDD  
VDD  
BA1  
VSS  
DQ12  
DQ13  
VSS  
A10/AP  
BA0  
DQ8  
VDDQ  
RAS  
CS0  
DQ9  
VDDQ  
WE  
VSS  
DM1  
DQS1  
DQS1  
VSS  
NC  
CAS  
VDDQ  
ODT0  
A13 / NC 3)  
VDD  
VSS  
VSS  
VDDQ  
CS1  
CK1  
NC  
CK1  
ODT1  
VDDQ  
VSS  
NC  
VSS  
VSS  
DQ14  
DQ15  
VSS  
DQ36  
DQ37  
VSS  
DQ10  
DQ11  
VSS  
DQ32  
DQ33  
VSS  
DQ20  
DQ21  
VSS  
DM4  
NC  
DQ16  
DQ17  
VSS  
DQS4  
DQS4  
VSS  
VSS  
DM2  
DQ38  
DQ39  
VSS  
DQS2  
DQS2  
VSS  
NC  
DQ34  
DQ35  
VSS  
VSS  
DQ22  
DQ23  
VSS  
DQ44  
DQ45  
VSS  
DQ18  
DQ19  
VSS  
DQ40  
DQ41  
VSS  
DQ28  
DQ29  
VSS  
DM5  
NC  
DQ24  
DQ25  
VSS  
DQS5  
DQS5  
VSS  
VSS  
DM3  
DQ46  
DQ47  
VSS  
DQS3  
DQS3  
VSS  
NC  
DQ42  
DQ43  
VSS  
VSS  
DQ30  
DQ31  
VSS  
CB4 / NC 2)  
CB5 / NC 2)  
DQ52  
DQ53  
VSS  
DQ26  
DQ27  
VSS  
DQ48  
DQ49  
VSS  
CK2  
CB0 / NC 2)  
SA2  
CK2  
INFINEON Technologies  
5
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
Pin Configuration (cont’d)  
Symbol  
CB1 / NC 2)  
PIN#  
Symbol  
PIN#  
Symbol  
PIN#  
Symbol  
PIN#  
43  
163  
164  
165  
166  
167  
168  
169  
170  
171  
172  
173  
174  
175  
176  
177  
178  
179  
180  
VSS  
102  
103  
104  
105  
106  
107  
108  
109  
110  
111  
112  
113  
114  
115  
116  
117  
118  
119  
120  
NC  
222  
223  
224  
225  
226  
227  
228  
229  
230  
231  
232  
233  
234  
235  
236  
237  
238  
239  
240  
VSS  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
VSS  
DM8  
VSS  
DM6  
NC  
DQS8  
DQS8  
VSS  
CB2 / NC 2)  
CB3 / NC 2)  
VSS  
NC  
DQS6  
DQS6  
VSS  
VSS  
VSS  
CB6 / NC 2)  
CB7 / NC 2)  
VSS  
DQ54  
DQ55  
VSS  
DQ50  
DQ51  
VSS  
VDDQ  
CKE1  
VDD  
NC, (A15)1)  
NC, (A14)1)  
VDDQ  
A12  
DQ60  
DQ61  
VSS  
VDDQ  
CKE0  
VDD  
DQ56  
DQ57  
VSS  
DM7  
NC  
NC, (BA2)1)  
DQS7  
NC  
NC  
VSS  
VDDQ  
A11  
VSS  
DQ62  
DQ63  
VSS  
A9  
DQ58  
DQ59  
VSS  
A7  
VDD  
VDD  
A8  
VDDSPD  
SA0  
A5  
A6  
SDA  
SCL  
SA1  
1) Pins 54, 173 and 174 are not connected on this modules and are reserved for future DIMM module products  
based on higher density memory components.  
2) These pins are the check bit DQ’s for ECC unbuffered DIMMs and no-connects for Non-ECC DIMMs  
3) Address A13 is not used on memory modules based on x 16 components  
1.6 Pin Locations  
Front  
120  
240  
pin  
1
64  
65  
pin 121  
185  
184  
Backside  
240 pin Modules (MO-237)  
INFINEON Technologies  
6
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
1.7 Unbuffered DIMM Input/Output Functional Description  
Type Polarity  
Input Cross point  
Input Active High  
Function  
Symbol  
CK[2:0],  
CK[2:0]  
The system clock inputs. All address and command lines are sampled on the cross point of  
the rising edge of CK and the falling edge of CK.  
Activates the SDRAM clock signals when high and deactivates when low. By deactivating the  
clocks, CKE low initiates the Power Down Mode or the Self Refresh Mode  
Enables the associated SDRAM command decoder when low and disables decoder when  
high. When decoder is disabled, new commands are ignored and previous operations con-  
tinue. This signal provides for external rank selection on systems with multiple ranks.  
CKE[1:0]  
CS[1:0]  
Active Low  
Input  
When high, termination resistance is enabled for all DQ, DQS and DM pins, assuming this  
Input Active High  
Input Active Low  
ODT[1:0]  
function is enabled in the Extended mode Register Set (EMRS).  
RAS, CAS,  
WE  
When sampled at the positive edge of the clock, RAS, CAS and WE define the operation to  
be executed by the SDRAM.  
DM is an input mask signal for write data. Input data is masked when DM is sampled high  
DM[8:0]  
BA[1:0]  
Input Active High coincident with that input data during a write access. DM is samples on both edges of DQS.  
Although DM pins are input only, the DM loading matches the DQ and DQS loading.  
Input  
-
Selects which internal SDRAM memory bank is activated  
During Bank Activate command cycle, Address defines the row address. During a Read or  
Write command cycle, Address defines the column address. In addition to the column  
address, A10(=AP) is used to invoke Auto-Precharge operation at the end of the burst read  
or write cycle. If AP is high, Auto Precharge is selected and BA[1:0] defines the bank to be  
precharged. If AP is low, Auto-Precharge is disabled. During a Precharge command cycle,  
AP is used in conjunction with BA[1:0] to control which bank(s) to precharge. If AP is high, all  
banks will be precharged regardless of the state of BA[1:0]. If AP is low, BA[1:0] are used to  
define which bank to precharge.  
A[13:0]  
Input  
-
DQ[63:0],  
CB[7:0]  
I/O  
I/O  
-
Data and Check Bit Input /Output pins.  
The data strobes, associated with one data byte, source with data transfer. In Write mode,  
the data strobe is sourced by the controller and is centered in the data window. In Read  
mode the data strobe is sources by the DDR2 SDRAM and is sent at the leading edge of the  
data window. DQS signals are complements, and timing is relative to the crosspoint of  
respective DQS and DQS. If the module is to be operated in single ended strobe mode, all  
DQS signals must be tied on the system board to VSS and DDR2 SDRAM mode registers  
programmed appropriately.  
DQS[8:0],  
DQS[8:0]  
Cross point  
These signals are tied at the system planar to either VSS or VDDSPD to configure the serial  
SPD EEPROM address range  
This bidirectional pin is used to transfer data into and out of the SPD EEPROM. A resistor  
maybe connected from the SDA bus line to VDDSPD on the system level to act as a pull-up.  
This signal is used to clock data into the SPD EEPROM. A resistor maybe connected from  
the SCL bus line to VDDSPD on the system planar to act as a pull-up.  
Input  
I/O  
-
-
-
SA[2:0]  
SDA  
Input  
SCL  
Supply  
Supply  
Supply  
-
-
-
Isolated power supply for the SDRAM output buffers to provide improved noise immunity.  
Power and ground for the DDR SDRAM input buffers and core logic.  
Reference voltage for the SSTL-18 inputs.  
VDDQ  
V
DD, VSS  
VREF  
Serial EEPROM positive power supply, wired to a separated power pin at the connector  
which supports from 1.7 Volt to 3.6 Volt.  
Supply  
-
VDDSPD  
Note: CS1, ODT1 and CKE1 are used on dual rank modules only.  
INFINEON Technologies  
7
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
2.0 Block Diagrams  
2.2 One Rank 32M x 64 (256 MByte) DDR2 SDRAM DIMM Modules (x16 components.)  
HYS64T32000GU on Raw Card C  
CS0  
CS  
CS  
LDQS  
LDQS  
LDM  
DQS4  
DQS4  
DM4  
LDQS  
LDQS  
LDM  
DQS0  
DQS0  
DM0  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
UDQS  
UDM  
DQ32  
DQ33  
DQ34  
DQ35  
DQ36  
DQ37  
DQ38  
DQ39  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
D0  
D2  
DQS1  
DQS5  
UDQS  
UDM  
DQS1  
DQS5  
DM1  
DM5  
DQ40  
DQ41  
DQ42  
DQ43  
DQ44  
DQ45  
DQ46  
DQ47  
DQ8  
I/O 8  
I/O 8  
DQ9  
I/O 9  
I/O 9  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
I/O 10  
I/O 11  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/0 14  
I/O 15  
I/  
O 12  
I/O 13  
I/0 14  
I/O 15  
CS  
CS  
LDQS  
LDQS  
LDM  
DQS6  
DQS6  
DM6  
LDQS  
LDQS  
LDM  
DQS2  
DQS2  
DM2  
DQ16  
DQ17  
DQ18  
DQ19  
DQ20  
DQ21  
DQ22  
DQ23  
DQ48  
DQ49  
DQ50  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
UDQS  
UDM  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
UDQS  
DQ51  
DQ52  
DQ53  
DQ54  
DQ55  
D1  
D3  
DQS3  
DQS7  
UDQS  
UDM  
DQS3  
DQS7  
DM3  
DM7  
DQ56  
DQ57  
DQ58  
DQ59  
DQ60  
DQ61  
DQ62  
DQ63  
DQ24  
DQ25  
DQ26  
DQ27  
DQ28  
DQ29  
DQ30  
DQ31  
I/O 8  
I/O 8  
I/O 9  
I/O 9  
I/O 10  
I/O 11  
I/O 12  
I/O 13  
I/0 14  
I/O 15  
I/O 10  
I/O 11  
I/  
O 12  
I/O 13  
I/O 14  
I/O 15  
V
EEPROM  
DDSPD  
Clock Wiring  
SDRAMs  
NC  
Serial PD  
Clock Input  
V
V
SDA  
DD, DDQ  
VREF  
D0 - D3  
D0 - D3  
D0 - D3  
CK0, CK0  
CK1, CK1  
CK2, CK2  
SCL  
WP A0  
SA0 SA1 SA2  
A1 A2  
2
2
SDRAMs  
SDRAMs  
V
SS  
BA0, BA1  
BA0, BA1 : SDRAMs D0 - D3  
A0 - A12 : SDRAMs D0 - D3  
DQ-to-I/O wiring may be changed within a byte  
A0 - A12  
RAS  
DQ/DQS/DQS/DM/CKE/S relationships must be maintained as shown  
DQ/DQS/DQS, adress and control resistors are 22 Ohms +/- 5%  
RAS  
CAS  
WE  
: SDRAMs D0 - D3  
: SDRAMs D0 - D3  
: SDRAMs D0 - D3  
CAS  
WE  
BAx, Ax, RAS,CAS, WE resistors are 10 Ohms +/- 5%  
CKE0  
ODT0  
CKE  
ODT  
: SDRAMs D0 - D3  
: SDRAMs D0 - D3  
INFINEON Technologies  
8
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
Block Diagrams  
2.2 One Rank 64M x 64 / 72 (512 MByte) DDR2 SDRAM DIMM Modules (x8 comp.)  
HYS64T64000GU / HYS72T64000GU on Raw Card A  
CS0  
DQS0  
DQS0  
DM0  
DQS4  
DQS4  
DM4  
DM  
CS DQS DQS  
D4  
DM  
CS DQS DQS  
D0  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
DQ32  
DQ33  
DQ34  
DQ35  
DQ36  
DQ37  
DQ38  
DQ39  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DQS1  
DQS1  
DM1  
DQS5  
DQS5  
DM5  
DM  
CS DQS DQS  
D1  
DM  
CS DQS DQS  
D5  
DQ8  
DQ40  
DQ41  
DQ42  
DQ43  
DQ44  
DQ45  
DQ46  
DQ47  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DQ9  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
DQS2  
DQS2  
DM2  
DQS6  
DQS6  
DM6  
DM  
CS DQS DQS  
D2  
DM  
CS DQS DQS  
D6  
DQ16  
DQ17  
DQ18  
DQ19  
DQ20  
DQ21  
DQ22  
DQ23  
DQ48  
DQ49  
DQ50  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DQ51  
DQ52  
DQ53  
DQ54  
DQ55  
DQS3  
DQS3  
DM3  
DQS7  
DQS7  
DM7  
DM  
CS DQS DQS  
D3  
DM  
CS DQS DQS  
D7  
DQ24  
DQ25  
DQ26  
DQ27  
DQ28  
DQ29  
DQ30  
DQ31  
DQ56  
DQ57  
DQ58  
DQ59  
DQ60  
DQ61  
DQ62  
DQ63  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DQS8  
DQS8  
DM8  
V
EEPROM  
DDSPD  
Serial PD  
DM  
CS DQS DQS  
D8  
CB0  
CB1  
CB2  
CB3  
CB4  
CB5  
CB6  
CB7  
V
V
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DD, DDQ  
VREF  
D0 - D7, D8  
D0 - D7, D8  
SDA  
SCL  
WP A0  
SA0 SA1 SA2  
A1 A2  
V
SS  
D0 - D7, D8  
Clock Wiring  
SDRAMs  
D8 for ECC modules only  
Clock Input  
CK0, CK0  
CK1, CK1  
CK2, CK2  
3
3
3
SDRAMs  
SDRAMs  
SDRAMs  
BA0, BA1  
A0 - A13  
RAS  
CAS  
WE  
CKE0  
ODT0  
BA0, BA1 : SDRAMs D0 - D7, D8  
A0 - A13 : SDRAMs D0 - D7, D8  
RAS  
CAS  
WE  
: SDRAMs D0 - D7, D8  
: SDRAMs D0 - D7, D8  
: SDRAMs D0 - D7, D8  
: SDRAMs D0 - D7, D8  
DQ-to-I/O wiring may be changed within a byte  
DQ/DQS/DQS/DM/CKE/S relationships must be maintained as shown  
CKE  
DQ/DQS/DQS, adress and control resistors are 22 Ohms +/- 5%  
ODT  
: SDRAMs D0 - D7, D8  
BAx, Ax, RAS,CAS, WE resistors are 5.1 Ohms +/- 5%  
INFINEON Technologies  
9
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
Block Diagrams  
2.3 128M x 64/72 (1GByte) two rank DDR2 SDRAM DIMM Modules (x8 comp.)  
HYS64T128020GU / HYS72T128020GU on Raw Card B  
CS1  
CS0  
DQS0  
DQS0  
DM0  
DQS4  
DQS4  
DM4  
DM  
CS DQS DQS  
D4  
DM  
CS DQS DQS  
D13  
DM  
CS DQS DQS  
D0  
DM  
CS DQS DQS  
D9  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
DQ32  
DQ33  
DQ34  
DQ35  
DQ36  
DQ37  
DQ38  
DQ39  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DQS1  
DQS1  
DM1  
DQS5  
DQS5  
DM5  
DM  
CS DQS DQS  
D5  
DM  
CS DQS DQS  
D1  
DM  
CS DQS DQS  
D14  
DM  
CS DQS DQS  
D10  
DQ8  
DQ40  
DQ41  
DQ42  
DQ43  
DQ44  
DQ45  
DQ46  
DQ47  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DQ9  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
DQS2  
DQS2  
DM2  
DQS6  
DQS6  
DM6  
DM  
CS DQS DQS  
D15  
DM  
CS DQS DQS  
D2  
DM  
CS DQS DQS  
D11  
DM  
CS DQS DQS  
D6  
DQ16  
DQ17  
DQ18  
DQ19  
DQ20  
DQ21  
DQ22  
DQ23  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DQ48  
DQ49  
DQ50  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DQ51  
DQ52  
DQ53  
DQ54  
DQ55  
DQS3  
DQS3  
DM3  
DQS7  
DQS7  
DM7  
DM  
CS DQS DQS  
D3  
DM  
DM  
CS DQS DQS  
D7  
CS DQS DQS  
D16  
DM  
CS DQS DQS  
D12  
DQ24  
DQ25  
DQ26  
DQ27  
DQ28  
DQ29  
DQ30  
DQ31  
DQ56  
DQ57  
DQ58  
DQ59  
DQ60  
DQ61  
DQ62  
DQ63  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DQS8  
DQS8  
DM8  
V
EEPROM  
DDSPD  
DM  
CS DQS DQS  
D8  
DM  
CS DQS DQS  
D17  
V
CB0  
CB1  
CB2  
CB3  
CB4  
CB5  
CB6  
CB7  
V
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
I/O 0  
I/O 1  
I/O 2  
I/O 3  
I/O 4  
I/O 5  
I/O 6  
I/O 7  
DD, DDQ  
VREF  
D0 - D17  
D0 - D17  
V
SS  
D0 - D17  
Serial PD  
Clock Wiring  
SDRAMs  
SDA  
Clock Input  
D8 and D17 on ECC modules only  
SCL  
WP A0  
SA0 SA1 SA2  
A1 A2  
BA0, BA1  
A0 - A13  
RAS  
CAS  
WE  
CKE0  
CKE1  
ODT0  
ODT1  
BA0, BA1 : SDRAMs D0 - D17  
A0 - A13 : SDRAMs D0 - D17  
CK0, CK0  
CK1, CK1  
CK2, CK2  
6
6
6
SDRAMs  
SDRAMs  
SDRAMs  
RAS  
CAS  
WE  
CKE  
CKE  
ODT  
ODT  
: SDRAMs D0 - D17  
: SDRAMs D0 - D17  
: SDRAMs D0 - D17  
: SDRAMs D0 - D8  
: SDRAMs D9 - D17  
: SDRAMs D0 - D8  
: SDRAMs D9 - D17  
DQ-to-I/O wiring may be changed within a byte  
DQ/DQS/DQS/DM/CKE/S relationships must be maintained as shown  
DQ/DQS/DQS, adress and control resistors are 22 Ohms +/- 5%  
BAx, Ax, RAS,CAS, WE resistors are 7.5 Ohms +/- 5%  
INFINEON Technologies  
10  
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
3.0 Absolute Maximum Ratings  
Parameter  
Symbol  
Limit Values  
Unit  
min.  
max.  
2.3  
Voltage on any pins relative to VSS  
Voltage on VDD relative to VSS  
Voltage on VDD Q relative to VSS  
Storage temperature range  
VIN, VOUT  
VDD  
– 0.5  
– 1.0  
– 0.5  
-55  
V
V
2.3  
VDDQ  
2.3  
TSTG  
+100  
oC  
Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a  
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reli-  
ability.  
3.1 Operating Temperature Range  
Parameter  
Symbol  
Limit Values  
Unit Notes  
min.  
max.  
DIMM Module Operating Temperature Range (ambient)  
DRAM Component Case Temperature Range  
TOPR  
0
0
+55  
+95  
oC  
TCASE  
oC  
1 - 4  
1. DRAM Component Case Temperature is the surface temperature in the center on the top side of any of the DRAMs. For  
measurement conditions, please refer to the JEDEC document JESD51-2.  
2. Within the DRAM Component Case Temperature range all DRAM specification will be supported.  
3. Above 85oC DRAM case temperature the Auto-Refresh command interval has to be reduced to tREFI = 3.9 µs.  
4. Self-Refresh period is hard-coded in the DRAMs and therefore it is imperative that the system ensures the DRAM is below  
85oC case temperature before initiating self-refresh operation.  
3.2 Supply Voltage Levels and DC Operating Conditions  
Parameter  
Symbol  
Limit Values  
Unit  
Notes  
min.  
1.7  
nom.  
max.  
1.9  
Device Supply Voltage  
Output Supply Voltage  
Input Reference Voltage  
EEPROM Supply Voltage  
DC Input Logic High  
VDD  
1.8  
V
V
-
VDDQ  
VREF  
VDDSPD  
VIH (DC)  
VIL (DC)  
IL  
1.7  
1.8  
1.9  
1)  
2)  
0.49 x VDDQ  
1.7  
0.5 x VDDQ  
0.51 x VDDQ  
3.6  
V
V
VREF + 0.125  
– 0.30  
– 5  
VDDQ + 0.3  
VREF – 0.125  
5
V
DC Input Logic Low  
V
In / Output Leakage Current  
µA  
3)  
1
2
3
Under all conditions, VDDQ must be less than or equal to VDD  
Peak to peak AC noise on VREF may not exceed ± 2% VREF (DC).VREF is also expected to track noise variations in VDDQ  
For any pin on the DIMM connector under test input of 0 V VIN VDDQ + 0.3 V.  
.
INFINEON Technologies  
11  
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
4.0 IDD Specifications and Conditions  
4.1 256 MByte Non- ECC Module HYS64T32000GU (one rank, four components x16)  
256 MByte HYS64T32000GU PC2-3200 -5” PC2-4300 “-3.7” PC2-5400 “-3”  
max.  
280  
300  
16  
max.  
320  
360  
16  
max.  
360  
420  
16  
Symbol  
IDD0  
IDD1  
Parameter / Condition  
Operating Current  
Unit Note  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Operating Current  
Precharge PD Standby Current  
IDD2P  
IDD2N Precharge Standby Current  
128  
100  
52  
160  
120  
64  
200  
140  
80  
IDD2Q Precharge Quiet Standby Current  
Active PD Standby Current  
IDD3P(0)  
IDD3P(1) LP Active PD Standby Current  
IDD3N Active Standby Current  
20  
20  
20  
140  
340  
360  
480  
24  
160  
400  
440  
520  
24  
200  
500  
520  
520  
24  
Operating Current Burst Read  
IDD4R  
IDD4W Operating Current Burst Write  
IDD5B Auto-Refresh Current (tRFCmin.)  
Auto-Refresh Current (tREFI)  
Self-Refresh Current  
Operating Current  
IDD5D  
IDD6  
IDD7  
16  
16  
16  
840  
880  
960  
Notes: 1) Calculated values from component data. ODT disabled. IDD1, IDD4R, and IDD7 are defined with the outputs dis-  
abled.  
4.2 512 MByte Non-ECC Module HYS64T64000GU (one rank, eight components x8)  
512 MByte HYS64T64000GU  
PC2-3200 “-5” PC2-4300 “-3.7” PC2-5400 “-3”  
max.  
440  
480  
32  
max.  
520  
600  
32  
max.  
600  
720  
32  
Symbol  
IDD0  
IDD1  
Parameter / Condition  
Operating Current  
Unit Note  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Operating Current  
IDD2P Precharge PD Standby Current  
IDD2N Precharge Standby Current  
256  
200  
104  
40  
320  
240  
128  
40  
400  
280  
160  
40  
Precharge Quiet Standby Current  
IDD2Q  
IDD3P(0) Active PD Standby Current  
IDD3P(1) LP Active PD Standby Current  
Active Standby Current  
IDD3N  
280  
560  
600  
960  
48  
320  
720  
760  
1040  
48  
400  
840  
880  
1120  
48  
IDD4R Operating Current Burst Read  
IDD4W Operating Current Burst Write  
Auto-Refresh Current (tRFCmin.)  
IDD5B  
IDD5D Auto-Refresh Current (tREFI)  
IDD6  
IDD7  
Self-Refresh Current  
Operating Current  
32  
32  
32  
1040  
1120  
1280  
Notes: 1) Calculated values from component data. ODT disabled. IDD1, IDD4R, and IDD7 are defined with the outputs dis-  
abled.  
INFINEON Technologies  
12  
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
4.3 512 MByte ECC Module HYS72T64000GU (one rank, nine components x8)  
512 MByte HYS72T64000GU PC2-3200 “-5” PC2-4300 “-3.7” PC2-5400 “-3”  
max.  
495  
540  
36  
max.  
585  
675  
36  
max.  
675  
810  
36  
Symbol  
IDD0  
IDD1  
Parameter / Condition  
Operating Current  
Unit Note  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Operating Current  
IDD2P Precharge PD Standby Current  
IDD2N Precharge Standby Current  
288  
225  
117  
45  
360  
270  
144  
45  
450  
315  
180  
45  
Precharge Quiet Standby Current  
IDD2Q  
IDD3P(0) Active PD Standby Current  
IDD3P(1) LP Active PD Standby Current  
Active Standby Current  
IDD3N  
315  
630  
675  
1080  
54  
360  
810  
855  
1170  
54  
450  
945  
990  
1260  
54  
IDD4R Operating Current Burst Read  
IDD4W Operating Current Burst Write  
Auto-Refresh Current (tRFCmin.)  
IDD5B  
IDD5D Auto-Refresh Current (tREFI)  
IDD6  
IDD7  
Self-Refresh Current  
Operating Current  
36  
36  
36  
1170  
1260  
1440  
Notes: 1) Calculated values from component data. ODT disabled. IDD1, IDD4R, and IDD7 are defined with the outputs dis-  
abled.  
4.4 1024 MByte Non-ECC Module HYS64128020GU (two ranks, sixteen components x8)  
1024 MByte HYS64T128020GU  
PC2-3200 “-5” PC2-4300 “-3.7” PC2-5400 “-3”  
max.  
472  
512  
64  
max.  
552  
632  
64  
max.  
632  
752  
64  
Symbol  
IDD0  
IDD1  
Parameter / Condition  
Operating Current  
Unit Note  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
1, 2  
1, 2  
1, 3  
1, 3  
1, 3  
1, 3  
1, 3  
1, 3  
1, 2  
1, 2  
1, 2  
1, 3  
1, 3  
1, 2  
Operating Current  
Precharge PD Standby Current  
IDD2P  
IDD2N Precharge Standby Current  
512  
400  
208  
80  
640  
480  
256  
80  
800  
560  
320  
80  
IDD2Q Precharge Quiet Standby Current  
Active PD Standby Current  
IDD3P(0)  
IDD3P(1) LP Active PD Standby Current  
IDD3N Active Standby Current  
560  
592  
632  
976  
96  
640  
752  
792  
1060  
96  
800  
872  
912  
1120  
96  
Operating Current Burst Read  
IDD4R  
IDD4W Operating Current Burst Write  
IDD5B Auto-Refresh Current (tRFCmin.)  
Auto-Refresh Current (tREFI)  
Self-Refresh Current  
Operating Current  
IDD5D  
IDD6  
IDD7  
64  
64  
64  
1072  
1152  
1312  
Notes: 1) Calculated values from component data. ODT disabled. IDD1, IDD4R, and IDD7 are defined with the outputs dis-  
abled.  
2) The other rank is in IDD2P Precharge Power-Down Standby Current mode  
3) Both ranks are in the same IDD current mode  
INFINEON Technologies  
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Unbuffered DDR2 SDRAM-Modules  
4.5 1024 MByte ECC Module HYS72T128020GU (two ranks, eighteen components x8)  
1024 MByte HYS72T128020GU  
PC2-3200 “-5” PC2-4300 “-3.7” PC2-5400 “-3”  
max.  
531  
576  
72  
max.  
621  
711  
72  
max.  
711  
846  
72  
Symbol  
IDD0  
IDD1  
Parameter / Condition  
Operating Current  
Unit Note  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
1, 2  
1, 2  
1, 3  
1, 3  
1, 3  
1, 3  
1, 3  
1, 3  
1, 2  
1, 2  
1, 2  
1, 3  
1,3  
Operating Current  
IDD2P Precharge PD Standby Current  
IDD2N Precharge Standby Current  
576  
450  
234  
90  
720  
540  
288  
90  
900  
630  
360  
90  
Precharge Quiet Standby Current  
IDD2Q  
IDD3P(0) Active PD Standby Current  
IDD3P(1) LP Active PD Standby Current  
Active Standby Current  
IDD3N  
630  
666  
711  
1116  
108  
72  
720  
846  
891  
1206  
108  
72  
900  
981  
1026  
1296  
108  
72  
IDD4R Operating Current Burst Read  
IDD4W Operating Current Burst Write  
Auto-Refresh Current (tRFCmin.)  
IDD5B  
IDD5D Auto-Refresh Current (tREFI)  
IDD6  
IDD7  
Self-Refresh Current  
Operating Current  
1, 2  
1206  
1296  
1476  
Notes: 1) Calculated values from component data. ODT disabled. IDD1, IDD4R, and IDD7 are defined with the outputs dis-  
abled.  
2) The other rank is in IDD2P Precharge Power-Down Standby Current mode  
3) Both ranks are in the same IDD current mode  
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4.6 IDD Measurement Conditions  
(VDDQ = 1.8V ± 0.1V; VDD = 1.8V ± 0.1V)  
Symbol  
Parameter/Condition  
Operating Current - One bank Active - Precharge  
tCK = tCKmin., tRC = tRCmin., tRAS = tRASmin., CKE is HIGH, CS is high between valid commands. Address and con-  
trol inputs are SWITCHING, Databus inputs are SWITCHING.  
IDD0  
IDD1  
IDD2P  
Operating Current - One bank Active - Read - Precharge  
IOUT = 0 mA, BL = 4, tCK = tCKmin., tRC = tRCmin., tRAS = tRASmin.,tRCD = tRCDmin.,AL = 0, CL = CLmin.;  
CKE is HIGH, CS is high between valid commands. Address and control inputs are SWITCHING, Databus inputs are  
SWITCHING.  
Precharge Power-Down Current: All banks idle; CKE is LOW; tCK = tCKmin.;  
Other control and address inputs are STABLE, Data bus inputs are FLOATING.  
Precharge Standby Current: All banks idle; CS is HIGH; CKE is HIGH; tCK = tCKmin.;  
IDD2N  
Other control and address inputs are SWITCHING, Data bus inputs are SWITCHING.  
Precharge Quiet Standby Current: All banks idle; CS is HIGH; CKE is HIGH; tCK = tCKmin.;  
IDD2Q  
Other control and address inputs are STABLE, Data bus inputs are FLOATING.  
Active Power-Down Current: All banks open; tCK = tCKmin., CKE is LOW; Other control and address inputs are STA-  
IDD3P(0)  
IDD3P(1)  
IDD3N  
BLE, Data bus inputs are FLOATING. MRS A12 bit is set to “0” (Fast Power-down Exit);  
Active Power-Down Current: All banks open; tCK = tCKmin., CKE is LOW; Other control and address inputs are STA-  
BLE, Data bus inputs are FLOATING. MRS A12 bit is set to “1” (Slow Power-down Exit);  
Active Standby Current: All banks open; tCK = tCKmin.; tRAS = tRASmax; tRP = tRPmin.,CKE is HIGH; CS is high  
between valid commands. Other control and address inputs are SWITCHING, Data bus inputs are SWITCHING.  
Operating Current - Burst Read: All banks open; Continuous burst reads; BL = 4;AL = 0, CL = CLmin.; tCK = tCKmin.;  
tRAS = tRASmax., tRP = tRPmin.; CKE is HIGH, CS is high between valid commands.  
IDD4R  
Address inputs are SWITCHING; Data Bus inputs are SWITCHING; IOUT = 0mA.  
Operating Current - Burst Write: All banks open; Continuous burst writes; BL = 4; AL = 0, CL = CLmin.; tCK = tCKmin.;  
tRAS = tRASmax., tRP = tRPmin.; CKE is HIGH, CS is high between valid commands.  
Address inputs are SWITCHING; Data Bus inputs are SWITCHING;  
IDD4W  
Burst Auto-Refresh Current: tCK = tCKmin., Refresh command every tRFC = tRFCmin. interval, CKE is HIGH, CS is  
IDD5B  
IDD5D  
IDD6  
HIGH between valid commands, Other control and address inputs are SWITCHING, Data bus inputs are SWITCHING.  
Distributed Auto-Refresh Current: tCK = tCKmin., Refresh command every tRFC = tREFI interval, CKE is LOW and CS  
is HIGH between valid commands, Other control and address inputs are SWITCHING, Data bus inputs are SWITCHING.  
Self-Refresh Current: CKE 0.2V; external clock off, CK and CK at 0V; Other control and address inputs are FLOAT-  
ING, Data bus inputs are FLOATING. RESET = Low. IDD6 current values are guaranteed up to TCASE of 85oC max.  
All Bank Interleave Read Current:  
1. All banks are being interleaved at minimum tRC without violating tRRD using a burst length of 4. Control and address  
bus inputs are STABLE during DESELECTS. Iout = 0mA.  
2. Timing pattern:  
IDD7  
- DDR2 -400-333: A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D D D (12 clocks)  
- DDR2 -533-444: A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D D D (16 clocks)  
- DDR2 -667-444: A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D (19 clocks)  
3. Legend: A = Activate, RA = Read with Auto-Precharge, D=DESELECT  
Notes:  
1. IDD specifications are tested after the device is properly initialized and IDD parameter are specified with ODT disabled.  
2. Definitions for IDD:  
LOW is defined as VIN <= VIL(ac)max; HIGH is defined as VIN >= VIH(ac)min.  
STABLE is defined as inputs are stable at a HIGH or LOW level.  
FLOATING is defined as inputs are VREF = VDDQ / 2.  
SWITCHING is defined as:  
inputs are changing between HIGH and LOW every other clock (once per two cycles) for address and control signals, and  
inputs changing between HIGH and LOW every other clock (once per cycle) for DQ signals not including mask or strobes.  
3. IDD1, IDD4R, and IDD7A current measurements are defined with the outputs disabled (Iout = 0 mA). To achieve this on module  
level the output buffers can be disabled using an EMRS(1) (Extended Mode Register Command) by setting A12 bit to HIGH.  
3. For two rank modules: For all active current measurements the other rank is in Precharge Power-Down Mode IDD2P  
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4.6 IDD Measurement Conditions (cont’d)  
For testing the IDD parameters, the following timing parameters are used:  
-5  
-3.7  
PC2-4300  
-3  
Unit  
PC2-3200  
PC2-5400  
Parameter  
Symbol  
3-3-3  
3
4-4-4  
4
4-4-4  
4
CAS Latency  
CLmin  
tCKmin  
tCK  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Clock Cycle Time  
5
3.75  
15  
3
Active to Read or Write delay  
tRCDmin  
tRCmin  
15  
60  
7.5  
10  
45  
15  
12  
57  
7.5  
10  
45  
12  
Active to Active / Auto-Refresh command period  
60  
x8 1)  
tRRDmin  
tRRDmin  
tRASmin  
tRPmin  
7.5  
10  
Active bank A to Active bank B  
command delay  
x16 2)  
Active to Precharge Command  
Precharge Command Period  
45  
15  
Auto-Refresh to Active / Auto-Refresh command  
period  
tRFCmin  
tREFI  
105  
7.8  
105  
7.8  
105  
7.8  
ns  
µs  
Average periodic Refresh interval  
Notes: 1) For modules based on x8 components  
2) For modules based on x16 components  
4.7 ODT (On Die Termination) Current  
The ODT function adds additional current consumption to the DDR2 SDRAM when enabled by the EMRS(1).  
Depending on address bits A6 & A2 in the EMRS(1) a “week” or “strong” termination can be selected. The cur-  
rent consumption for any terminated input pin, depends on the input pin is in tri-state or driving “0” or “1”, as long  
a ODT is enabled during a given period of time.  
ODT current per terminated pin:  
EMRS(1) State  
Unit  
min.  
5
typ.  
6
max.  
7.5  
A6 = 0, A2 = 1  
A6 = 1, A2 = 0  
A6 = 0, A2 = 1  
mA/DQ  
mA/DQ  
mA/DQ  
Enabled ODT current per DQ  
IODTO  
IODTT  
added IDDQ current for ODT enabled;  
ODT is HIGH; Data Bus inputs are FLOATING  
2.5  
10  
3
3.75  
15  
12  
Active ODT current per DQ  
added IDDQ current for ODT enabled;  
ODT is HIGH; worst case of Data Bus inputs  
are STABLE or SWITCHING.  
A6 = 1, A2 = 0  
5
6
7.5  
mA/DQ  
note: For power consumption calculations the ODT duty cycle has to be taken into account  
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5.0 Electrical Characteristics & AC Timings  
5.1 AC Timing Parameter by Speed Grade (Component level data, for reference only)  
-5  
-3.7  
-3  
DDR2 -400  
DDR2 -533  
DDR2 -667  
Symbol  
Parameter  
Unit  
Min  
Max  
Min  
Max  
Min  
Max  
tAC DQ output access time from CK/CK  
tDQSCK DQS output access time from CK/CK  
tCH CK, CK high-level width  
600  
500  
0.45  
+ 600  
-500  
450  
0.45  
0.45  
+500  
-450  
+450  
+400  
0.55  
0.55  
ps  
ps  
tCK  
tCK  
+ 500  
0.55  
0.55  
+450  
0.55  
0.55  
-400  
0.45  
0.45  
tCL CK, CK low-level width  
0.45  
tHP Clock Half Period  
min. (tCL, tCH)  
min. (tCL, tCH)  
min. (tCL, tCH)  
CL = 3  
tCK Clock cycle time  
CL = 4 & 5  
5000  
5000  
600  
8000  
8000  
-
5000  
3750  
600  
8000  
8000  
-
5000  
3000  
tbd.  
8000  
8000  
-
ps  
ps  
ps  
Address and control input setup time  
Address and control input hold time  
DQ and DM input hold time  
tIS  
tIH  
600  
400  
400  
0.6  
0.35  
-
-
600  
350  
350  
0.6  
0.35  
-
-
tbd.  
300  
300  
0.6  
0.35  
-
-
-
-
-
-
ps  
ps  
ps  
tCK  
tCK  
-
-
tDH  
DQ and DM input setup time  
-
-
tDS  
Control and Addr. input pulse width (each input)  
DQ and DM input pulse width (each input)  
Data-out high-impedance time from CK/CK  
DQ low-impedance from CK / CK  
-
-
tIPW  
-
-
tDIPW  
tHZ  
tLZ(DQ)  
tACmax  
tACmax  
tACmax ps  
2*tACmin tACmax 2*tACmin tACmax 2*tACmin tACmax ps  
DQS low-impedance from CK / CK  
tACmin  
-
tACmax  
350  
tACmin  
-
tACmax  
300  
tACmin  
-
tACmax ps  
tLZ(DQS)  
DQS-DQ skew  
(for DQS & associated DQ signals)  
250  
ps  
ps  
tDQSQ  
tQHS Data hold skew factor  
-
450  
-
-
400  
-
-
350  
-
tQH Data Output hold time from DQS  
tHP-tQHS  
tHP-tQHS  
tHP-tQHS  
WL  
WL  
WL  
WL  
WL  
WL  
tDQSS Write command to 1st DQS latching transition  
tDQSL,H DQS input low (high) pulse width (write cycle)  
tCK  
tCK  
tCK  
-0.25  
+0.25  
-0.25  
+0.25  
-0.25  
+0.25  
0.35  
0.2  
-
-
0.35  
0.2  
-
-
0.35  
0.2  
-
-
DQS falling edge to CLK setup time  
tDSS  
(write cycle)  
DQS falling edge hold time from CLK  
(write cycle)  
0.2  
-
0.2  
-
0.2  
-
tCK  
tDSH  
Mode register set command cycle time  
Write preamble  
2
-
-
2
-
-
2
-
-
tCK  
tCK  
tCK  
tCK  
tCK  
ns  
tMRD  
tWPRE  
tWPST  
tRPRE  
tRPST  
tRAS  
0.25  
0.40  
0.9  
0.25  
0.40  
0.9  
0.35  
0.40  
0.9  
Write postamble  
0.60  
1.1  
0.60  
70000  
-
0.60  
1.1  
0.60  
70000  
-
0.60  
1.1  
0.60  
70000  
-
Read preamble  
Read postamble  
0.40  
45  
0.40  
45  
0.40  
45  
Active to Precharge command  
Active to Active/Auto-refresh command period  
60  
60  
57  
ns  
tRC  
Auto-refresh to Active/Auto-refresh command  
period  
tRFC  
105  
-
105  
-
105  
-
ns  
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-5  
-3.7  
-3  
DDR2 -400  
DDR2 -533  
DDR2 -667  
Symbol  
Parameter  
Unit  
Min  
15  
Max  
Min  
15  
Max  
Min  
Max  
Active to Read or Write delay (with and without  
Auto-Precharge) delay  
-
-
12  
-
-
-
ns  
ns  
ns  
tRCD  
tRP Precharge command period  
15  
-
-
15  
-
-
12  
x8  
7.5  
7.5  
7.5  
Active bank A to Active  
tRRD  
(1k page size)  
bank B command  
x16 (2k page size)  
10  
2
-
-
-
-
-
-
10  
2
-
-
-
-
-
-
10  
2
-
-
-
-
-
-
ns  
tCK  
ns  
tCK  
ns  
ns  
CAS A to CAS B Command Period  
Write recovery time  
tCCD  
tWR  
15  
15  
15  
Auto precharge write recovery + precharge time WR+tRP  
WR+tRP  
7.5  
WR+tRP  
7.5  
tDAL  
tWTR  
tRTP  
Internal write to read command delay  
10  
Internal read to precharge command delay  
7.5  
7.5  
7.5  
Exit power down to any valid command  
(other than NOP or Deselect)  
2
6 - AL  
2
-
-
-
2
6 - AL  
2
-
-
-
2
6 - AL  
2
-
-
-
tCK  
tCK  
tCK  
tXARD  
tXARDS  
tXP  
Exit active power-down mode to read command  
(slew exit, lower power)  
Exit precharge power-down to any valid com-  
mand (other than NOP or Deselect)  
Exit Self-Refresh to read command  
Exit Self-Refresh to non-read command  
CKE minimum high and low pulse width  
OCD drive mode output delay  
200  
-
-
200  
-
-
200  
-
-
tCK  
ns  
tCK  
ns  
tXSRD  
tXSNR  
tCKE  
tRFC + 10  
tRFC + 10  
tRFC + 10  
3
0
-
3
0
-
3
0
-
12  
12  
12  
tOIT  
Minimum time clocks remain ON after CKE  
asynchronously drops low  
tIS+tCK  
+tIH  
tIS+tCK  
+tIH  
tIS+tCK  
+tIH  
-
-
-
ns  
µs  
tDELAY  
0oC - 85oC  
-
-
7.8  
3.9  
-
-
7.8  
3.9  
-
-
7.8  
3.9  
Average Periodic  
tREFI  
Refresh Interval  
85oC - 95oC  
1. For details and notes see the relevant INFINEON component datasheet  
2. Timing definition and values for tis, tih, tds and tdh may change due to actual JEDEC work. This may also  
effect the SPD code for these parameters  
5.2 ODT AC Electrical Characteristics and Operating Conditions (all speed bins)  
Symbol Parameter / Condition  
min.  
2
max.  
2
Units  
tAOND ODT turn-on delay  
tCK  
DDR2-400/533  
DDR2-667  
tAC(min)  
tAC(min)  
tAC(min) + 2 ns  
tAC(max) + 1 ns  
tAC(max) + 0.7 ns  
2 tCK + tAC(max) + 1 ns  
ODT turn-on  
tAON  
ns  
tAONPD ODT turn-on (Power-Down Modes)  
tAOFD ODT turn-off delay  
ns  
tCK  
ns  
ns  
tCK  
tCK  
2.5  
2.5  
tAOF  
tAOFPD  
tANPD  
tAXPD  
ODT turn-off  
tAC(min)  
tAC(max) + 0.6 ns  
ODT turn-off delay (Power-Down Modes)  
ODT to Power Down Mode Entry Latency  
ODT Power Down Exit Latency  
tAC(min) + 2 ns  
2.5 tCK + tAC(max) + 1 ns  
3
8
-
-
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6.0 Serial Presence Detect Codes for Unbuffered DIMM Modules  
Byte# Description  
Speed  
Grade  
SPD Entry  
Value  
Hex Value  
0
1
2
3
4
5
6
7
8
9
Number of SPD Bytes  
all  
all  
128  
256  
80  
08  
08  
0E  
0A  
60  
48  
00  
05  
50  
3D  
30  
60  
50  
45  
02  
82  
08  
08  
00  
0C  
04  
38  
00  
02  
00  
01  
50  
3D  
30  
60  
50  
45  
50  
60  
3C  
30  
Total Bytes in Serial PD  
Memory Type  
all  
DDR2-SDRAM  
13 / 14  
10  
Number of Row Addresses  
Number of Column Addresses  
Number of DIMM Ranks, Package and Height  
Module Data Width  
all  
0D  
0A  
60  
40  
0E  
0A  
60  
40  
0E  
0A  
61  
40  
0E  
0A  
61  
48  
all  
all  
1 / 2  
all  
x64 / x72  
not used  
SSTL_1.8  
5 ns  
Not used  
all  
Module Interface Levels  
Min. Clock Cycle Time at CAS Latency = 5  
all  
-5  
-3.7  
-3  
3.7 ns  
3 ns  
10  
SDRAM Access Time from Clock at CL = 5  
-5  
0.6 ns  
-3.7  
-3  
0.5 ns  
0.45 ns  
non-ECC / ECC  
7.8 µs, SR  
x16, x8  
na / x8  
-
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
DIMM Configuration Type  
Refresh Rate/Type  
all  
00  
00  
00  
02  
all  
SDRAM Width, Primary  
Error Checking SDRAM Data Width  
Reserved  
all  
10  
00  
08  
00  
08  
00  
08  
08  
all  
all  
Burst Length Supported  
Number of SDRAM Banks  
Supported CAS Latencies  
Not used  
all  
4 & 8  
all  
4
all  
5, 4, 3  
all  
not used  
unbuffered DIMM  
normal DIMM  
incl. weak driver  
5 ns  
DIMM Type Information  
SDRAM Module Attributes  
SDRAM Device Attributes: General  
Min. Clock Cycle Time at CAS Latency = 4  
all  
all  
all  
-5  
-3.7  
-3  
3.7 ns  
3 ns  
24  
SDRAM Access Time from Clock for CL = 4  
-5  
0.6 ns  
-3.7  
-3  
0.5 ns  
0.45 ns  
5 ns  
25  
26  
27  
Minimum Clock Cycle Time at CL = 3  
Access Time from Clock at CL = 3  
Minimum Row Precharge Time (tRP)  
all  
all  
0.6 ns  
-5 & -3.7  
-3  
15 ns  
12 ns  
28  
29  
Minimum Row Act. to Row Act. Delay (tRRD)  
Minimum RAS to CAS Delay (tRCD)  
all  
10 / 7.5 ns  
15 ns  
28  
40  
1E  
80  
1E  
3C  
30  
2D  
80  
60  
50  
45  
1E  
1E  
-5 & -3.7  
-3  
12 ns  
30  
31  
32  
Minimum RAS Pulse Width (tRAS)  
Module Density (per rank)  
all  
45 ns  
80  
80  
Address and Command Setup Time (tIS)  
-5  
-3.7  
-3  
0.60 ns  
0.50 ns  
0.45 ns  
INFINEON Technologies  
19  
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
Byte# Description  
Speed  
Grade  
SPD Entry  
Value  
Hex Value  
33  
34  
35  
Address and Command Hold Time (tIH)  
-5  
-3.7  
-3  
0.60 ns  
0.50 ns  
0.45 ns  
0.40 ns  
0.35 ns  
0.30 ns  
0.40 ns  
0.35 ns  
60  
50  
45  
40  
35  
30  
40  
35  
30  
3C  
28  
1E  
1E  
00  
00  
3C  
39  
69  
80  
23  
1E  
19  
2D  
28  
23  
00  
Data Input Setup Time (tDS)  
Data Input Hold Time (tDH)  
-5  
-3.7  
-3  
-5  
-3.7  
-3  
all  
0.30 ns  
15 ns  
36  
37  
Write Recovery Time (tWR)  
Internal Write to Read Command delay  
(tWTR)  
-5  
10 ns  
-3.7 & -3  
all  
7.5 ns  
7.5 ns  
not used  
38  
39  
40  
41  
Internal Read to Precharge delay (tRTP)  
Not used  
Extension of Byte 41 tRC and Byte 42 tRFC  
Minimum Core Cycle Time (tRC)  
all  
-5 & -3.7  
-3  
60 ns  
57 ns  
42  
43  
44  
Min. Auto Refresh Cycle Time (tRFC)  
Maximum Clock Cycle Time tck  
Max. DQS-DQ Skew (tDQSQmax.)  
all  
105 ns  
all  
8 ns  
-5  
0.35 ns  
0.30 ns  
0.25 ns  
0.45 ns  
0.40 ns  
0.35 ns  
not used  
see note 1  
Revision 1.0  
-3.7  
-3  
45  
46  
Read Data Hold Skew Factor (tQHS)  
Not used  
-5  
-3.7  
-3  
47-61 Reserved for “Delta Temperature in SPD”  
00  
00  
00  
10  
00  
00  
tbd  
62  
63  
SPD Revision  
Checksum for Bytes 0 - 62  
-5  
-3.7  
-3  
tbd  
tbd  
tbd  
tbd  
tbd  
tbd  
tbd  
tbd  
tbd  
C1  
00  
tbd  
tbd  
tbd  
tbd  
tbd  
64  
Manufacturers JEDEC ID Code  
INFINEON  
65-71 Not used  
72  
Module Assembly Location  
XX  
XX  
XX  
XX  
XX  
FF  
73-90 Module Part Number  
91-92 Module Revision Code  
93-94 Module Manufacturing Date  
95-98 Module Serial Number  
99-127 Manufacturer’s Specific Data  
Year/Week Code  
Serial Number  
blank  
128-255 Open for Customer use  
blank  
Note 1 : Will be used for future SPD Code Revisions. For details of “Delta Temperature in SPD” see JEDEC ballot JC-42.5  
Item # 1468.  
INFINEON Technologies  
20  
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
7.0 Package Outlines  
7.1 Raw Card A  
Module Package  
DDR2 Unbuffered DIMM Modules Raw Card A  
one physical rank, 8 (Non-ECC) or 9 (ECC) components x8  
+ 0.15  
-
133.35  
2.7 max.  
Not installed on x64  
(Non-ECC) Configuration  
Front View  
4.0  
120  
240  
pin 1  
64  
65  
+ 0.1  
-
1.27  
63,0  
5,175  
5,175  
55,0  
PCB warpage 0.40  
5.0  
Backside View  
185  
pin 121  
184  
3
3
Detail of Contacts A  
Detail of Contacts B  
5.0  
0.75R  
0.8 -+ 0.05  
1.0  
1.5  
2.5  
note: all outline dimensions and tolerances are in accordance with the JEDEC standard (MO-237)  
INFINEON Technologies  
21  
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
7.2 Raw Card B  
Module Package  
DDR2 Unbuffered DIMM Modules Raw Card B  
two physical ranks, 16 (Non-ECC) or 18 (ECC) components x8  
+ 0.15  
-
133.35  
4.00 m ax.  
Front View  
4.0  
120  
pin  
1
64  
65  
+ 0.1  
-
1.27  
63,0  
5,175  
5,175  
55,0  
PCB warpage 0.40  
5.0  
Not installed on x64  
(Non-ECC) Configuration  
Backside View  
pin 121  
240  
185  
184  
3
3
D etail of C ontacts  
A
Detail of C ontacts  
5.0  
B
0.75R  
+ 0.05  
-
0.8  
1.0  
1.5  
2.5  
note: all outline dimensions and tolerances are in accordance with the JEDEC standard (MO-237)  
INFINEON Technologies  
22  
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
7.3 Raw Card C  
Module Package  
DDR2 Registered DIMM Modules Raw Card C  
one physical rank, 4 components x16 (tbd.)  
+ 0.15  
-
133.35  
2.7 max.  
Front View  
4.0  
120  
pin 1  
64  
65  
+ 0.1  
-
1.27  
63,0  
5,175  
5,175  
55,0  
PCB warpage 0.40  
5.0  
Backside View  
185  
pin 121  
240  
184  
3
3
Detail of Contacts A  
Detail of Contacts B  
5.0  
0.75R  
0.8 -+ 0.05  
1.0  
1.5  
2.5  
note: all outline dimensions and tolerances are in accordance with the JEDEC standard (MO-237)  
INFINEON Technologies  
23  
1.04  
HYS 64/72Txx0x0GU  
Unbuffered DDR2 SDRAM-Modules  
8.0 Nomenclature (Modules & Components)  
8.1 DDR2 DIMM Modules  
1
2
3
4
5
6
7
8
9
10  
11  
H Y S 7 2  
T
1 2 8  
0
2
0
G
U
- 5 - A  
Example:  
1
2
INFINEON Prefix  
HYS for DIMM Modules  
7
8
Product Variations  
Package  
0 = standard  
64 = Non-ECC Modules  
72 = ECC Modules  
G = standard modules  
H = “green” modules  
Module Data Width  
R = Registered DIMMs  
U = Unbuffered DIMMs  
DL = Small Outline DIMMs)  
-5 = PC2-3200 (DDR2-400)  
-3.7 = PC2-4300 (DDR2-533)  
-3 = PC2-5400 (DDR2-667)  
A = 1st Generation  
B = 2nd Generation  
C = 3rd Generation  
T = DDR2  
DRAM Technology  
Module Type  
3
4
5
6
9
64 = 64 Mb  
Memory Density per I/O 128 = 128 Mb  
256 = 256 Mb  
10 Speed Grade  
11 Die Revision  
Raw Card Generation  
0 = first generation  
Multiplying “Memory Density per I/O” with “Module Data Width”  
and dividing by 8 for Non-ECC and 9 for ECC modules gives the  
overall module memory density in MBytes.  
Number of Memory  
Ranks  
0 = One Rank  
2 = Two Ranks  
8.2 DDR2 Memory Components  
1
2
3
4
5
6
7
8
9
H Y B 1 8  
T
5 1 2 8 0  
0
A
- 5  
C
Example:  
INFINEON  
1
2
HYB for DRAM Components  
18 = 1.8 V Power Supply  
6
7
Product Variations  
Die Revision  
0 = standard  
Component Prefix  
A = 1st Generation  
B = 2nd Generation  
C = 3rd Generation  
C = BGA package  
F = BGA package (lead and  
halogen free)  
-5 =...DDR2-400  
-3.7 =.DDR2-533  
-3 =...DDR2-667  
Power Supply Voltage  
DRAM Technology  
Memory Density  
3
4
5
T = DDR2  
8
Package Type  
Speed Grade  
256 = 256 Mb  
512 = 512 Mb  
1G = 1024Mb  
40 = x4, 4 data in/outputs  
80 = x8, 8 data in/outputs  
16 = x16, 16 data in/outputs  
9
Memory Organisation  
INFINEON Technologies  
24  
1.04  
厂商 型号 描述 页数 下载

INFINEON

HYS64-72V2200GU-8 3.3V 2M ×64 /72- 1位BANK SDRAM模块3.3V 4M ×64 /72- 2位BANK SDRAM模块[ 3.3V 2M x 64/72-Bit 1 BANK SDRAM Module 3.3V 4M x 64/72-Bit 2 BANK SDRAM Module ] 17 页

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HYS64-74V8200GU 3.3 V 8M ×64 /72- 1位银行SDRAM模块3.3 V 16M ×64 /72- 2位银行SDRAM模块[ 3.3 V 8M x 64/72-Bit 1 Bank SDRAM Module 3.3 V 16M x 64/72-Bit 2 Bank SDRAM Module ] 17 页

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HYS6472V16200GU 3.3 V 16M ×64 /72-位SDRAM模块3.3 V 32M ×64 /72-位SDRAM模块3.3 V 64M ×64 /72-位SDRAM模块[ 3.3 V 16M x 64/72-Bit SDRAM Modules 3.3 V 32M x 64/72-Bit SDRAM Modules 3.3 V 64M x 64/72-Bit SDRAM Modules ] 17 页

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HYS6472V4200GU 3.3V 4M ×64 /72- 1位BANK SDRAM模块3.3V 8M ×64 /72- 2位BANK SDRAM模块[ 3.3V 4M x 64/72-Bit 1 BANK SDRAM Module 3.3V 8M x 64/72-Bit 2 BANK SDRAM Module ] 15 页

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HYS64D128020GBDL-6-A [ DDR DRAM Module, 128MX64, 0.7ns, CMOS, SO-DIMM-200 ] 11 页

ETC

HYS64D128020GBDL-7-A ? 1GB ( 1024Mx64 ) PC2100 2银行?\n[ ?1GB (1024Mx64) PC2100 2-bank? ] 11 页

INFINEON

HYS64D128020GU-7-A 2.5 V 184针无缓冲DDR- SDRAM我模块[ 2.5 V 184-pin Unbuffered DDR-I SDRAM Modules ] 18 页

INFINEON

HYS64D128020GU-8-A 2.5 V 184针无缓冲DDR- SDRAM我模块[ 2.5 V 184-pin Unbuffered DDR-I SDRAM Modules ] 18 页

QIMONDA

HYS64D128020GU-8-A [ DDR DRAM Module, 128MX64, 0.8ns, CMOS, PDMA184 ] 18 页

INFINEON

HYS64D128021 200针的小型双列直插式内存模块[ 200-Pin Small Outline Dual-In-Line Memory Modules ] 23 页

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