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DZ5X068D0R

型号:

DZ5X068D0R

描述:

硅外延平面型[ Silicon epitaxial planar type ]

品牌:

PANASONIC[ PANASONIC ]

页数:

4 页

PDF大小:

331 K

DZ5X068D  
Silicon epitaxial planar type  
Unit: mm  
For surge absorption circuits  
Features  
Excellent rising characteristics of zener current IZ  
Low zener operating resistance RZ  
Halogen-free / RoHs compliant  
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)  
Marking Symbol: 02  
Basic Part Number  
Dual DZ3X068D (Common anode)  
Packaging  
1: Cathode -1  
2:Anode-1, 2, 3, 4  
3: Cathode -2  
Panasonic  
4: Cathode -3  
5: Cathode -4  
DZ5X068D0R Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)  
Absolute Maximum Ratings Ta = 25°C  
Mini5-G3-B  
SC-74A  
JEITA  
Parameter  
Symbol  
PT  
Rating  
200  
Unit  
mW  
kV  
Code  
MO-178  
1
Total power dissipation*  
2
Electrostatic discharge *  
ESD  
Tj  
±10  
5
4
3
Junction temperature  
Storage temperature  
150  
°C  
T
stg  
–55 to +150  
°C  
Note) 1: Mounted on glass epoxy print board. (45 mm × 45 mm × 1 mm)(4 diode total)  
*
Solder in (0.7 mm × 1.0 mm)  
1
2
2: Test method:IEC61000-4-2 (C = 150 pF, R = 330 , Contact discharge:10 times)  
*
Common Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Forward voltage  
Symbol  
VF  
Conditions  
Min  
Typ  
Max  
1.0  
7.14  
30  
Unit  
V
IF = 10 mA  
IZ = 5 mA  
IZ = 5 mA  
IZ = 0.5 mA  
VR = 4.0 V  
IZ = 5 mA  
1,2  
Zener voltage *  
VZ  
6.46  
V
Zener operating resistance  
Zener rise operating resistance  
Reverse current  
RZ  
RZK  
IR  
60  
0.1  
µA  
3
Temparature coefcient of zener voltage *  
SZ  
3.1  
mV/°C  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. 1: The temperature must be controlled 25°C for V measurement. V value measured at other temperature must be adjusted to V (25°C)  
*
Z
Z
Z
: V guaranteed 20 ms after current ow.  
*2  
Z
3: T = 25°C to 150°C  
*
j
Publication date: July 2012  
Ver. BED  
1
DZ5X068D  
IF VF  
IZ VZ  
IR VR  
102  
10  
102  
T
a = 25°C  
Ta = 25°C  
Ta = 25°C  
105  
107  
109  
1011  
10  
1
1
101  
102  
101  
102  
103  
103  
0
0.5  
1.0  
1.5  
2.0  
0
4
8
12  
0
1
2
3
4
5
6
(
)
( )  
V
( )  
Reverse voltage VR V  
Forward voltage VF  
V
Zener voltage VZ  
RZ IZ  
SZ IZ  
Ct VR  
10  
40  
30  
20  
10  
0
7
6
5
4
3
2
Ta = 25°C  
Ta = 25°C  
1
0
1
101  
1
10  
102  
0
1
2
3
4
5
0
2
4
6
8
10  
(
)
V
Reverse voltage VR  
(
)
Zener current IZ (mA)  
Zener current IZ mA  
PT T  
Rth t  
PZSM tW  
a
103  
102  
10  
1
102  
10  
1
250  
200  
150  
100  
50  
Mounted on glass epoxy print board.  
(4 diode total)  
Ta = 25°C  
(1)  
(45 mm × 45 mm × 1 mm)  
Solder in : 0.7 mm × 1.0 mm  
Rth(j-l) = 120°C/W  
(2)  
(1) Non-heat sink  
(2) Mounted on glass epoxy print board.  
(45 mm × 45 mm × 1 mm)  
Solder in : 0.7 mm × 1.0 mm  
101  
0
0
103  
101  
10  
103  
102  
103  
104  
40  
80  
120  
160  
200  
Time t (s)  
Pulse width tW (µs)  
Ambient temperature Ta (°C)  
Ver. BED  
2
DZ5X068D  
Mini5-G3-B  
Unit: mm  
+0.10  
+0.05  
0.30  
0.13  
0.02  
0.05  
5
4
1
2
3
(0.95)  
(0.95)  
1.9 0.1  
+0.20  
2.90  
0.05  
Land Pattern (Reference) (Unit: mm)  
Ver. BED  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  
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