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DZQA6V8AXV5-7

型号:

DZQA6V8AXV5-7

描述:

QUAD表面贴装TVS阵列[ QUAD SURFACE MOUNT TVS ARRAY ]

品牌:

DIODES[ DIODES INCORPORATED ]

页数:

4 页

PDF大小:

74 K

DZQA6V8AXV5  
QUAD SURFACE MOUNT TVS ARRAY  
Features  
Mechanical Data  
Quad TVS in Common Anode Configuration  
Ultra-Small Surface Mount Package  
Ideal For Transient Suppression and ESD Protection  
Lead Free By Design/RoHS Compliant (Note 1)  
"Green Device" (Note 2)  
Case: SOT553  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Finish: Matte Tin, Annealed Over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.002 grams (approximate)  
Qualified to AEC-Q101 Standards for High Reliability  
ESD Capability  
IEC 61000-4-2 Contact Method ±8kV  
IEC 61000-4-2 Air Discharge Method ±15kV  
A1/A2  
A3/A4  
2
C2  
3
C1  
1
D2  
D3  
D1  
D4  
4
5
C4  
C3  
TOP VIEW  
Device Schematic  
Ordering Information (Note 3)  
Part Number  
Case  
Packaging  
DZQA6V8AXV5-7  
SOT553  
3000/Tape & Reel  
Notes:  
1. No purposefully added lead.  
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.  
3. For packaging details, go to our website at http://www.diodes.com.  
Marking Information  
T62 = Product type marking code  
YM = Date code marking  
Y = Year (Ex: W = 2009)  
T62  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2009  
2010  
2011  
2012  
2013  
2014  
2015  
Code  
W
X
Y
Z
A
B
C
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 4  
www.diodes.com  
February 2011  
© Diodes Incorporated  
DZQA6V8AXV5  
Document number: DS31271 Rev. 6 - 2  
DZQA6V8AXV5  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Symbol  
Value  
Unit  
0.9  
V
Forward Voltage @ IF = 10mA  
VF  
Thermal Characteristics  
Characteristic  
Power Dissipation (Notes 4 & 5)  
Symbol  
PD  
Value  
380  
Unit  
mW  
W
20  
Peak Power Dissipation, 8x20μS Waveform (Note 6)  
Thermal Resistance, Junction-to-Ambient (Note 4)  
Operating and Storage Temperature Range  
Ppk  
327  
°C/W  
Rθ  
JA  
-55 to +150  
TJ, TSTG  
°C  
Electrical Characteristics @TA = 25°C unless otherwise specified  
Clamping  
Voltage  
(Note 6)  
Capacitance  
@0V Bias(pF)  
(Note 8)  
Capacitance  
@3V Bias(pF)  
(Note 8)  
Breakdown Voltage  
(Note 7)  
Leakage Current  
(Note 7)  
Type  
Number  
Marking  
Code  
VBR @ IT = 1mA  
Min (V) Nom (V) Max (V)  
IRM @ VRM  
VC Max @ IPP  
VC(V) IPP(A)  
CT  
CT  
(V)  
4.3  
Typ  
12.5  
Max  
15  
Typ  
7.6  
Max  
Max(μA)  
DZQA6V8AXV5  
T62  
6.47  
6.8  
7.14  
1
13  
1.6  
9.5  
Notes:  
4. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. Suggested Pad Layout Document AP02001,  
which can be found on our website at http://www.diodes.com.  
5. Only 1 diode under power. For all 4 diodes under power, PD will be 25% of the listed value.  
6. Non-repetitive current pulse per Figure 3 and derate above TA = 25°C per Figure 1.  
7. Short duration pulse test used to minimize self-heating effect.  
8. Per element, f = 1MHz, TA = 25°C  
100  
100  
50  
0
75  
50  
25  
0
60  
20  
40  
0
0
25  
50  
75 100 125 150 175 200  
t, TIME (  
μs)  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 1 Pulse Derating Curve  
Fig. 2 Pulse Waveform  
2 of 4  
www.diodes.com  
February 2011  
© Diodes Incorporated  
DZQA6V8AXV5  
Document number: DS31271 Rev. 6 - 2  
DZQA6V8AXV5  
14  
12  
1
f = 1.0MHz  
0.1  
10  
8
0.01  
6
4
0.001  
2
0
0.0001  
0
1.0  
2.0  
3.0  
4.0  
5.0  
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
VR, REVERSE VOLTAGE (V)  
Fig. 4 Typical Total Capacitance vs.  
Reverse Voltage (Per Element)  
VF, INSTANTANEOUS FORWARD VOLTAGE (V)  
Fig. 3 Typical Forward Characteristics  
Package Outline Dimensions  
D
e1  
e
SOT553  
Dim Min  
Max Typ  
0.60 0.60  
0.18 0.15  
1.70 1.60  
1.70 1.60  
1.25 1.20  
0.30 0.20  
0.30 0.20  
0.50 Typ  
A
c
D
E
E1  
L
b
0.55  
0.10  
1.50  
1.55  
1.10  
0.10  
0.15  
E1  
E
L
c
b (5 places)  
a
e
e1  
a
1.00 Typ  
6°  
8°  
7°  
All Dimensions in mm  
A
Suggested Pad Layout  
C2  
C2  
Dimensions Value (in mm)  
Z
G
2.2  
1.2  
X
Y
0.375  
0.5  
C1  
G
Z
C1  
C2  
1.7  
0.5  
Y
X
3 of 4  
www.diodes.com  
February 2011  
© Diodes Incorporated  
DZQA6V8AXV5  
Document number: DS31271 Rev. 6 - 2  
DZQA6V8AXV5  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2011, Diodes Incorporated  
www.diodes.com  
4 of 4  
www.diodes.com  
February 2011  
© Diodes Incorporated  
DZQA6V8AXV5  
Document number: DS31271 Rev. 6 - 2  
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