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EZJPZV120GA

型号：

EZJPZV120GA

描述：

多层压敏电阻[ Multilayer Varistors ]

品牌：

PANASONIC[ PANASONIC ]

页数：

13 页

PDF大小：

452 K

下载PDF手册
Multilayer Varistors  
Multilayer Varistor for ESD pulse  
[DC voltage lines/High speed signal lines]  
Series EZJP, 0201size  
■ Features  
■Handling Precautions  
see pages 8 to 13  
■Packaging Specifications  
● Excellent ESD suppression due to advanced material  
technology  
● Meets IEC61000-4-2, Level 4 standard  
● Can replace 2 Zener Diodes and 1 Capacitor  
● Low capacitance versions for DC voltage lines of high  
see pages 7  
●● URlsotrpHaeSelodwcbocumaspspaelicsaitnatnce for signal lines of high speed busses  
■Explanation of Part Numbers  
10  
11  
1
2
3
4
5
6
7
8
9
12  
(Example)  
E
Z
J
P
Z
V
6
R
8
G
A
Product Code  
Design Code  
Series Code  
Packaging Style Code  
Paper Taping  
Capacitance  
Code  
Design Code  
Nil Cap. Tolerance :max.  
V
P
EZJP series  
Size Code  
R
D
G
J
20 pF  
27 pF  
100 pF  
220 pF  
Nominal Varistor Voltage  
The first and second digits denote  
the first 2 numbers of the varistor  
voltage and the third digit indicates  
the number of zeros following.  
Z
0201  
Decimal point The decimal point  
describes it into "R"  
■Construction  
No.  
①
②
③
④
⑤
Name  
Semiconductive Ceramics  
Internal electrode  
Substrate electrode  
Terminal  
electrode  
Intermediate electrode  
External electrode  
■Dimensions in mm (not to scale)  
(Unit:mm)  
L1 , L2  
Size  
Size  
L
W
T
Code  
Z
0201  
0.60±0.03 0.30±0.03 0.30±0.03 0.15±0.05  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 1 -  
Multilayer Varistors  
Multilayer Varistor, Low Voltage Type (Standard Type）  
[DC voltage lines/Low speed signal lines]  
■Features  
Multilayer monolithic ceramic construction  
■Recommended Applications  
- 1 -  
for use protecting DC voltage lines or signal lines  
・Circuit voltage  
Mobile phone SW, LCD, LED, Audio terminal,  
Battery pack, Memory card, External IF  
16  
6.7  
3.7  
DSC, DVC  
PC, PDA  
TV, DVD  
Audio  
SW, LCD, LED, USB  
SW, LCD, LED, USB  
Audio, Video terminal  
Audio terminal, Microphone, Receiver  
Game console Controller, External IF  
3
5
12  
Circuit voltage  
DC [V]  
・Varistor voltage : 6.8 to 27V [at 1mA]  
・
Capacitance : 15 to 150pFtyp. [at 1MHz]  
■Ratings and Characteristics  
Maximum  
allowable  
voltage  
Nominal  
Maximum  
Capacitance (pF)  
Maximum ESD  
varistor  
voltage  
peak current  
at 8/20µs, 2times  
(A)  
ize  
Part No.  
at IEC61000-4-2  
at 1MHz  
220max  
at 1kHz  
175typ.  
at DC (V)  
at 1mA (V)  
EZJPZV6R8JA  
3.7  
6.8  
5
EZJPZV6R8GA  
EZJPZV120GA  
EZJPZV120DA  
EZJPZV270RA  
3.7  
6.7  
6.7  
16  
6.8  
12  
12  
27  
100max  
100max  
27max  
100typ.  
100typ.  
33typ.  
5
5
1
1
0201  
Contact discharge  
8kV  
20max.  
16.5typ.  
●Operating Temperature Range : -40 to 85°C  
＊Recommend soldering method : Reflow soldering  
Maximum Allowable Voltage Maximum DC Voltage that can be applied continuously within the operating temperature range  
Varistor Voltage  
Varistor starting voltage between terminals at DC 1mA, also known as Breakdown voltage  
Varistor’s maximum current under the standard pulse 8/20µs, 2 times based on IEC60  
Maximum Peak Current  
Varistor’s maximum voltage under ESD based on IEC61000-4-2, 10 times  
(5 times of each positive-negative polarity)  
Maximum ESD  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 2 -  
Multilayer Varistors  
■Voltage vs. Current  
Max. Leakage Current  
Max. Clamping Voltage  
100  
EZJPZV270RA  
EZJPZV120□A  
EZJPZV6R8□A  
10  
EZJPZV270RA  
EZJPZV120□A  
EZJPZV6R8□A  
1
1E-06 0.00001 0.0001 0.001  
10-6  
10-5  
10-4  
10-3  
10-2  
0.01  
10-1  
100  
0.1  
101  
102  
10  
1
Current (A)  
■Frequency vs. Capacitance  
■Frequency vs. Attenuation  
10  
0
1000  
100  
10  
220pFmax.  
20pFmax.  
27pFmax.  
100pFmax.  
-10  
-20  
-30  
-40  
-50  
-60  
27pFmax.  
20pFmax.  
220pFmax.  
100pFmax.  
1
0.1  
1
10  
100  
1000  
10000  
0.1  
1
10  
100  
1000  
10000  
Frequency [MHz]  
Frequency [MHz]  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 3 -  
Multilayer Varistors  
■Varistor Characteristics and Equivalent Circuit  
A Multilayer Varistor does not have an electrical polarity like zener diodes and is equivalent to total 3 pcs. of 2 zener  
diodes and 1 capacitor.  
［Equivalent Circuit］  
Current (A)  
Zener diode  
Zener diode  
Capacitor 1 pc.  
monopolar 2pcs.  
Voltage (V)  
Multilayer Varistor  
■ESD Suppressive Effects  
Typical effects of ESD suppression  
Test conditions: IEC61000-4-2* Level 4 Contact discharge, 8kV  
［ESD suppressed waveform］  
1200  
1000  
800  
600  
400  
200  
0
Without Varistor  
Electrostatic discharger  
Attenuator : 60ｄB  
EZJPZV6R8GA  
[V1mA : 6.8V,C1MHz:100pFmax.]  
Oscillo-sc  
ope  
330Ω  
50Ω  
150pF  
-200  
-20  
0
20  
40  
60  
80 100 120 140 160 180 200  
MLCV  
Time (ns)  
* IEC61000-4-2 … International Standard of the ESD testing method (HBM) setting 4 levels of severity  
Severity  
Level 1  
2kV  
Level 2  
4kV  
Level 3  
6kV  
Level 4  
8kV  
Contact discharge  
Air discharge  
2kV  
4kV  
8kV  
15kV  
■Replacement of Zener diode  
Using a Multilayer Varistor to replace a “Zener diode & Capacitor” saves both the amount of space and number of  
components used.  
1.7  
0.3  
0.3  
2.6  
Mounting area  
Approx.93%space saving  
0.9  
Zener diode  
S-79  
MLCC  
Size 0402  
MLCV  
Size 0201  
Dimensions in mm  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 4 -  
Multilayer Varistors  
■Recommended Applications  
Applications  
Series  
Circuit  
DC 1k 1M 1G (Hz)  
DC to GHｚ  
Mobile phones, DSC, PC, PDA,  
HDD TV (PDP, LC etc.), DVD,  
DVC, Game consoles, Audio  
equipment  
Series  
EZJZ,P  
Ultra low capacitance  
(Cap.:3pF or less)  
Antenna, RF circuit, LVDS  
USB, IEEE1394, HDMIetc.  
DC to millions of Hz  
Low capacitance  
(Cap.:20 to 680pF)  
PWR, SW, Audio terminals  
LCD, RS232C, etc.  
PWR, Photoelectronic sensors,  
SSR, Motors, Pressure sensors,  
Proximity switches  
Series  
EZJS  
High capacitance  
(Cap.:1800 to 22000pF)  
DC to thousands of Hz  
PWR, SW, Audio terminals etc.  
■Applications  
●Mobile Phone  
- Audio lines  
- LCD/Camera lines  
LCD/  
Camera  
LCD/  
Camera  
F
P
AMP  
2mode noise filter  
C
controller  
- LED  
IC  
- I/O data lines  
I/O  
- SW/ Keyboard  
controller  
Connector  
IC  
●USB1.1/2.0 lines  
●IEEE1394 lines  
Power  
IC  
VDD  
.
USB  
IEEE1394  
controller  
VDD  
GND  
.
D＋  
controller  
D-  
.
GND  
.
TPA+  
TPA-  
.
TPB+  
TPB-  
.
.
●HDMI lines  
TMDS  
Ch:0  
Ch:1  
Ch:2  
HDMI  
IC  
Connector  
1 1 1 1 1 1  
1 1  
Clock  
2
2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 5 -  
Multilayer Varistors  
■Performance and Testing Methods  
Characteristics  
Specifications  
Testing Method  
Electrical characteristics shall be measured under the following  
Standard test  
conditions  
conditions.  
Temp. : 5 to 35°C, Relative humidity : 85% or less  
The voltage between both end terminals of a varistor when the  
specified measuring current (CmA) is applied to the Varistor (Vc, or  
To meet  
Varistor voltage  
the specified value  
VcmA.) The measurement shall be made as quickly as possible to  
avoid heating effects.  
Maximum allowable  
voltage  
To meet  
The maximum DC voltage that can be applied continuously to a  
the specified value varistor  
To meet  
the specified ｖalue  
Capacitance shall be measured at the specified frequency, bias  
Capacitance  
voltage 0V, measuring voltage 0.2 to 2 Vrms.  
The maximum current measured (while the varistor voltage is within  
±10% of its nominal value) when a standard impulse current of  
8/20μseconds is applied twice within an interval of 5 minutes.  
The maximum ESD measured (while the varistor voltage is within  
±30% of its nominal value) when exposed to ESD 10 times (five  
times for each positive-negative polarity) based on IEC61000-4-2.  
The part shall be immersed into a soldering bath under the  
conditions below.  
To meet  
Maximum peak current  
the specified value  
To meet  
Maximum ESD  
the specified value  
Solder: H63A  
Soldering flux: Ethanol solution of rosin (Concentration approx.25wt%）  
Soldering temp.: 230±5°C  
Solderability  
To meet  
the specified value  
Period: 4±1 sec.  
Soldering position: So that both terminal electrodes are completely  
immersed in the soldering bath  
The part shall be immersed into a soldering bath under the  
conditions below (before being subjected to standard conditions) for  
24±2 hours to evaluate its characteristics.  
Soldering conditions:270°C, 3s / 260°C, 10s  
Soldering position: So that both terminal electrodes are completely  
immersed in the soldering bath  
Resistance to  
soldering heat  
ΔVc / Vc  
: within ±10%  
Repeat the following cycle on the part for the specified number of  
times (before being subjected to standard conditions) for 24±2  
hours to evaluate its characteristics.  
Cycle : 5 cycles  
ΔVc / Vc  
: within ±10%  
Step  
Temperature  
Max. Operating Temp.  
Ordinary temp.  
Min. Operating Temp.  
Ordinary temp.  
Period  
30 min.  
3 min.  
30 min.  
3 min.  
Temperature cycle  
1
2
3
4
The part shall be tested under the conditions below (before being  
subjected to standard conditions) for 24±2 hours to evaluate its  
characteristics.  
ΔVc / Vc  
Damp heat load  
Temp.: 40±2°C  
: within ±10%  
Humidity: 90~95%RH  
Applied voltage: Maximum allowable voltage (Individually specified)  
Period: 500＋24 / 0 h  
The part shall be tested under the conditions below (before being  
subjected to standard conditions) for 24±2 hours to evaluate its  
characteristics.  
ΔVc / Vc  
: within ±10%  
High temperature load  
Temp.: Maximum operating temperature ±3°C (Individually specified)  
Applied voltage: Maximum allowable voltage (Individually specified)  
Period : 500＋24 / 0h  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 6 -  
Multilayer Varistors  
■Packaging Specifications  
●Standard Packing Quantities  
Thickness  
Paper Taping  
Q’ty （pcs./reel）  
Series  
Size Code  
（mm）  
Pitch (mm)  
2
EZJP  
Z (0201)  
0.3  
15,000  
●Paper Taping  
● Reel for Taping  
● Leader Part and Taped End  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 7 -  
Multilayer Varistors  
Multilayer Varistors ,Chip Type  
Series : EZJZ ,EZJP(For DC voltage lines, high speed signal lines)  
Series : EZJS (For DC voltage lines)  
Handling Precautions  
！
Safety Precautions  
Multilayer Varistors (hereafter refereed to as “Varistors”) should be used for general purpose applications as  
countermeasures against ESD and noise found in consumer electronics (audio/visual, home, office, information &  
communication) equipment. When subjected to severe electrical, environmental, and/or mechanical stress beyond the  
specifications, as noted in the Ratings and Specified Conditions section, the Varistors may fail in a short circuit mode  
or in an open-circuit mode. This case results in a burn-out, smoke or flaming.  
For products which require high safety levels, please carefully consider how a single malfunction can affect your  
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe, such as  
setting up protecting circuits, etc.  
● For the following applications and conditions, please contact us for additional specifications not found in this  
document.  
・When your application may have difficulty complying with the safety or handling precautions specified below.  
・For any applications where a malfunction with this product may directly or indirectly cause hazardous conditions  
which could result in death or injury;  
Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)  
Submarine Equipment (submarine repeating equipment, etc.)  
Transport Equipment (motor vehicles, airplanes, trains, ship, traffic signal controllers, etc.)  
Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system,  
etc.)  
Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)  
Information Processing Equipment (large scale computer system, etc.)  
Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)  
Rotary Motion Equipment  
Security Systems  
And any similar types of equipment  
！
Strict Observance  
1. Confirmation of Rated Performance  
The Varistors shall be operated within the specified rating/performance.  
Application exceeding the specifications may cause deteriorated performance and/or breakdown, resulting in  
degradation and/or smoking or ignition of products. The following are strictly observed.  
(1) The Varistors shall not be operated beyond the specified operating temperature range.  
(2) The Varistors shall not be operated in excess of the specified maximum allowable voltage.  
(3) The Varistors shall not be operated in the circuits to which surge current and ESD are applied exceeding the  
specified maximum peak current and maximum ESD.  
(4) Never use for AC power supply circuits.  
2. The Varistors shall not be mounted near inflammables.  
Temperature Range”.  
■Operating Conditions and Circuit Design  
1. Circuit Design  
The Varistors mounted on PCB shall be stored  
without operating within the specified “Storage  
Temperature Range” in the Specifications.  
1.1 Operating Temperature and Storage Temperature  
The specified “Operating Temperature Range” found  
in the Specification is the absolute maximum and  
minimum temperature rating. Every Varistor shall be  
operated  
within  
the  
specified  
“Operating  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 8 -  
Multilayer Varistors  
1.2 Operating Voltage  
c
The Varistors shall not be operated in excess of the  
“Maximum allowable voltage”. If the Varistors are  
operated beyond the specified Maximum allowable  
voltage, it may cause short and/or damage due to  
thermal run away. When high frequency and steep  
pulse voltages are continuously used, even when  
less than the Maximum allowable voltage, in a  
circuit, please examine the reliability of the Varistor  
while also checking the safety and reliability of your  
circuit. Check safety and reliability in your circuit.  
1.3 Self-heating  
SMD  
Land  
b
a
P
Component  
dimensions  
Size Code  
a
b
C
P
L
W
T
0.3～ 0.45～ 0.3～ 0.54～  
S
1.37 1.0 0.6  
(0504 2Array)  
0.4  
0.55  
0.4  
0.74  
The surface temperature of the Varistors shall be  
under the specified Maximum Operating  
Temperature in the Specifications including the  
temperature rise cause by self-heating. Check  
temperature rise of the Varistor in your circuit.  
1.4 Environmental Restrictions  
(2) The size of lands shall be designed to have equal  
spacing between the right and left sides. If the  
amount of solder on the right land is different from  
that on the left land, the component may be  
cracked by stress since the side with a larger  
amount of solder solidifies later during cooling.  
The Varistors shall not be operated and/or stored  
under the following conditions.  
Recommended Amount of Solder  
(1) Environmental conditions  
(b) Proper amount  
(a) Excessive amount  
(c) Insufficient amount  
(a) Under direct exposure to water or salt water  
(b) Under conditions where water can condense  
and/or dew can form  
(c) Under conditions containing corrosive gases  
such as hydrogen sulfide, sulfurous acid,  
chlorine and ammonia  
2.3 Utilization of Solder Resist  
(1) Solder resist shall be utilized to equalize the  
amounts of solder on both sides.  
(2) Solder resist shall be used to divide the pattern for  
the following cases;  
(2) Mechanical conditions  
Under severe conditions of vibration or impact  
beyond the specified conditions found in the  
Specifications.  
･Components are arranged closely.  
･The Varistor is mounted near a component with  
lead wires.  
2. Design of Printed Circuit Board  
2.1 Selection of Printed Circuit Boards  
･The Varistor is placed near a chassis.  
See the table below.  
When the Varistors are mounted and soldered on an  
“Alumina Substrate”, the substrate influences the  
Varistors’ reliability against “Temperature Cycles”  
and “Heat shock” due to the difference in the  
thermal expansion coefficient between them.  
Confirm that the actual board used does not  
deteriorate the characteristics of the Varistors.  
2.2 Design of Land Pattern  
Prohibited Applications and Recommended Applications  
Prohibited  
Improved applications  
by pattern division  
Item  
applications  
The lead wire of a  
component with lead wires  
Solder resist  
Mixed mounting  
with a component  
with lead wires  
(1) Recommended land dimensions are shown  
below. Use the proper amount of solder in order to  
prevent cracking. Using too much solder places  
excessive stress on the Varistors.  
Chassis  
Solder  
Solder resist  
Arrangement  
near chassis  
(
Ground solder)  
Recommended Land Dimensions  
SMD  
Land  
Electrode pattern  
A lead wire of  
c
Retro-fitted  
Solder resist  
Solder resist  
Retro-fitting of  
component with  
lead wires  
Soldering  
iron  
component  
b
a
Solder resist  
Component dimensions  
Portion to be expressively  
soldered  
Size Code  
a
b
c
L
W
T
0.3  
Lateral  
arrangement  
0.6 0.3  
1.0 0.5  
1.6 0.8  
0.2 to 0.3 0.2 to 0.3 0.2 to 0.3  
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5  
0.8 to 1.0 0.6 to 0.8 0.6 to 0.8  
Land  
Z(0201)  
0(0402)  
1(0603)  
2(0805)  
0.5  
0.8  
2.4 Component Layout  
2.0 1.25 0.8 to 1.25 0.8 to 1.2 0.8 to 1.0 0.8 to 1.0  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 9 -  
Multilayer Varistors  
The Varistors/components shall be placed on the PC  
board such that both electrodes are subjected to uniform  
stresses, or to position the component electrodes at right  
angles to the grid glove or bending line. This should be  
done to avoid cracking the Varistors from bending the  
PC board after or during placing/mounting on the PC  
board.  
2. Adhesives for Mounting  
(1) The amount and viscosity of an adhesive for  
mounting shall be such that the adhesive shall  
not flow off on the land during its curing.  
(2) If the amount of adhesive is insufficient for  
mounting, the Varistors may fall off after or during  
soldering.  
(1) To minimize mechanical stress caused by the  
warp or bending of a PC board, please follow the  
recommended Varistors’ layout below.  
(3) If the adhesive is too low in its viscosity, the  
Varistors may be out of alignment after or during  
soldering.  
Prohibited  
Recommendded layout  
(4) Adhesives for mounting can be cured by  
ultraviolet or infrared radiation. In order to prevent  
the terminal electrodes of the Varistors from  
oxidizing, the curing shall be done under the  
following conditions:  
Layout the Varistor sideways  
against the stressing direction.  
160°C max., for 2 minutes max.  
(5) Insufficient curing may cause the Varistors to fall  
off after or during soldering. In addition, insulation  
resistance between terminal electrodes may  
deteriorate due to moisture absorption. In order to  
prevent these problems, please observe proper  
curing conditions.  
(2) The following layout is for your reference since  
mechanical stress near the dividing/breaking  
position of a PC board varies depending on the  
mounting position of the Varistors.  
3. Chip Mounting Consideration  
(1) When mounting the Varistors/components on a PC  
board, the Varistor bodies shall be free from  
excessive impact loads such as mechanical impact  
or stress due to the positioning, pushing force and  
displacement of vacuum nozzles during mounting.  
(2) Maintenance and inspection of the Chip Mounter  
must be performed regularly.  
E
D
Perforation  
C
A
B
Slit  
Magnitude of stress A>B=C>D>E  
(3) If the bottom dead center of the vacuum nozzle is  
too low, the Varistor will crack from excessive force  
during mounting.  
(3) The magnitude of mechanical stress applied to the  
Varistors when the circuit board is divided is in the  
order of push back < slit < V-groove < perforation.  
Also take into account the layout of the Varistors  
and the dividing/breaking method.  
The following precautions and recommendations  
are for your reference in use.  
(a) Set and adjust the bottom dead center of the  
vacuum nozzles to the upper surface of the PC  
board after correcting the warp of the PC board.  
(b) Set the pushing force of the vacuum nozzle  
during mounting to 1 to 3 N in static load.  
(c) For double surface mounting, apply a supporting  
pin on the rear surface of the PC board to  
suppress the bending of the PC board in order to  
minimize the impact of the vacuum nozzles.  
Typical examples are shown in the table below.  
2.5 Mounting Density and Spaces  
If components are arranged in too narrow a space,  
the components can be affected by solder bridges  
and solder balls. The space between components  
should be carefully determined.  
■ Precautions for Assembly  
1. Storage  
(1) The Varistors shall be stored between 5 – 40°C  
and 20 - 70%RH, not under severe conditions of  
high temperature and humidity.  
Item  
Prohibited mounting  
Recommended mounting  
The supporting pin does not  
necessarily  
have  
to  
be  
(2) If stored in a place that is humid, dusty, or contains  
corrosive gasses (hydrogen sulfide, sulfurous acid,  
hydrogen chloride and ammonia etc.), the solderability  
of terminal electrodes may deteriorate.  
positioned beneath the Varistor.  
Crack  
Single surface  
mouting  
Supporting  
pin  
In addition, storage in a place subjected to heating  
and/or exposure to direct sunlight will causes  
deformed tapes and reels, and component sticking  
to tapes, both of which can result in mounting  
problems.  
Double surface  
mounting  
Supporting  
i
Separation  
of Solder  
Crack  
(3) Do not store components longer than 6 months.  
Check the solderability of products that have been  
stored for more than 6 months before use.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 10 -  
Multilayer Varistors  
Recommended profile for Flow soldering [Ex.]  
(d) Adjust the vacuum nozzles so that their bottom  
dead center during mounting is not too low.  
(4) The closing dimensions of the positioning chucks  
shall be controlled. Maintenance and replacement  
of positioning chucks shall be performed regularly  
to prevent chipping or cracking of the Varistors  
caused by mechanical impact during positioning  
due to worn positioning chucks.  
Soldering  
260  
240  
Gradual cooling  
(at ordinary temperature)  
(5) Maximum stroke of the nozzle shall be adjusted so  
that the maximum bending of PC board does not  
exceed 0.5mm at 90 mm span. The PC board shall  
be supported by an adequate number of supporting  
pins.  
Time  
3 to 5  
sec  
60 to 120sec  
<Allowable temperature difference>  
Size  
Temp. Tol.  
0603  
∆T 150°C  
4. Selection of Soldering Flux  
For  
products  
specified  
in  
individual  
Soldering flux may seriously affect the performance of  
the Varistors. The following shall be confirmed before  
use.  
specifications, avoid flow soldering.  
5.2 Reflow Soldering  
(1) The soldering flux should have a halogen based  
content of 0.1 wt% (converted to chlorine) or below.  
Do not use soldering flux with strong acid.  
(2) When applying water-soluble soldering flux, wash  
the Varistors sufficiently because the soldering flux  
residue on the surface of PC boards may  
deteriorate the insulation resistance on the  
Varistors’ surface.  
The reflow soldering temperature conditions are each  
temperature curves of Preheating, Temp. rise, Heating,  
Peak and Gradual cooling.  
Large temperature difference caused by rapid heat  
application to the Varistors may lead to excessive  
thermal stresses, contributing to the thermal cracks.  
The Preheating temperature requires controlling with  
great care so that tombstone phenomenon may be  
prevented.  
5. Soldering  
Item  
Preheating  
Temperature  
140 to 180°C  
Preheating temp  
to Peak temp.  
220°C min.  
260°C max.  
Peak temp.  
to 140°C  
Period or Speed  
60 to 120 sec  
5.1 Flow Soldering  
For flow soldering, abnormal and large thermal and  
mechanical stress, caused by the ” Temperature  
Gradient” between the mounted Varistors and melted  
solder in a soldering bath may be applied directly to  
the Varistors, resulting in failure and damage of the  
Varistors. Therefore it is essential that soldering  
process follow these recommended conditions.  
(1) Application of Soldering flux:  
Temp. rise  
2 to 5°C /sec  
Heating  
Peak  
60 sec max.  
10 sec max.  
Gradual cooling  
1 to 4°C /sec  
The soldering flux shall be applied to the mounted Varistors  
thinly and uniformly by foaming method.  
Recommended profile of Reflow soldering (EX)  
(2) Preheating:  
④Peak  
②Temp.rise  
The mounted Varistors/Components shall be pre-heated  
sufficiently so that the “Temperature Gradient” between the  
Varistors/Components and the melted solder shall be  
150 °C max. (100 to 130°C)  
260  
220  
180  
⑤Gradual  
cooling  
(3) Immersion into Soldering bath:  
The Varistors shall be immersed into a soldering bath of  
240 to 260 °C for 3 to 5 seconds.  
140  
(4) Gradual Cooling:  
①Preheating  
③Heating  
The Varistors shall be cooled gradually to room ambient  
temperature with the cooling temperature rates of 8 °C /s  
max. from 250°C to 170 °C and 4 °C/s max. from 170 °C to  
130°C.  
Time  
60 to 120 sec  
60 sec max.  
(5) Flux Cleaning:  
∆T : Allowable temperature difference ∆T 150°C  
When the Varistors are immersed into a cleaning solvent,  
be sure that the surface temperatures of devices do not  
exceed 100 °C.  
The rapid cooling (forced cooling) during Gradual  
cooling part should be avoided, because this may  
cause defects such as the thermal cracks, etc.  
When the Varistors are immersed into a cleaning  
solvent, make sure that the surface temperatures of the  
devices do not exceed 100 .  
(6) Performing flow soldering once under the conditions shown  
in the figure below [Recommended profile of Flow soldering  
(Ex)] will not cause any problems. However, pay attention  
to the possible warp and bending of the PC board.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 11 -  
Multilayer Varistors  
Performing reflow soldering twice under the conditions  
shown in the figure above [Recommended profile of  
Reflow soldering (EX)] will not cause any problems.  
However, pay attention to the possible warp and  
bending of the PC board.  
Conditions of Hand soldering without preheating  
Condition  
Temperature of Iron tip  
Wattage  
270 °C max.  
20 W max.  
Shape of Iron tip  
φ3 mm max.  
Soldering time  
3 sec max.  
with a soldering iron  
5.3 Hand Soldering  
Hand soldering typically causes significant temperature  
change, which may induce excessive thermal stresses  
inside the Varistors, resulting in the thermal cracks, etc.  
In order to prevent any defects, the following should be  
observed;  
6. Post Soldering Cleaning  
6.1 Cleaning solvent  
Soldering flux residue may remain on the PC board  
if cleaned with an inappropriate solvent. This may  
deteriorate the electrical characteristics and  
reliability of the Varistors.  
･The temperature of the soldering tips should be  
controlled with special care.  
･The direct contact of soldering tips with the Varistors  
and/or terminal electrodes should be avoided.  
･Dismounted Varistors shall not be reused.  
(1) Condition 1 (with preheating)  
6.2 Cleaning conditions  
Inappropriate cleaning conditions such as  
insufficient cleaning or excessive cleaning may  
impair the electrical characteristics and reliability of  
the Varistors.  
(a) Soldering:  
Φ1.0mm Thread eutectic solder with soldering  
flux* in the core.  
(1) Insufficient cleaning can lead to:  
(a) The halogen substance found in the residue of  
the soldering flux may cause the metal of  
terminal electrodes to corrode.  
*Rosin-based and non-activated flux is Recommended.  
(b) Preheating:  
The Varistors shall be preheated so that the  
“Temperature Gradient” between the devices  
and the tip of soldering iron is 150°C or below.  
(c) Temperature of Iron tip: 300°C max.  
(The required amount of solder shall be melted  
in advance on the soldering tip.)  
(b) The halogen substance found in the residue of  
the soldering flux on the surface of the Varistors  
may change resistance values.  
(c) Water-soluble soldering flux may have more  
remarkable tendencies of (a) and (b) above  
compared to those of rosin soldering flux.  
(2) Excessive cleaning can lead to:  
(d) Gradual cooling:  
After soldering, the Varistors shall be cooled  
gradually at room temperature.  
(a) Overuse of ultrasonic cleaning may deteriorate  
the strength of the terminal electrodes or cause  
cracking in the solder and/or ceramic bodies of  
the Varistors due to vibration of the PC boards.  
Please follow these conditions for Ultrasonic  
cleaning:  
Recommended profile of Hand soldering (EX)  
Gradual cooling  
Ultrasonic wave output: 20 W/L max.  
Ultrasonic wave frequency: 40 kHz max.  
Ultrasonic wave cleaning time: 5 min. max.  
Preheating  
6.3 Contamination of Cleaning solvent  
Cleaning with contaminated cleaning solvent may  
cause the same results as insufficient cleaning  
due to the high density of liberated halogen.  
60 to 120 sec  
3 sec max.  
∆T : Allowable temperature difference ∆T 150°C  
7. Inspection Process  
(2) Condition 2 (without preheating)  
When mounted PC boards are inspected with  
measuring terminal pins, abnormal and excess  
mechanical stress shall not be applied to the PC broad  
or mounted components, to prevent failure or damage  
to the devices.  
Hand soldering can be performed without preheating,  
by following the conditions below:  
(a) Soldering iron tip shall never directly touch the  
ceramic and terminal electrodes of the Varistors.  
(b) The lands are sufficiently preheated with a  
soldering iron tip before sliding the soldering iron tip  
to the terminal electrodes of the Varistors for  
soldering.  
(1) Mounted PC boards shall be supported by an  
adequate number of supporting pins with bend  
settings of 90 mm span 0.5 mm max.  
(2) Confirm that the measuring pins have the right tip  
shape, are equal in height and are set in the  
correct positions.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 12 -  
Multilayer Varistors  
Prohibited dividing  
Recommended dividing  
The following figures are for your reference to  
avoid bending the PC board.  
Loading direction  
V-groove  
Loading direction  
Loading  
point  
PC  
Chip component  
PC  
board  
board  
Prohibited setting  
Check pin  
Recommended setting  
Check pin  
Chip  
component  
Loading  
point  
V-groove  
Bending of  
PC board  
9. Mechanical Impact  
Supporting pin  
Separated, Crack  
(1) The Varistors shall be free from any excessive  
mechanical impact. The Varistor body is made of  
ceramics and may be damaged or cracked if  
dropped.  
8. Protective Coating  
When the surface of a PC board on which the Varistors  
have been mounted is coated with resin to protect  
against moisture and dust, it shall be confirmed that the  
protective coating which is corrosive or chemically active  
is not used, in order that the reliability of the Varistors in  
the actual equipment may not be influenced. Coating  
materials that expand or shrink also may lead to damage  
to the Varistor during the curing process.  
Never use a Varistor which has been dropped; their  
quality may be impaired and failure rate increased.  
(2) When handling PC boards with Varistors mounted  
on them, do not allow the Varistors to collide with  
another PC board.  
When mounted PC boards are handled or stored in  
a stacked state, impact between the corner of a PC  
board and the Varistor may cause damage or  
cracking and can deteriorate the withstand voltage  
and insulation resistance of the Varistor.  
9. Dividing/Breaking of PC Boards  
(1) Abnormal and excessive mechanical stress such as  
bending or torsion shown below can cause cracking  
in the Varistors.  
Torsion  
Bending  
(2) Dividing/Breaking of the PC boards shall be done  
carefully at moderate speed by using a jig or  
apparatus to prevent the Varistors on the boards  
from mechanical damage.  
■Other  
(3) Examples of PCB dividing/breaking jigs:  
The outline of PC board breaking jig is shown  
below.  
The various precautions described above are typical.  
For special mounting conditions, please contact us.  
When PC board are broken or divided, loading  
points should be close to the jig to minimize the  
extent of the bending.  
Also, planes with no parts mounted on should be  
used as plane of loading, which generates a  
compressive stress on the mounted plane, in order  
to prevent tensile stress induced by the bending,  
which may cause cracks of the Varistors or other  
parts mounted on the PC boards.  
Outline of Jig  
V-groove  
PC board  
PC board  
splitting jig  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
- 13 -  
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