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TXS0302

型号:

TXS0302

描述:

具有自动方向感应2位双向电压电平转换器[ 2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTOMATIC DIRECTION SENSING ]

品牌:

TI[ TEXAS INSTRUMENTS ]

页数:

7 页

PDF大小:

277 K

TXS0302  
www.ti.com  
SCES835 NOVEMBER 2011  
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTOMATIC DIRECTION  
SENSING  
Check for Samples: TXS0302  
1
FEATURES  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114)  
500-V Machine Model (C101)  
Fully Symmetric Supply Voltages. 0.9-V to  
3.6-V on A Port and B Port  
Max Open Drain Data Rate: 8Mbps  
DQE OR DQM PACKAGE  
(TOP VIEW)  
Internal Pull-up Resistors: 4.7-k  
VCC Isolation Feature If Either VCC Input Is at  
GND, All Outputs Are in the High-Impedance  
State  
8
VCCA  
A1  
1
2
3
4
VCCB  
B1  
7
6
5
OE Input Circuit Referenced to VCCA  
A2  
B2  
Low Power Consumption, 4-µA Max ICCA + ICCB  
GND  
OE  
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
DESCRIPTION/ORDERING INFORMATION  
This 2-bit non-inverting translator uses two separate configurable power-supply rails. The A port is designed to  
track VCCA. VCCA accepts any supply voltage from 0.9 V to 3.6 V. The B port is designed to track VCCB. VCCB  
accepts any supply voltage from 0.9 V to 3.6 V. This allows for low-voltage bidirectional translation between 1-V,  
1.2-V, 1.5-V, 1.8-V, 2.5-V and 3.3-V voltage nodes. For the TXS0302, when the output-enable (OE) input is low,  
all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or  
power down, OE should be tied to GND through a pull-down resistor; the minimum value of the resistor is  
determined by the current-sourcing capability of the driver. The TXS0302 is designed so that the OE input circuit  
is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry  
disables the outputs, preventing damaging current backflow through the device when it is powered down. For  
typical application circuitry, refer to Figure 1.  
Functional Table  
Inputs  
Output  
Bn/An  
L
OE  
H
VCCA/VCCB  
An/Bn  
H
H
L
L
H
X
X
H
H
H
3-State  
3-State  
L
X
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCT PREVIEW information concerns products in the  
formative or design phase of development. Characteristic data and  
other specifications are design goals. Texas Instruments reserves  
the right to change or discontinue these products without notice.  
Copyright © 2011, Texas Instruments Incorporated  
TXS0302  
SCES835 NOVEMBER 2011  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(3)  
PREVIEW  
DQE MicroQFN  
DQM MicroQFN  
YFP - NanoStarTM WCSP  
(DSBGA) )  
YZP - NanoStarTM WCSP  
Reel of 5000  
TXS0302DQER  
Reel of 3000  
Reel of 3000  
TXS0302DQMR  
PREVIEW  
40°C to 85°C  
TXS0302YFPR  
TXS0302YZPR  
PREVIEW  
PREVIEW  
Reel of 3000  
(DSBGA  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(3) YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
TERMINAL FUNCTIONS  
PIN NO.  
NAME  
TXS0302  
VCCA  
A1  
DESCRIPTION  
YFP/YZP DQE/DQM  
A1  
B1  
C1  
D1  
D2  
C2  
B2  
A2  
1
2
3
4
5
6
7
8
A-port supply voltage 0.9 V VCCA 3.6 V  
Input/output 1. Referenced to VCCA  
Input/output 2. Referenced to VCCA  
Ground  
.
.
A2  
GND  
OE  
3-state output-mode enable; Pull OE low to place all outputs in 3-state mode.  
B2  
Input/output 2. Referenced to VCCB  
Input/output 1. Referenced to VCCB  
.
.
B1  
VCCB  
B-port supply voltage 0.9 V VCCB 3.6 V.  
TYPICAL OPERATING CIRCUIT  
1.8 V  
3.3 V  
0.1 μF  
0.1 μF  
1 μF  
VCCB  
VCCA  
OE  
1.8 V  
System  
Controller  
3.3 V  
System  
A1  
A2  
B1  
B2  
Data  
Data  
Figure 1.  
2
Submit Documentation Feedback  
Copyright © 2011, Texas Instruments Incorporated  
Product Folder Link(s): TXS0302  
PACKAGE OPTION ADDENDUM  
www.ti.com  
31-Mar-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TXS0302DQER  
TXS0302DQMR  
PREVIEW  
PREVIEW  
X2SON  
X2SON  
DQE  
DQM  
8
8
5000  
3000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
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Applications  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
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Copyright © 2012, Texas Instruments Incorporated  
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