Table R5 Physical Characteristics and Environmental Specifications for Radial-leaded Devices  
					BBRF  
					Physical Characteristics  
					Lead material  
					Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)  
					Solderability per ANSI/J-STD-002 Category 3  
					per IEC-STD 68-2-20, Test Tb, Method 1A, Condition B, can withstand 10 seconds at 260°C 5°C  
					Cured, flame-retardant epoxy polymer; meets UL 94V-0  
					-40°C~85°C  
					Soldering characteristics  
					Solder heat withstand  
					Insulating material  
					Operation temperature  
					Note: Devices are not designed to be placed through a reflow process.  
					Environmental Specifications  
					Test  
					Conditions  
					Resistance Change  
					Passive aging  
					70°C, 1000 hours  
					85°C, 1000 hours  
					5%  
					5%  
					Humidity aging  
					Thermal shock  
					Solvent resistance  
					85°C, 85%RH, 1000 hours  
					85°C, -40°C (10 times)  
					MIL-STD-202, Method 215F  
					5%  
					5%  
					No change  
					RXEF  
					Physical Characteristics  
					Lead material  
					RXEF005  
					RXEF010  
					: Tin-plated nickel-copper alloy, 0.128mm2 (26AWG), ø0.40mm (0.016in.)  
					: Tin-plated nickel-copper alloy, 0.205mm2 (24AWG), ø0.51mm (0.020in.)  
					RXEF017 to 040 : Tin-plated copper-clad steel, 0.205mm2 (24AWG), ø0.51mm (0.020in.)  
					RXEF050 to 090 : Tin-plated copper, 0.205mm2 (24AWG), ø0.51mm (0.020in.)  
					RXEF110 to 375 : Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)  
					Solderability per ANSI/J-STD-002 Category 3  
					RXEF005, RXEF010 meet ANSI/J-STD-002 Category 1  
					RXEF017- RXEF025: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a;  
					can withstand 5 seconds at 260°C 5°C  
					Soldering characteristics  
					Solder heat withstand  
					All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b;  
					can withstand 10 seconds at 260°C 5°C  
					Insulating material  
					Operation temperature  
					Cured, flame-retardant epoxy polymer; meets UL 94V-0  
					-40°C~85°C  
					Note: Devices are not designed to be placed through a reflow process.  
					Environmental Specifications  
					Test  
					Conditions  
					Resistance Change  
					Passive aging  
					-40°C, 1000 hours  
					5%  
					85°C, 1000 hours  
					5%  
					Humidity aging  
					Thermal shock  
					Solvent resistance  
					85°C, 85%RH, 1000 hours  
					85°C, -40°C (10 times)  
					MIL-STD-202, Method 215F  
					10%  
					10%  
					No change  
					10  
					RKEF  
					Physical Characteristics  
					Lead material  
					RKEF050 to 090 : Tin-plated copper, 0.205mm2 (24AWG), ø0.51mm (0.020in.)  
					RKEF110 to 500 : Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)  
					Solderability per ANSI/J-STD-002 Category 3  
					RKEF050-RKEF185 : per IEC-STD 68-2-20, Test Tb, Method 1a, condition a;  
					can withstand 5 seconds at 260°C 5°C  
					Soldering characteristics  
					Solder heat withstand  
					All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b;  
					RKEF can withstand 10 seconds at 260°C 5°C  
					Insulating material  
					Operation temperature  
					Cured, flame-retardant epoxy polymer; meets UL 94V-0  
					-40°C~85°C  
					Note: Devices are not designed to be placed through a reflow process.  
					126  
					RoHS Compliant, ELV Compliant