TN25 and TYNx25 Series
Figure 3: Average and D.C. on-state current
versus ambient temperature (copper surface
under tab: S=1cm2) (D2PAK)
Figure 4: Relative variation of thermal
impedance versus pulse duration
I
(A)
T(AV)
K=[Z /R
]
th th
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.00
0.10
0.01
Z
th(j-c)
D.C.
α = 180°
Z
th(j-a)
t (s)
p
T
(°C)
amb
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
0
25
50
75
100
125
Figure 5: Relative variation of gate trigger
current, holding current and latching current
versus junction temperature
Figure 6: Surge peak on-state current versus
number of cycles
I
,I ,I [T ] / I ,I ,I [T =25°C]
GT
H
L
j
GT
H
L
j
I
(A)
TSM
2.5
2.0
1.5
1.0
0.5
0.0
350
300
250
200
150
100
50
tp=10ms
One cycle
Non repetitive
Tj initial=25°C
IGT
IH & IL
Repetitive
TC=100°C
Number of cycles
T (°C)
j
0
1
10
100
1000
-40
-20
0
20
40
60
80
100
120
140
Figure 7: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10 ms, and corresponding values of I²t
Figure 8: On-state characteristics (maximum
values)
(A), I2t (A2s)
I
(A)
TM
I
TSM
300
100
2000
1000
Tj max.:
Vt0=0.77V
Rd=14mΩ
Tj initial = 25°C
ITSM
Tj=max
I2t
Tj=25°C
10
dI/dt limitation
t (ms)
p
V
(V)
TM
1
100
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0.01
0.10
1.00
10.00
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