IN74LVU04
MAXIMUM RATINGS*
Symbol
Parameter
Value
-0.5 ÷ +7.0
±20
Unit
V
mA
mA
mA
VCC
DC supply voltage (Referenced to GND)
DC input diode current
IIK *1
2
IOK
*
DC output diode current
±50
IO *3
ICC
DC output source or sink current
-bus driver outputs
±25
DC
VCC
current
for
types
with
mA
mA
mW
±50
±50
- bus driver outputs
IGND
PD
DC GND current for types with
- bus driver outputs
Power dissipation per package, plastic
750
500
DIP+
SOIC
package+
Tstg
TL
Storage temperature
-65 ÷ +150
°C
°C
Lead temperature, 1.5 mm from Case for
10 seconds (Plastic DIP ), 0.3 mm (SOIC
Package)
260
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 12 mW/°C from 70° to 125°C
SOIC Package: : - 8 mW/°C from 70° to 125°C
*1: VI < -0.5V or VI > VCC+0.5V
*2: Vo < -0.5V or Vo > VCC+0.5V
*3: -0.5V < Vo < VCC+0.5V
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to
GND)
Min
1.0
Max
5.5
Unit
V
VIN, VOUT
TA
DC Input Voltage, Output Voltage
(Referenced to GND)
0
VCC
V
Operating Temperature, All Package
Types
-40
+125
°C
tr, tf
Input Rise and Fall
Time
0
0
0
0
500
200
100
50
ns
1.0 V≤VCC <2.0 V
2.0 V≤VCC <2.7 V
2.7 V≤VCC <3.6 V
3.6 V≤VCC ≤5.5 V
This device contains protection circuitry to guard against damage due to high static
voltages or electric fields. However, precautions must be taken to avoid applications of any voltage
higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and
V
OUT should be constrained to the range GND≤(VIN or VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or
VCC). Unused outputs must be left open.
2
